Preparation and use method of black hole liquid

A black hole and electrolyte technology, applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of contradictory coating adhesion and conductivity, affecting the performance of black hole liquid, and restricting the application of black hole liquid, etc. Achieve the effect of short electroplating completion time, easy operation and good bonding force
CN113207243AInactive Publication Date: 2021-08-03UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
Publication Date
2021-08-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a preparation method and a use method of black hole liquid for the printed circuit board industry. The black hole liquid comprises the following components: a conductive agent, graphene oxide, a dispersing agent and a binding agent. The method comprises the following steps: by taking a graphite plate as an anode, a titanium plate or a graphite plate as a cathode and ultrapure water or an ammonia water solution as an electrolyte, carrying out electrolysis for a certain time, adding a conductive agent and a binder, and adjusting the pH value to 9-10, so as to obtain the black hole liquid. When the black hole liquid prepared by the method is used for treating the surface of a non-metal base material of a printed circuit board or a hole wall subjected to pretreatment, a conductive film layer with good binding force and conductivity can be obtained.
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Description

technical field

[0001] The invention relates to the field of printed circuit board manufacturing, and more specifically relates to the preparation and application method of a black hole solution capable of directly electroplating printed circuit boards. Background technique

[0002] The connection between double-layer boards or multi-layer boards is realized through the metallization of the guide holes between the boards, referred to as hole metallization. There are two main technologies in the development of hole metallization: electroless copper plating technology and direct electroplating technology. Electroless plating is the earliest and most mature application of hole metallization technology, and has been widely used by major manufacturers until now. However, it contains carcinogenic formaldehyde and other substances, which is also accompanied by environmental pollution problems, and the stability of the electroless copper plating solution requires strict The use of ...

Claims

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