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Preparation method of polyimide composite film for printed circuit board

A printed circuit board and polyimide technology, which is applied in the field of preparation of polyimide composite films for printed circuit boards, can solve problems such as the inability to meet the high frequency signal transmission of printed circuit boards, and achieve the benefits of Dielectric properties, increase stability, avoid agglomeration effects

Pending Publication Date: 2021-10-08
浙江中科玖源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric constant of traditional aromatic polyimide is generally in the range of 3.4-3.6, which cannot meet the high-frequency signal transmission requirements of printed circuit boards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of nano-silica grafted with amino groups on the surface: disperse 10g of nano-silica with a particle size of 60nm in 250ml of anhydrous toluene, add 60g of γ-aminopropyltriethoxysilane, and heat to 112 ℃, and then constant temperature reflux reaction for 40h, that is.

[0021] The preparation method of polyimide composite film for printed circuit board:

[0022] (1) Disperse the nano silicon dioxide grafted with amino groups on the surface and the fluorinated graphene with oxygen-containing groups in 100ml N,N-dimethylformamide, sonicate for 1h, and then stir for 8h to obtain a mixed solution; , the mass ratio of nano-silica grafted with amino groups on the surface to fluorinated graphene with oxygen-containing groups is 10:1;

[0023] (2) Add the above mixed solution to the polyamic acid solution at a mass ratio of 2:100. After mixing, cast a film on clean glass, remove the solvent with hot air at 160°C, and cool down to room temperature; then place the gl...

Embodiment 2

[0026] Preparation of nano-silica grafted with amino groups on the surface: disperse 10 g of nano-silica with a particle size of 100 nm in 200 ml of anhydrous toluene, add 50 g of N-(β-aminoethyl-γ-aminopropyl) trimethoxysilane , In a nitrogen atmosphere, heated to 115 ° C, and then constant temperature reflux reaction 24h, that is.

[0027] The preparation method of polyimide composite film for printed circuit board:

[0028] (1) Disperse nano-silica with amino groups grafted on the surface and fluorinated graphene with oxygen-containing groups in 100ml of N,N-dimethylformamide, sonicate for 0.5h, and then stir for 6h to obtain a mixed solution; Wherein, the mass ratio of nano-silica grafted with amino groups on the surface to fluorinated graphene with oxygen-containing groups is 15:1;

[0029] (2) Add the above mixed solution to the polyamic acid solution at a mass ratio of 5:100. After mixing, cast a film on a clean glass, remove the solvent with hot air at 160°C, and lowe...

Embodiment 3

[0032] Preparation of nano-silica grafted with amino groups on the surface: Disperse 10g of nano-silica with a particle size of 10nm in 300ml of anhydrous toluene, add 80g of γ-aminopropyltriethoxysilane, and heat to 110 ℃, and then constant temperature reflux reaction for 48h, that is.

[0033] The preparation method of polyimide composite film for printed circuit board:

[0034] (1) Disperse the nano-silica with amino group grafted on the surface and the fluorinated graphene with oxygen-containing groups in 100ml N,N-dimethylformamide, ultrasonication for 1h, and then stirring for 7h to obtain a mixed solution; wherein , the mass ratio of nano-silica grafted with amino groups on the surface to fluorinated graphene with oxygen-containing groups is 5:1;

[0035] (2) Add the above mixed solution to the polyamic acid solution at a mass ratio of 5:100. After mixing, cast a film on a clean glass, remove the solvent with hot air at 160°C, and lower it to room temperature; then pla...

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Abstract

The invention discloses a preparation method of a polyimide composite film for a printed circuit board. The preparation method comprises the following steps: (1) dispersing nano silicon dioxide with amino grafted on the surface and fluorinated graphene with oxygen-containing groups in N, N-dimethylformamide, and carrying out ultrasonic treatment and stirring to obtain a mixed solution; and (2) adding the mixed solution into a polyamide acid solution, and carrying out film casting and thermal imidization to obtain a polyimide composite film, wherein the mass ratio of the mixed solution to the polyamide acid solution is (1-5): 100. The polyimide composite film for the printed circuit board prepared by the invention has lower dielectric constant and dielectric loss, and can meet the requirements of the printed circuit board on high-frequency signal transmission.

Description

technical field [0001] The invention belongs to the field of polyimide composite films, in particular to a preparation method of polyimide composite films for printed circuit boards. Background technique [0002] Polyimide is a kind of high polymer with the advantages of wide application temperature, chemical corrosion resistance, high strength and good dielectric properties. As a special engineering material, it has been widely used in aviation, aerospace, microelectronics, Liquid crystal, communication and other fields. It is also widely used in flexible printed circuits. [0003] With the information processing of electronic products, the direction of high-frequency signal transmission and high-speed digitalization continues to develop. In order to ensure that electronic products have good signal transmission quality under the condition of high-frequency signal transmission, the transmission line in the conductive copper foil of the printed circuit board and the connect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K9/06C08K7/26C08K3/04
CPCC08J5/18C08J2379/08C08K9/06C08K7/26C08K3/042C08K2201/011
Inventor 徐哲刘国隆解惠东邵成蒙
Owner 浙江中科玖源新材料有限公司
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