High-activity and high-stability colloidal palladium catalyst and preparation process thereof

Abstract

The invention discloses a high-activity and high-stability colloidal palladium catalyst and a preparation process thereof. The high-activity and high-stability colloidal palladium catalyst comprises the following components by mass: 2-5g / L of a palladium source, 100-200ml / L of ethyl lactate, 1-5g / L of vanillin, 1-5g / L of ascorbic acid and 0.5-1g / L of a dispersant. The palladium source is reduced and filtered through the ascorbic acid to form nano-palladium particles, particle accumulation is reduced, the temperature is controlled to generate nano-palladium colloid, and a step-by-step heating mode is adopted until the temperature is increased until a system is boiled, so that aggregation of the palladium colloid caused by sudden increase of the temperature can be prevented; and after the temperature is kept for a period of time at a relatively low temperature, nanoparticles of the palladium colloid can be better and more stably dispersed, the system uniformity of the palladium colloid is ensured, colloid aggregation is avoided through filtration, the size of the colloid is reduced, malic acid is added for complexing palladium ions, and the condition that the state of the prepared palladium catalyst is influenced due to free palladium ions in the system is avoided, the high nano activity and the high stability are ensured, and the quality of a prepared metal copper layer is improved.

Description

technical field [0001] The invention relates to the technical field of metal grids, in particular to a highly active and highly stable colloidal palladium catalyst and a preparation process thereof. Background technique [0002] We will use a certain reducing agent to deposit metal ions in the plating solution on the surface of the activated substrate through redox reaction without external current, which is called electroless plating, also known as Electroless plating. In conventional production, the substrates of electroless plating are mostly non-conductors. Before electroless plating, the surface of the substrate must be pretreated and activated, and a certain active center is adsorbed on the non-metallic substrate to induce subsequent electroless plating. Activation not only determines the quality of electroless plating, but also determines the quality of the coating. [0003] In the process of metallization of non-metallic materials, the performance of palladium cata...

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Problems solved by technology

[0003] In the process of metallization of non-metallic materials, the performance of palladium catalyst is one of the key factors related to the metallization of non-metallic materials. At present, the activity of existing palladium catalysts is general, and it is usually necessary to increase the content of palladium in the catalyst solution to 50- Only 100ppm can ensure the continuous stability of the palladium catalyst solution, otherwise it will affect the subsequent electroless plating; at present, the palladium catalyst is usually directly formulated into a solution, and when it is formulated into a concentrated solution, it is prone to instability, and in the production process, there will be The precipitation of palladium chloride causes great waste, and the cost of palladium chloride accounts for the vast majority of the entire cost

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