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Low-dielectric and high-heat-resistance benzoxazine resin containing hydrocarbon chain segment and imine ring and preparation method of low-dielectric and high-heat-resistance benzoxazine resin

A technology of benzoxazine and hydrocarbon chain segments, which is applied in the field of benzoxazine resin and its preparation, can solve the problem of inability to apply high-frequency and high-speed copper-clad laminates, limit the application of high-frequency and high-speed copper-clad laminates, dielectric constant and dielectric loss Higher problems, to achieve the effect of improving heat resistance, reducing dielectric loss, and increasing crosslinking density

Pending Publication Date: 2021-11-05
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional benzoxazine resins such as bisphenol A type and bisphenol F type resins are only suitable for the pressing of ordinary copper clad laminates due to their high dielectric constant and dielectric loss, and cannot be applied to high frequency and high speed copper clad laminates. Therefore, , people try to further develop and synthesize benzoxazines with low dielectric properties
[0004] In recent years, people have attempted to introduce long-chain carbon chains into the benzoxazine structure, hoping to reduce the dielectric constant and dielectric loss by increasing the molecular free volume. In the prior art, there are, for example, : Preparation of dodecylphenol benzoxazine resin ("Thermosetting Resin" 2013 06 issue), cardanol benzoxazine resin ("Polymer Materials Science and Engineering" 2011 Volume 27), nonylphenol modified However, since the number of carbon atoms in the carbon chain introduced in the structure is 6-12, the molecular free volume of benzoxazine increases and Not obvious. Therefore, the dielectric properties of the resin after curing are not good. On the contrary, as the carbon chain grows, the heat resistance of the product decreases, and Tg≤140°C limits its application in the field of high-frequency and high-speed copper clad laminates.

Method used

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  • Low-dielectric and high-heat-resistance benzoxazine resin containing hydrocarbon chain segment and imine ring and preparation method of low-dielectric and high-heat-resistance benzoxazine resin
  • Low-dielectric and high-heat-resistance benzoxazine resin containing hydrocarbon chain segment and imine ring and preparation method of low-dielectric and high-heat-resistance benzoxazine resin
  • Low-dielectric and high-heat-resistance benzoxazine resin containing hydrocarbon chain segment and imine ring and preparation method of low-dielectric and high-heat-resistance benzoxazine resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A preparation method of a low-dielectric, high-heat-resistant benzoxazine resin containing hydrocarbon chain segments and imine rings, the steps are: in a reactor equipped with a stirrer, a thermometer, and a condenser tube, add 100 g of p-ethylene Base phenol / aniline type benzoxazine resin, 20g MDA (abbreviation of diaminodiphenylmethane, the same hereinafter) type bismaleimide resin (BMI-1000 of Japan DAIWA), 80g cyclohexanone and 0.02g Dicumyl peroxide, heat up to 100°C, pre-polymerize for 30min, cool down slightly to 80°C, add 20g polybutadiene resin (Ricon 100), 0.02g dicumyl peroxide, react at this temperature for 150min, cool down , that is, a low-dielectric, high-heat-resistant benzoxazine resin containing hydrocarbon chain segments and imine rings is obtained, which is a reddish-brown transparent liquid with a solid content of 64%. The chemical structure is as follows (9):

[0038]

[0039] In formula (9), x, y, n are 1-10, z is 5-20

Embodiment 2

[0041] A preparation method of a low-dielectric, high-heat-resistant benzoxazine resin containing hydrocarbon chain segments and imine rings, the steps are: in a reactor equipped with a stirrer, a thermometer, and a condenser tube, add 100 g of bisphenol F / vinylaniline type benzoxazine resin, 30g monomaleimide resin (Hubei Tosoh Chemical N-PMI), 50g solvent and 0.01g azobisisobutyronitrile, heat up to 120°C, pre-polymerize for 60min , slightly lowered the temperature to 90°C, added 30g polystyrene butadiene resin (Ricon 100), 0.01g dicumyl peroxide, reacted at this temperature for 120min, lowered the temperature, and obtained low Dielectric, high heat-resistant benzoxazine resin is a reddish brown transparent liquid with a solid content of 76.2%, and its chemical structure is as follows (10):

[0042]

[0043] In formula (10), x, y, and n are 1-10, and z is 5-20.

Embodiment 3

[0045] A preparation method of a low-dielectric, high-heat-resistant benzoxazine resin containing hydrocarbon chain segments and imine rings, the steps are: in a reactor equipped with a stirrer, a thermometer, and a condenser tube, add 100g MDA / P-vinylphenol type benzoxazine resin, 40g MDA type bismaleimide resin (BMI-1100 of Japan DAIWA), 60g methyl ethyl ketone and 0.02g azobisisobutyronitrile, heated up to 100°C, prepolymerized 3min, slightly lower the temperature to 90°C, add 10g polystyrene butadiene resin (Ricon 181), 0.005g tert-butyl peroxybenzoate, react at this temperature for 200min, lower the temperature, and obtain the The low-dielectric, high-heat-resistant benzoxazine resin is a reddish-brown transparent liquid with a solid content of 71.4%, and its chemical structure is as follows (11):

[0046]

[0047] In formula (11), x, y, and n are 1-10, and z is 5-20.

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Abstract

The invention discloses a low-dielectric and high-heat-resistance benzoxazine resin containing a hydrocarbon chain segment and an imine ring as shown in a formula (I). A preparation method of the compound comprises the following steps: adding a double-bond-containing benzoxazine resin, a maleimide resin, a solvent and an initiator into a reactor provided with a stirrer, a thermometer and a condensation pipe, conducting heating to 80-140 DEG C, conducting pre-polymerizing for 30-300 minutes, conducting cooling to 80-120 DEG C, adding a hydrocarbon resin and an initiator, conducting reacting for 30-300 minutes at the temperature, and conducting cooling, thereby obtaining the product. The prepared low-dielectric and high-heat-resistance benzoxazine resin containing the hydrocarbon chain segment and the imine ring has the characteristics of low dielectric constant, low dielectric loss, high heat resistance and the like, and is particularly suitable for being used as a raw material for a high-frequency and high-speed copper-clad plate. The formula (I) is shown in the specification.

Description

technical field [0001] The invention belongs to a benzoxazine resin for copper-clad laminates and a preparation method thereof, and relates to a low-dielectric and high-heat-resistant benzoxazine resin containing hydrocarbon chain segments and imine rings and a preparation method thereof. The (prepared) low-dielectric and high-heat-resistant benzoxazine resin containing hydrocarbon segments and imine rings of the present invention is particularly suitable as a raw material for high-frequency and high-speed copper clad laminates, and can also be used for laminates, integrated circuit packaging, high Density Internet and other fields. Background technique [0002] 5G is becoming one of the most impactful technological changes. Due to its data transmission rate and high reliability requirements, 5G communication puts forward very high requirements on the dielectric constant, dielectric loss factor and heat resistance of the laminates and copper clad laminates used. As an impo...

Claims

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Application Information

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IPC IPC(8): C08G14/06
CPCC08G14/06
Inventor 支肖琼黄杰廖曦李欣吴杰
Owner SICHUAN DONGFANG INSULATING MATERIAL