Preparation and use method of black hole liquid

A black hole and electrolyte technology, applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of contradictory coating adhesion and conductivity, affecting the performance of black hole liquid, and restricting the application of black hole liquid, etc. Achieve the effect of short electroplating completion time, easy operation and good bonding force

Inactive Publication Date: 2021-08-03
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the black hole solution (such as: CN106535505A, CN104562115A, US5015339, US5389270, and P4724005A) used in the direct plating process of printed circuit board hole metallization is a suspension with water as the dispersion medium and carbon black / graphite particles as the conductive matrix. However, the suspension is unstable and prone to coagulation, which seriously affects the performance of the black hole liquid
The existing black hole liquid is generally composed of graphite, carbon black or graphene aqueous solution. At present, after the hole is metallized, there is a problem that the coating bonding force and conductivity are contradictory, that is, improving the black hole conductivity will lead to It will cause weak bonding force of the plating layer, and improving the bonding force of the plating layer will cause the black hole to have weak conductivity and cause the plating time to be too long
The contradiction between the two limits the application of black hole liquid to a certain extent.

Method used

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  • Preparation and use method of black hole liquid
  • Preparation and use method of black hole liquid

Examples

Experimental program
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Effect test

Embodiment 1

[0028] A method for preparing black hole liquid, comprising the steps of: using a graphite plate with a thickness of 80 mm, a length of 700 mm, and a width of 700 mm as an anode, its ash content is 50 ppm, and its bulk density is 2.0 g / cm 3 , the particle size is 500 μm; a titanium plate with a thickness of 10 mm, a length of 700 mm, and a width of 700 mm is used as the cathode; the distance between the graphite plate and the titanium plate is 5 mm; the resistivity of the electrolyte is above 18 MΩ Ultra-pure water; the power supply is a rectified DC power supply. During electrolysis, the voltage is 6-60 V and the current density is 60 mA / cm 2 After 168 hours of electrolysis, stop the electrolysis, add a conductive agent with a mass percentage of 6.55% and a binder with a mass percentage of 1.64%, and adjust the pH to 9-10 to obtain the black hole solution A.

Embodiment 2

[0030] A method for preparing black hole liquid, comprising the steps of: using a graphite plate with a thickness of 80 mm, a length of 700 mm, and a width of 700 mm as an anode, its ash content is 45 ppm, and its bulk density is 1.5 g / cm 3 , the particle size is 450 μm; a titanium plate with a thickness of 10 mm, a length of 700 mm, and a width of 700 mm is used as the cathode; the distance between the graphite plate and the titanium plate is 5 mm; the electrolyte is 2.5 mol / L ammonia solution ; The power supply is pulsed power supply, and the current density is controlled at 250 A / cm during electrolysis 2 , the frequency is 10k Hz, after 24 hours of electrolysis, stop the electrolysis, add a conductive agent with a mass percentage of 6.25% and a binder with a mass percentage of 6.25%, adjust the pH to 9-10 to obtain the black hole solution B.

Embodiment 3

[0032] A method for preparing black hole liquid, comprising the steps of: using a graphite plate with a thickness of 80 mm, a length of 700 mm, and a width of 700 mm as an anode, its ash content is 40 ppm, and its bulk density is 2.0 g / cm 3 , the particle size is 380 μm; a titanium plate with a thickness of 10 mm, a length of 700 mm, and a width of 700 mm is used as the cathode; the distance between the graphite plate and the titanium plate is 10 mm; the electrolyte is a resistivity of more than 18 MΩ Ultrapure water; the power supply is a rectified DC power supply. During electrolysis, the voltage is 6-60 V and the current density is 10-300 mA / cm 2 After 96 hours of electrolysis, stop the electrolysis, add a conductive agent with a mass percentage of 5.88% and a binder with a mass percentage of 11.76%, and adjust the pH to 9-10 to obtain black hole liquid C.

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Abstract

The invention discloses a preparation method and a use method of black hole liquid for the printed circuit board industry. The black hole liquid comprises the following components: a conductive agent, graphene oxide, a dispersing agent and a binding agent. The method comprises the following steps: by taking a graphite plate as an anode, a titanium plate or a graphite plate as a cathode and ultrapure water or an ammonia water solution as an electrolyte, carrying out electrolysis for a certain time, adding a conductive agent and a binder, and adjusting the pH value to 9-10, so as to obtain the black hole liquid. When the black hole liquid prepared by the method is used for treating the surface of a non-metal base material of a printed circuit board or a hole wall subjected to pretreatment, a conductive film layer with good binding force and conductivity can be obtained.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically relates to the preparation and application method of a black hole solution capable of directly electroplating printed circuit boards. Background technique [0002] The connection between double-layer boards or multi-layer boards is realized through the metallization of the guide holes between the boards, referred to as hole metallization. There are two main technologies in the development of hole metallization: electroless copper plating technology and direct electroplating technology. Electroless plating is the earliest and most mature application of hole metallization technology, and has been widely used by major manufacturers until now. However, it contains carcinogenic formaldehyde and other substances, which is also accompanied by environmental pollution problems, and the stability of the electroless copper plating solution requires strict The use of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42C25D5/54C25D7/00
CPCH05K3/424H05K3/425C25D5/54C25D7/00H05K2201/095
Inventor 吴志彬肖城锋莫世懂林建辉孙延一
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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