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Conductive adhesive for LED chip packaging and preparation method thereof

A technology of LED chips and adhesives, which is applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of heat resistance, high temperature resistance, expensive gold, copper is easy to be oxidized, etc., to achieve good High temperature resistance, remarkable bonding strength, and good thermal stability

Pending Publication Date: 2021-09-28
深圳市汇海鑫科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current organic conductive adhesives have good adhesion properties to a variety of materials, but their heat resistance and high temperature resistance are not good. They mainly include epoxy resin conductive adhesives, polyurethane conductive adhesives, phenolic resin conductive adhesives, organic silicon Resin conductive adhesive and polyimide conductive adhesive, etc.
The main way to improve the conductivity of organic adhesives is to add gold powder, silver powder, copper powder, etc. Although gold powder has excellent chemical stability and excellent conductivity, it can solve the problems of easy oxidation of copper and migration of silver. It is the most conductive adhesive. Ideal conductive filler, but gold is expensive
Silver powder and copper powder are relatively cheap but cannot migrate after treatment, which also limits their application to a certain extent

Method used

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  • Conductive adhesive for LED chip packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] A preparation method of conductive adhesive for LED chip packaging, comprising the steps of:

[0031] (1) Pretreatment of expanded perlite:

[0032] A. Put the expanded perlite in a corona discharge apparatus for corona treatment, control the working voltage to 12-16kV, take it out after 50-70s of treatment;

[0033] B. Put the expanded perlite after corona treatment in operation A in a muffle furnace, and treat it at a high temperature of 1200-1400°C, and take out the expanded perlite for later use;

[0034] C. The expanded perlite after the high temperature treatment in operation B is placed in an ultrafine pulverizer for ultrafine pulverization, and after completion, the expanded perlite powder is obtained by passing through a 2000-3000 mesh sieve for subsequent use;

[0035] D. Place the expanded perlite obtained in operation C in a cold plasma device for cold plasma treatment. The discharge power of the cold plasma treatment is 200-240W, and the treatment gas is n...

Embodiment 1

[0044] A preparation method of conductive adhesive for LED chip packaging, comprising the steps of:

[0045] (1) Pretreatment of expanded perlite:

[0046] A. Put the expanded perlite in the corona discharge apparatus for corona treatment, control the working voltage to 12kV, take it out after 50s for standby;

[0047] B. Place the expanded perlite after corona treatment in operation A in a muffle furnace, and treat it at a high temperature of 1200 ° C. After completion, take out the expanded perlite for later use;

[0048]C. The expanded perlite after the high temperature treatment in operation B is placed in the superfine pulverizer to carry out the ultrafine pulverization process, and after completion, the expanded perlite powder is passed through a 2000 mesh sieve for subsequent use;

[0049] D. The expanded perlite obtained in operation C is placed in a cold plasma device for cold plasma treatment, the discharge power of the cold plasma treatment is 200W, the treatment g...

Embodiment 2

[0057] A preparation method of conductive adhesive for LED chip packaging, comprising the steps of:

[0058] (1) Pretreatment of expanded perlite:

[0059] A. Put the expanded perlite in the corona discharge apparatus for corona treatment, control the working voltage to 14kV, and take it out after 60s for standby;

[0060] B. Place the expanded perlite after corona treatment in operation A in a muffle furnace, and treat it at a high temperature of 1300°C, and take out the expanded perlite after completion;

[0061] C. The expanded perlite after the high temperature treatment in operation B is placed in the superfine pulverizer to carry out the ultrafine pulverization process, and after completion, the expanded perlite powder is passed through a 2500 mesh sieve for subsequent use;

[0062] D. The expanded perlite obtained in operation C is placed in a cold plasma device for cold plasma treatment, the discharge power of the cold plasma treatment is 220W, and the treatment gas i...

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Abstract

The invention discloses a conductive adhesive for LED chip packaging and a preparation method thereof, and belongs to the technical field of organic adhesives. The preparation method comprises the following steps: (1) pretreating expanded perlite; (2) chemical plating; (3) weighing the raw materials; and (4) preparing a finished product. According to the preparation method of the conductive adhesive for LED chip packaging, the adhesive finally prepared through the method is remarkable in bonding strength, low in resistivity and good in conductivity, the shear strength of the adhesive prepared through the method reaches up to 13.6 MPa at the temperature of 1200 DEG C, the heat preservation time is 1-4 h. The shear strength of the high-temperature-resistant adhesive is increased, and the shear strength of the high-temperature-resistant adhesive is decreased after 4 hours, so that the high-temperature-resistant adhesive prepared by the method is good in high-temperature resistance and good in thermal stability.

Description

technical field [0001] The invention belongs to the technical field of organic adhesives, and in particular relates to a conductive adhesive for LED chip packaging and a preparation method thereof. Background technique [0002] Compared with the traditional connection technology, the adhesive and bonding technology has the advantages of small deformation of parts, uniform stress distribution, high bonding strength, bonding performance, and materials with large differences in thickness. The glue seam has a sealing effect, and the process is simple and can be The advantages of reducing the quality of structural parts make it widely used in high-tech fields such as 5G, high-speed chips, and laser imaging. [0003] The current organic conductive adhesives have good adhesion properties to a variety of materials, but their heat resistance and high temperature resistance are not good. They mainly include epoxy resin conductive adhesives, polyurethane conductive adhesives, phenolic ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J11/04
CPCC09J163/00C09J9/02C09J11/04C08K2003/0806C08K2201/001C08L2201/08C08L2203/206C08K9/00C08K7/26C08K3/08C08K9/12Y02P20/10
Inventor 徐嘉鹏林海晖
Owner 深圳市汇海鑫科技有限公司