Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical copper plating solution and method for plating copper substrate by using chemical copper plating solution

A technology for electroless copper plating and circuit boards, which is applied in liquid chemical plating, electrical connection formation of printed components, coating, etc., and can solve problems such as high application and processing costs, high toxicity, and high corrosion.

Pending Publication Date: 2021-09-14
惠州金晟新电子科技有限公司
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an electroless copper plating solution and a method for electroless copper plating aiming at the technical problems of high application cost and processing cost, high toxicity and high corrosion of existing chemical copper plating liquid additives

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical copper plating solution and method for plating copper substrate by using chemical copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A kind of electroless copper plating solution, by mass concentration, this electroless copper plating solution comprises components: the main salt of 2.5g / L, the reducing agent of 3.0g / L, the complexing agent of 5g / L, the Stabilizer, 0.5g / L accelerator, 0.06g / L surfactant, 0.012g / L polyvinylpyrrolidone and 0.042g / L sodium diphenylamine sulfonate, and the balance is ultrapure water. Compared with the existing chemical copper plating solution, the chemical copper plating solution of the present invention adds additives, including polyvinyl pyrrolidone and sodium diphenylamine sulfonate. Among them, polyvinylpyrrolidone is a non-ionic polymer compound, and the nitrogen atom in the molecule is easy to combine with copper ions, and the molecule of sodium diphenylamine sulfonate contains sulfonic acid groups and nitrogen atoms, which is also very easy to combine with copper ions. The combination of ions effectively improves the stability of the electroless copper plating solu...

Embodiment 2

[0044] In this embodiment, in terms of mass concentration, the electroless copper plating solution includes components: 9g / L copper sulfate pentahydrate, 21g / L sodium hypophosphite, 20g / L sodium citrate, 0.043g / L Thiosulfate, 1.5g / L nickel sulfate, 0.38g / L polyethylene glycol-600, 0.023g / L polyvinylpyrrolidone and 0.056g / L diphenylamine sulfonate and ultrapure water solvent.

[0045] In this embodiment, the above electroless copper plating solution further includes a pH regulator, and the pH regulator is sodium hydroxide. When the electroless copper plating solution of the present invention performs electroless copper plating, the pH value of the solution needs to be adjusted to be alkaline. In this embodiment, the pH value of the electroless copper plating solution is adjusted to pH=10.

[0046] see figure 1 , a kind of method that adopts the copper plated substrate of above-mentioned electroless copper plating solution, it comprises steps:

[0047] S1. Take the PCB board ...

Embodiment 3

[0054] In this embodiment, in terms of mass concentration, the electroless copper plating solution includes components: 6g / L copper sulfate pentahydrate, 12g / L sodium hypophosphite, 12g / L sodium citrate, 0.042g / L Thiosulfate, 1g / L nickel sulfate, 0.19g / L polyethylene glycol-600, 0.017g / L polyvinylpyrrolidone and 0.050g / L sodium diphenylamine sulfonate in ultrapure water .

[0055] In this embodiment, the above electroless copper plating solution further includes a pH regulator, and the pH regulator is sodium hydroxide. When the electroless copper plating solution of the present invention performs electroless copper plating, the pH value of the solution needs to be adjusted to be alkaline. In this embodiment, the pH value of the electroless copper plating solution is adjusted to pH=10.

[0056] see figure 1 , a kind of method that adopts the copper plated substrate of above-mentioned electroless copper plating solution, it comprises steps:

[0057] S1. Take the PCB board to ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chemical copper plating solution and a method for chemical copper plating. The chemical copper plating solution comprises the components including, by mass concentration, a main salt, a reducing agent, a complexing agent, a stabilizer, an accelerator, a surfactant and the balance ultrapure water. The chemical copper plating solution further comprises a pH value regulator and an additive, wherein the additive is polyvinylpyrrolidone and sodium diphenylaminesulfonate. The chemical copper plating method comprises the steps of alkaline oil removal, micro-etching, preimpregnation, activation, peptization and copper deposition. Alkaline oil removal, micro-etching, preimpregnation, activation and peptization are pretreatment procedures to adsorb colloidal palladium particles to a PCB to be plated with copper. In the copper deposition process, copper ions are catalytically reduced to the PCB to be plated with copper through the chemical copper plating solution. In the chemical copper plating solution, the polyvinylpyrrolidone and the sodium diphenylaminesulfonate are used as the combined additive, so that the chemical copper plating solution has the characteristics of being environmentally friendly, low in price and easy to obtain, and the copper plating effect can be effectively improved while the copper plating rate is ensured.

Description

technical field [0001] The invention relates to the technical field of electroless copper plating, in particular to an electroless copper plating solution and a method for electroless copper plating. Background technique [0002] Electroless copper plating is a process in the manufacture of circuit boards, usually also called copper sinking or porosity, which is an autocatalytic redox reaction. First, it is treated with an activator to make the surface of the insulating substrate adsorb a layer of active particles. The particles are usually metal palladium particles. Copper ions are first reduced on these active metal palladium particles, and these reduced metal copper The crystal nucleus itself becomes the catalytic layer of copper ions, so that the reduction reaction of copper continues on the surface of these new copper crystal nuclei. Hole metallization in the PCB metallization process is a technical problem. Most of the hole metallization is to cover a thin layer of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40H05K3/42H05K3/18
CPCC23C18/40C23C18/405H05K3/422H05K3/181
Inventor 曾文生
Owner 惠州金晟新电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com