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A kind of thin film inductor processing technology and thin film inductor

A processing technology and inductor technology, applied in the direction of inductor/transformer/magnet manufacturing, transformer/inductor coil/winding/connection, transformer/inductor parts, etc. And other problems, to achieve good protection, improve performance, improve the effect of practicality

Active Publication Date: 2022-05-20
合泰盟方电子(深圳)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the applicant found in actual processing that more agglomeration and granulation appeared on the surface of the titanium layer, the first copper layer, and the second copper layer, which affected the performance of the thin film inductor

Method used

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  • A kind of thin film inductor processing technology and thin film inductor
  • A kind of thin film inductor processing technology and thin film inductor
  • A kind of thin film inductor processing technology and thin film inductor

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Embodiment 1

[0071] Embodiments of the present application disclose a thin film inductor. Reference Figure 1 and Figure 2 , including an insulating substrate 1, the insulating substrate 1 is a square ceramic substrate, and the top surface of the insulating substrate 1 is set to the front, and the bottom surface of the insulation substrate 1 is set to the back. The insulation substrate 1 is provided with a first insulating layer 2 on the front, and the first insulation layer 2 is sputtered by sputtering sputtering. The back of the insulating substrate 1 is also provided with a first insulating layer 2, and the end faces of the two ends of the insulating substrate 1 along its length direction are also respectively fixed with a first insulating layer 2. The front of the insulating substrate 1 is symmetrically fixed on the surface of the first insulating layer 2 with two front electrodes 31, the two front electrodes 31 are respectively disposed at both ends of the insulating substrate 1 along its ...

Embodiment 2

[0077] Embodiments of the present application disclose a thin film inductor processing process, comprising the following steps:

[0078] S1, in the insulating substrate 1 in the front of the front electrode 31 is provided, on the back side of the back electrode 32 is provided, the two sides of the side electrode 33 are sputtered silica, the silica forms a first insulating layer 2 on the surface of the insulating substrate 1, with reference Figure 3 。

[0079] The applicant found that the first insulation layer 2 not only improves the insulation of the insulation substrate 1, and the insulation substrate 1 is a square ceramic substrate, the composition of the ceramic is mainly silicon, aluminum, oxygen three elements, sputtering silica on the surface of the insulating substrate 1, using the synergy between the silicon in the silicon dioxide and the silicon in the ceramic, effectively improving the binding strength of the first insulation layer 2 and the insulation substrate 1, whil...

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Abstract

This application relates to the technical field of inductor processing, and specifically discloses a thin film inductor processing technology and a thin film inductor. The processing technology includes the following steps: setting a first insulating layer; applying a magnetic field to the insulating substrate, setting a titanium layer, a first copper layer; set the first hanging copper plating to form the inductance coil and the front electrode; set the thermal conductive silicone grease to fill the silicon dioxide layer and the silicon dioxide layer to form an isolation layer and the second insulating layer; apply a magnetic field to the insulating substrate to set the second Copper layer; set the second hanging copper plating to form lead-out rods; process two back electrodes; process side electrodes to form a primary product; heat treat the primary product at a temperature of 130-160°C for 0.5-2h. The thin film inductor processing technology of the present application can effectively reduce the phenomenon of agglomeration and granulation of metal titanium and metal copper, and increase the crystallinity of the titanium layer, the first copper layer, and the second copper layer, and improve the performance of the thin film inductor. Stability, yield rate, practicality.

Description

Technical field [0001] The present application relates to the field of inductor processing technology, in particular to a thin film inductor processing process and a thin film inductor. Background [0002] With the development of science and technology, electronic systems have developed in the direction of high-frequency broadband and high integration, accompanied by the development of electronic components to miniaturization, which undoubtedly puts forward higher requirements for electronic components. Inductor is a common kind of electronic components, which is a kind of component that can convert electrical energy into magnetic energy and store it, and the common inductors mainly include stacked inductors, wire-wound inductors, and thin-film inductors. Among them, thin-film inductors have a high inductance due to the introduction of magnetic films in the processing process, and can also reduce the size of components, while also improving the performance of inductors, so that t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00H01F27/29H01F27/28
CPCH01F41/00H01F27/2847H01F27/29
Inventor 高涛彭美华邹松青林素娟
Owner 合泰盟方电子(深圳)股份有限公司