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Preparation method of ceramic composite polytetrafluoroethylene type microwave composite dielectric substrate

A technology of polytetrafluoroethylene and composite media, which is applied in the field of electronic components and ceramic materials for microwave electronic components, can solve the problems of unsuitable mixing uniformity and continuous batch production, and achieve high production efficiency, good dispersion uniformity, good uniformity

Pending Publication Date: 2021-09-17
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of existing ceramic-filled polytetrafluoroethylene composite material mixing uniformity and inapplicability to continuous mass production

Method used

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  • Preparation method of ceramic composite polytetrafluoroethylene type microwave composite dielectric substrate

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Experimental program
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Embodiment 1

[0030] Choose silicon dioxide as filler, use silane coupling agent to carry out surface treatment on it, the silane coupling agent is 2% of the mass of silicon dioxide, the surface modified ceramic powder and polytetrafluoroethylene emulsion according to the mass ratio of 60% Silicon dioxide + 40% polytetrafluoroethylene is used for batching and stirring. After stirring for 4 hours, while stirring the mixed solution, use a vacuum pump to pump the mixed solution to the atomizer. The atomizer speed is 6000r / min, and the inlet temperature The compound dough is prepared at 250°C and the outlet temperature is 110°C. The prepared compound dough is calendered and then hot-pressed and sintered. The hot-pressed sintering temperature is 370°C, the pressure is 7Mpa, and the time is 2h. Silicon composite polytetrafluoroethylene type high frequency microwave composite dielectric substrate with a dielectric constant of 3.0.

Embodiment 2

[0032] Titanium dioxide is selected as the filler, and its surface is also treated with a silane coupling agent. The silane coupling agent is 1.5% of the mass of titanium dioxide. Tetrafluoroethylene is compounded, and then demulsification, calendering, and hot-press sintering are carried out according to the method in embodiment 1 to prepare a titanium dioxide composite polytetrafluoroethylene type high-frequency microwave composite dielectric substrate with a dielectric constant of 11.

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Abstract

The invention relates to a preparation method of a ceramic composite polytetrafluoroethylene type microwave composite dielectric substrate. The preparation method comprises the following specific steps: carrying out surface modification on a filler through a silane coupling agent; mixing surface-modified porcelain powder with a polytetrafluoroethylene emulsion to form a mixed emulsion; carrying out high-temperature demulsification on the mixed emulsion by using a spray drying device through a high-temperature and high-speed rotary demulsification method; conveying the mixed emulsion to a high-speed rotary atomization device through a vacuum conveying device, wherein the emulsion is rapidly thrown out through the high-speed rotary atomization device, rapid demulsification is achieved under the action of centrifugal force and high temperature, and composite dough is formed; pressing the composite dough through a pressing device for molding; and carrying out hot pressed sintering on a pressed and molded diaphragm to obtain the microwave composite dielectric substrate. The problems that an existing ceramic filled polytetrafluoroethylene composite material is low in in mixing uniformity and not suitable for continuous batch production are solved. The method is widely applied to modern microwave electronic communication fields such as spaceflight electronic equipment, communication, a Beidou system, a wireless local area network and the Internet of Things.

Description

technical field [0001] The invention belongs to the field of electronic components, specifically, to the field of microwave electronic components, and more specifically, to the field of ceramic materials for microwave electronic components. Background technique [0002] With the gradual development of the communication field towards higher frequency bands, integrated circuits are required to be highly integrated and high-frequency, and the requirements for microwave composite dielectric substrates, the core material of integrated circuits, are gradually increasing. At present, domestic mainstream copper-clad laminate manufacturers still use glass fiber cloth impregnated PTFE emulsion is dried to prepare a prepreg, and the glass fiber cloth has obvious directionality, and there are cross nodes in the glass fiber, so that there are obvious differences in the node constants of the board in the X and Y directions. There are different degrees of attenuation, and the signal transm...

Claims

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Application Information

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IPC IPC(8): B29C43/00B29C43/58C04B14/06C04B14/30C04B20/02C04B26/08B29L7/00
CPCB29C43/003B29C43/006B29C43/58C04B26/08C04B20/023C04B14/06C04B14/305B29C2043/5808B29C2043/5816B29L2007/002Y02P20/10
Inventor 杨俊龚漫莉窦占明韩玉成尚勇王星许丽
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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