3D laser photosensitive printing solder resist ink for integrated circuit and preparation method thereof

Abstract

The invention relates to the technical field of integrated circuit printing, in particular to 3D laser photosensitive printing solder resist ink for an integrated circuit and a preparation method thereof. The 3D laser photosensitive printing solder resist ink for an integrated circuit is prepared from the following raw materials in parts by weight: 20-80 parts of a maleic anhydride modified polyimide photosensitive oligomer, 5-30 parts of vinyloxy acrylate, 10-60 parts of polycyclic acrylate, 0.1-1 part of a fluorescent recognition agent, 1-5 parts of a sensitizer, 1-5 parts of a photoinitiator and 0.1-1 part of an interface agent. The 3D laser photosensitive printing solder resist ink for an integrated circuit provided by the invention is good in solder resist performance and good in tolerance to acid, alkali and isopropanol, the solder resist ink has excellent adhesion fastness on a Cu substrate, and a solder resist ink coating film is relatively high in hardness and low in VOC (Volatile Organic Compounds) content.

Description

technical field [0001] The present application relates to the technical field of integrated circuit printing, in particular to a 3D laser photosensitive printing solder resist ink for integrated circuits and a preparation method thereof. Background technique [0002] Solder resist ink is an insulating material, which is printed on the circuit board to form a solder resist layer. The solder resist layer is formed by a permanent polymer solder resist coating material. The solder resist layer covers most of the printed circuits. The solder resist The layer provides permanent protection for the copper traces of the printed circuit board, and the solder mask layer can prevent the solder from bridging between the conductors, which can effectively prevent short circuits. [0003] The traditional solder mask green oil is a kind of acrylic oligomer, which is coated on the circuit and substrate of the printed circuit board that do not need to be soldered to prevent the physical discon...

AI Technical Summary

Problems solved by technology

[0004]However, when the traditional solder resist green oil requires porous pad solder resist, there are many problems as follows: 1) The traditional solder resist green oil contains VOC solvents, which need to be used A large amount of liquid medicine is used for water treatment, and the high VOC content requires waste gas treatment, which is not environmentally friendly; 2) The traditional solder mask green oil can only use exposure and development technology, and there is insufficient development, so it is difficult to withstand the high temperature of reflow soldering (280-290 ℃ ), the tolerance to acid and alkali and various liquid medicines (such as isopropanol) is also poor, which will cause the pad position to be damaged by side erosion, and the solder mask will lift, bubble or fall off, resulting in resistance The edge of the solder pattern is abnormal, and it is difficult to guarantee the reliability in the production process; 3) The traditional solder mask green oil has no selectivity, and the places that need solder mask and those that do not need to be soldered will be exposed and developed, which not only wastes materials, but also aggravates the problem. Treatment where solder mask is required

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