Method for producing curable silicone sheet having hot melt properties
A manufacturing method and curable technology, applied in heat-activated films/sheets, chemical instruments and methods, flat products, etc., can solve defects, curable silicone sheet damage, curable silicone sheet is prone to damage, etc. question
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0392] The method for producing the hot-melt curable silicone sheet of the present invention will be described in detail using examples and comparative examples. In addition, in the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. In addition, the softening point of the curable granular silicone composition constituting the curable silicone sheet was measured by the following method.
[0393] [Softening point of curable granular silicone composition]
[0394] The curable granular silicone composition is molded into cylindrical particles. The pellets were placed on a heating plate set at 25° C. to 100° C., and a load of 100 grams was continuously pressed from above for 10 seconds. After the load was removed, the amount of deformation of the pellets was measured. Let the temperature at which the amount of deformation in the height direction becomes 1 mm or more be the softening point.
[0395] Next, by the method shown in th...
reference example 1
[0396] [Reference Example 1: Non-thermofusible Polyorganosiloxane Resin Microparticles]
[0397] Into a 1L flask, put the white solid at 25°C from the average unit formula
[0398] (Me 3 SiO 1 / 2 ) 0.44 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02
[0399] 270.5 g of 55% by mass-xylene solution of polyorganosiloxane resin and 1,3-divinyltetramethyldisiloxane complex of platinum Disiloxane solution (content of platinum metal = about 4000ppm) 0.375g was uniformly stirred at room temperature (25°C) to prepare a xylene solution of polyorganosiloxane resin containing 10ppm of platinum metal by mass unit . In addition, this polyorganosiloxane resin does not soften / melt even when heated to 200° C., and does not have thermal fusibility.
[0400] The xylene solution of the polyorganosiloxane resin prepared above was removed by spraying with a spray dryer at 50°C, and the xylene was granulated to prepare a spherical non-thermofusible polyorganosiloxane Alkane resin particles. As a result o...
Embodiment 1
[0402] (a+c(pt)) 69.8 g of non-thermofusible polyorganosiloxane resin particles (vinyl content=0% by mass) obtained in Reference Example 1,
[0403] (b1) by the formula
[0404] ViMe 2 SiO(Me 2 SiO) 800 SiViMe 2
[0405] 29.9 g of dimethylvinylsiloxane-terminated dimethylpolysiloxane (vinyl group content = 0.09% by mass) at both ends of the molecular chain shown,
[0406] (c4(SiH)) is given by
[0407] Me 3 SiO(MeHSiO) 7 (Me 2 SiO) 6.5 SiMe 3
[0408] Expressed organohydrogenpolysiloxane 0.2g
[0409] {With respect to 1 mole of vinyl groups in the dimethylvinylsiloxane-terminated dimethylpolysiloxane at both ends of the molecular chain, the silicon atom in the organohydrogenpolysiloxane is 1.4 moles bonded to hydrogen atoms amount},
[0410] (d1) 234.4 g of alumina (AES-12 manufactured by Sumitomo Chemical) with an average particle diameter of 0.44 μm,
[0411] 1-Ethynyl-1-cyclohexanol (in an amount of 1000 ppm by mass unit relative to the present composition) w...
PUM
| Property | Measurement | Unit |
|---|---|---|
| softening point | aaaaa | aaaaa |
| storage modulus | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


