Thick-film resistor paste simultaneously applicable to aluminum oxide ceramic substrate and isolation dielectric layer

A technology of alumina ceramics and isolation medium, which is applied in the direction of conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, and can solve the problem of inconvenient use of multilayer thick film integrated circuit products, non-universal products, integrated circuit Problems such as troublesome design and manufacturing process, to achieve the effects of small graphic effect, good resistance consistency, and simple preparation process

Active Publication Date: 2021-11-12
西安宏星电子浆料科技股份有限公司
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Problems solved by technology

[0004] Existing resistor pastes for thick film integrated circuits are designed separately for the alumina ceramic substrate and the isolation dielectric layer, and the products cannot

Method used

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  • Thick-film resistor paste simultaneously applicable to aluminum oxide ceramic substrate and isolation dielectric layer
  • Thick-film resistor paste simultaneously applicable to aluminum oxide ceramic substrate and isolation dielectric layer
  • Thick-film resistor paste simultaneously applicable to aluminum oxide ceramic substrate and isolation dielectric layer

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Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments, which do not limit the protection scope of the present invention. The protection scope of the present invention is only limited by the claims, and any omission, replacement or modification made by those skilled in the art on the basis of the disclosed embodiments of the present invention will fall within the protection scope of the present invention.

[0016] 1. Selection of conductive powder: the particle size of silver powder ranges from 1 to 3 μm, and the specific surface area of ​​palladium powder is 5 to 15 m 2 / g, the specific surface area of ​​ruthenium dioxide is 25~55m 2 / g, the specific surface area of ​​lead ruthenate is 3~10m 2 / g.

[0017] 2. Preparation of lead borosilicate glass powder: according to the weight percentage of PbO 57%, SiO 2 7%, CaO 13%, Al 2 o 3 3%, B 2 o 3 15% and ZnO 5%. After mixing various oxides evenly, the r...

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Abstract

The invention discloses a thick-film resistor paste simultaneously applicable to an aluminum oxide ceramic substrate and an isolation dielectric layer. The resistor paste is composed of conductive powder, a glass binding phase, an additive and an organic carrier, wherein the conductive powder is at least one selected from silver powder, palladium powder, ruthenium dioxide and lead ruthenate; and the glass binding phase is lead borosilicate glass composite magnesium aluminate spinel. According to the invention, the silver powder, the palladium powder, the ruthenium dioxide and the lead ruthenate are adopted as conductive phases, so it is guaranteed that the resistor paste has good resistance and temperature coefficients under different resistance values; and the resistor paste is used on the aluminum oxide ceramic substrate and the isolation dielectric layer by adopting a magnesium aluminate spinel-lead borosilicate glass powder composite material; and the prepared luminum oxide ceramic substrate and the prepared isolation dielectric layer both have the characteristics of good resistance consistency and small temperature coefficient, and meet the use requirements of various thick-film circuit products.

Description

technical field [0001] The invention relates to a resistance slurry, in particular to a thick-film resistance slurry which is applied on an alumina ceramic substrate and an isolation medium layer and has the characteristics of good resistance consistency and small temperature coefficient. Background technique [0002] Thick film resistor paste is a technology-intensive product integrating metallurgy, chemistry, materials, electronic technology, analysis and testing technology and other multi-disciplinary fields. In order to adapt to printing, sintering process requirements and practical application requirements, it must have printability, functional characteristics and process compatibility. The commonly used resistance paste is a kind of paste composed of functional phase, binder phase, additives and organic vehicle, mixed in a certain proportion. [0003] As one of the basic raw materials for the production of various thick film integrated circuits, thick film resistor pa...

Claims

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Application Information

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IPC IPC(8): H01B1/14H01B1/16H01B1/20H01B1/22H01L27/01
CPCH01B1/14H01B1/16H01B1/20H01B1/22H01L27/013
Inventor 鹿宁党丽萍吴高鹏王妮王博张建益马倩
Owner 西安宏星电子浆料科技股份有限公司
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