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Flexible heat-conducting phase-change gel material and preparation method and application thereof

A technology of gel material and thermal conductive filler, which is applied in heat exchange materials, chemical instruments and methods, electrical equipment structural parts, etc. High coefficient, high phase change enthalpy, and not easy to leak

Active Publication Date: 2021-11-16
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its thermal conductivity is low (generally 0.1-0.5Wm -1 K -1 ), easy leakage has been the two bottlenecks restricting its development
In practical applications, due to the unevenness of the heating parts of electronic devices, directly adding solid organic phase change materials is not only easy to leak, but also cannot be closely attached to its surface, resulting in large air thermal resistance and low thermal conductivity

Method used

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  • Flexible heat-conducting phase-change gel material and preparation method and application thereof
  • Flexible heat-conducting phase-change gel material and preparation method and application thereof
  • Flexible heat-conducting phase-change gel material and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042] (1) First weigh the graphene nanosheet heat-conducting filler, put it into a nylon ball mill jar, add agate for grinding, then pour the ground nanosheet into the reagent bottle, add tetrahydrofuran organic solvent to it, and heat it at 180W Ultrasonic at high power, take the upper layer solution, filter, wash with deionized water, put it in an oven to dry, and obtain a nanosheet thermally conductive filler with good peeling dispersion; then add a terephthalic acid modifier to the peeled nanosheet thermally conductive filler , using a magnetocaloric reactor to heat and stir it, then washing it with deionized water to remove the residual modifier, drying it in an oven to obtain a modified graphene nanosheet thermally conductive filler for use;

[0043] (2) Weigh silicon dioxide nanoparticle heat-conducting filler, add tetrahydrofuran organic solvent therein, ultrasonically under 180W power, take upper layer solution, filter, wash with deionized water, put into oven and dry...

Embodiment 2

[0051] (1) First weigh the hexagonal boron nitride nanosheet heat-conducting filler, put it into a nylon ball mill jar, add agate for grinding, then pour the ground nanosheet into a reagent bottle, and add tetrahydrofuran organic solvent therein, Ultrasound under 180W power, take the upper layer solution, filter, wash with deionized water, put it in an oven to dry, and obtain a nanosheet thermally conductive filler with good peeling dispersion; then add terephthalic acid modified to the peeled nanosheet thermally conductive filler Using a magnetocaloric reactor to heat and stir it, wash it with deionized water, wash off the residual modifier, and dry it in an oven to obtain a modified hexagonal boron nitride nanosheet thermally conductive filler for use;

[0052] (2) Weigh silicon carbide nano-particle heat-conducting filler, add tetrahydrofuran organic solvent therein, ultrasonically under 180W power, take upper layer solution, filter, wash with deionized water, put into oven ...

Embodiment 3

[0060] (1) First weigh the hexagonal boron nitride nanosheet heat-conducting filler, put it into a nylon ball mill jar, add agate for grinding, then pour the ground nanosheet into a reagent bottle, and add tetrahydrofuran organic solvent therein, Ultrasound under 180W power, take the upper layer solution, filter, wash with deionized water, put it in an oven to dry, and obtain a nanosheet thermally conductive filler with good peeling dispersion; then add terephthalic acid modified to the peeled nanosheet thermally conductive filler Using a magnetocaloric reactor to heat and stir it, wash it with deionized water, wash off the residual modifier, and dry it in an oven to obtain a modified hexagonal boron nitride nanosheet thermally conductive filler for use;

[0061] (2) Weigh the aluminum nitride nanoparticle heat-conducting filler, add tetrahydrofuran organic solvent therein, ultrasonically under 180W power, take the upper layer solution, filter, wash with deionized water, put in...

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Abstract

The invention discloses a flexible heat-conducting phase-change gel material and a preparation method and application thereof. The preparation method comprises the steps of: melting an organic phase-change material at a temperature higher than a phase-change temperature, adding a cross-linked elastomer material into the organic phase-change material solution in batches, heating and stirring at the same time, properly raising the temperature along with the gradual increase of the content of the cross-linked elastomer to fully and uniformly melt the cross-linked elastomer material in the organic phase-change material to obtain a gel solution, adding a modified nano-sheet heat-conducting filler, heating and stirring until the nano-sheet heat-conducting filler is uniformly dispersed, finally adding a modified nano-particle heat-conducting filler, and heating and stirring until the nano-particle heat-conducting filler is uniformly dispersed to obtain a flexible heat-conducting phase-change gel material. The organic phase-change material is used as a main body and packaged with the cross-linked elastomer, the heat-conducting filler is used as a heat-conducting channel, and the flexible heat-conducting phase-change gel material prepared by heating and mixing has the advantages of being flexible, not prone to leakage, high in phase-change enthalpy value, good in heat conductivity coefficient, good in stability and the like.

Description

technical field [0001] The invention relates to the technical field of organic phase-change materials, in particular to a flexible heat-conducting phase-change gel material and its preparation method and application. Background technique [0002] Organic phase change material is an ideal thermal management material, which has the ability to store and release a large amount of heat, can maintain a relatively constant temperature during the phase change process, has good chemical stability and cycle stability, low corrosion, phase The high enthalpy value makes it a medium suitable for heat storage and temperature control in the field of thermal management of electronic devices, and has broad application prospects in the thermal management of 5G electronic devices. But its thermal conductivity is low (generally 0.1-0.5Wm -1 K -1 ) and easy leakage have been the two bottlenecks restricting its development. In practical applications, due to the unevenness of the heating parts ...

Claims

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Application Information

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IPC IPC(8): C09K5/06H05K7/20
CPCC09K5/063H05K7/20381
Inventor 林鹏程邹丽清盛鑫鑫陈颖
Owner GUANGDONG UNIV OF TECH
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