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Polymer-based high-thermal-conductivity material and preparation process thereof

A preparation process and high thermal conductivity technology, applied in the direction of heat exchange materials, circuit substrate materials, circuit heat devices, etc., can solve the problem that the thermal conductivity cannot be further improved, achieve good regularity, improve thermal conductivity, and save costs Effect

Active Publication Date: 2021-11-19
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to solve the problem that the thermal conductivity of traditional polymer-based thermally conductive materials cannot be further improved only through the dispersion of thermally conductive fillers in the polymer matrix

Method used

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  • Polymer-based high-thermal-conductivity material and preparation process thereof
  • Polymer-based high-thermal-conductivity material and preparation process thereof
  • Polymer-based high-thermal-conductivity material and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] A preparation process for a polymer-based high thermal conductivity material, comprising the steps of:

[0061] (1) In terms of parts by volume, take 10 parts of thermally conductive filler (boron nitride, BN) and 90 parts of pore-forming agent (select urea), mix the thermally conductive filler and pore-forming agent evenly to obtain a mixture, and then place In the mold, compression molding (pressure 200MPa, time 5 minutes), heating up for heat treatment (temperature 140°C, time 2 hours) to obtain a thermally conductive skeleton;

[0062] (2) According to the number of parts by mass, take 75 parts of resin (select epoxy resin 5015) and 25 parts of curing agent (select epoxy resin curing agent 5015), mix the resin and curing agent evenly (stir and mix evenly, and the stirring time is 5 minutes), obtain mixed solution (epoxy resin prepolymer);

[0063] (3) Soak the heat-conducting skeleton described in step (1) in the mixed liquid described in step (2) in the container,...

Embodiment 2

[0065] A preparation process for a polymer-based high thermal conductivity material, comprising the steps of:

[0066] (1) In terms of parts by volume, take 20 parts of thermally conductive filler (boron nitride, BN) and 80 parts of pore-forming agent (select urea), mix the thermally conductive filler and pore-forming agent evenly to obtain a mixture, and then place In the mold, compression molding (pressure 200MPa, time 5 minutes), heating up for heat treatment (temperature 140°C, time 2 hours) to obtain a thermally conductive skeleton;

[0067] (2) According to the number of parts by mass, take 75 parts of resin (select epoxy resin 5015) and 25 parts of curing agent (select epoxy resin curing agent 5015), stir and mix the resin and curing agent evenly, and the stirring time is 5 minutes. Obtain mixed solution (epoxy resin prepolymer);

[0068] (3) Soak the heat-conducting skeleton described in step (1) in the mixed liquid described in step (2) in the container, the volume r...

Embodiment 3

[0070] A preparation process for a polymer-based high thermal conductivity material, comprising the steps of:

[0071] (1) In terms of parts by volume, take 30 parts of thermally conductive filler (boron nitride, BN) and 70 parts of pore-forming agent (select urea), mix the thermally conductive filler and pore-forming agent evenly to obtain a mixture, and then place In the mold, compression molding (pressure 200MPa, time 5 minutes), heating up for heat treatment (temperature 140°C, time 2 hours) to obtain a thermally conductive skeleton;

[0072] (2) According to the number of parts by mass, take 75 parts of resin (select epoxy resin 5015) and 25 parts of curing agent (select epoxy resin curing agent 5015), stir and mix the resin and curing agent evenly, and the stirring time is 5 minutes. Obtain mixed solution (epoxy resin prepolymer);

[0073] (3) Soak the heat-conducting skeleton described in step (1) in the mixed liquid described in step (2) in the container, the volume r...

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Abstract

The invention discloses a polymer-based high-thermal-conductivity material and a preparation process thereof. The process comprises the following steps: uniformly mixing a heat-conducting filler and a pore-forming agent to obtain a mixture, placing the mixture in a mold, carrying out compression molding, and heating to carry out heating treatment to obtain a heat-conducting framework; uniformly mixing a resin and a curing agent to obtain a mixed solution; and soaking the heat-conducting framework in the mixed solution in a container, vacuumizing the container, and standing for curing treatment to obtain the polymer-based high-heat-conductivity material. According to the invention, the heat-conducting filler mixed with the pore-forming agent is compacted by a compression molding method and then is heated to a temperature above the melting point of the pore-forming agent, the pore-forming agent is changed into a molten state, the liquid-state pore-forming agent flows to form pores while the heat-conducting filler is enhanced in the flowing process, so that a firm porous heat-conducting frameworkis formed, and low-viscosity liquid resin is poured and cured to form the insulating heat-conducting material; and the preparation process provided by the invention has low requirements on the particle size and shape of the heat-conducting filler, and the cost is saved.

Description

technical field [0001] The invention belongs to the technical field of chemical materials, and in particular relates to a polymer-based high thermal conductivity material and a preparation process thereof. Background technique [0002] The rise of the fifth-generation mobile network and the higher power density in electronic equipment have increased the heat dissipation requirements. If there is no sufficient thermal management guarantee, it is easy to cause premature aging or damage of related components. Microelectronics and wireless communication systems urgently need polymer composite materials with excellent thermal conductivity, low dielectric constant and low dielectric loss. [0003] With the rapid development of 5G communications, highly integrated chips, artificial intelligence, etc., the power density and heat production of electronic devices have increased significantly. If there is no sufficient thermal management guarantee, it will easily lead to premature agin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/38C08K7/24C08K3/22C08K3/34C08K7/26C09K5/14H05K1/02H05K1/03
CPCC08K3/38C08K7/24C08K3/22C08K3/34C08K7/26C09K5/14H05K1/0353H05K1/0201C08K2003/385C08K2003/2227C08L63/00
Inventor 曹贤武魏善智
Owner SOUTH CHINA UNIV OF TECH
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