Laminate, method for producing same, method for producing composite laminate, and method for producing polymer film

A manufacturing method and laminated body technology, applied in the direction of plating of superimposed layers, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of interlayer peeling and low adhesion
CN113365804APending Publication Date: 2021-09-07ASAHI GLASS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ASAHI GLASS CO LTD
Publication Date
2021-09-07

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Abstract

To provide: a laminate which has achieved uniform and high adhesion between a polymer layer and a metal foil layer; and a method for producing this laminate. A laminate according to the present invention comprises a metal foil layer and a polymer layer which is arranged on the surface of the metal foil layer so as to be in direct contact therewith, and which contains a tetrafluoroethylene-based polymer that has a melt viscosity of from 1 * 102 to 1 * 106 Pa.s at 380 DEG C. This laminate is configured such that: no silicon atom is present in the surface of the metal foil layer; or the ratio of nickel atoms detected in the surface of the metal foil layer by means of X ray fluorescence analysis is from 0.03% by mass to 0.25% by mass.
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Description

technical field

[0001] The present invention relates to a laminate having a predetermined polymer layer provided in direct contact on the surface of a predetermined metal foil layer, a method for producing the same, a method for producing a composite laminate, and a method for producing a polymer film. Background technique

[0002] In printed wiring boards, in order to achieve a low dielectric constant, it is sometimes necessary to reduce the surface roughness of the copper foil or form a polymer layer with a low dielectric constant polymer. However, low-k polymers are generally less polar and have poor adhesion to other materials. In addition, since the surface smoothness of the copper foil with reduced surface roughness is too high, the anchoring effect of the polymer layer is difficult to generate, and the adhesiveness is poor. Therefore, it is difficult to achieve strong adhesion between a polymer layer comprising a low dielectric constant polymer and a low-roughened co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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