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Polycrystalline silicon material

A polysilicon and polysilicon block technology, which is applied in the growth of polycrystalline materials, silicon, silicon compounds, etc., can solve problems such as the influence of the resistivity of single crystal silicon

Pending Publication Date: 2021-11-26
TOKUYAMA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the surface doping elements of the polysilicon raw material affect the resistivity of the single crystal silicon

Method used

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  • Polycrystalline silicon material
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0160] The polysilicon raw material is produced by the Siemens method. As raw material gas, purified trichlorosilane and hydrogen with high purity were used.

[0161] As the purified trichlorosilane, what was produced by the method shown below was used. First, low-purity crude trichlorosilane is obtained by reacting metallurgical-grade low-purity silicon called metal silicon with hydrogen chloride, and metal silicon with tetrachlorosilane and hydrogen.

[0162] In the metal silicon as the raw material of crude trichlorosilane, B, Al, P, and As are mixed in the ratio of hundreds of ppb to several hundreds of ppm, respectively, in the reaction of metal silicon and hydrogen chloride, and metal silicon and tetrachlorosilane and hydrogen During the reaction, each dopant component is also chlorinated and mixed into the crude trichlorosilane.

[0163] Therefore, the obtained crude trichlorosilane was purified by distillation, and B, P, Al and As in the crude trichlorosilane were se...

Embodiment 2

[0208]Synthesis, distillation purification, recovery purification, and precipitation of polycrystalline silicon were performed in the same manner as in Example 1. The concentration of dichlorosilane in the recovered and purified trichlorosilane at this time was measured by gas chromatography and found to be 900 ppmw.

[0209] The polycrystalline silicon obtained after the precipitation was analyzed by the same method as in Example 1. The average resistivity was 1700 [Ωcm]. The main B concentration is 2 [ppta], and the main Al concentration is less than 1 [ppta] which is the lower limit of quantification. The bulk Al concentration is assumed to be 0 [ppta], and the bulk acceptor concentration is assumed to be 2 [ppta]. The main P concentration is 51 [ppta], and the main As concentration is 3 [ppta]. Therefore, the bulk donor concentration is 54 [ppta].

[0210] Next, in the same manner as in Example 1, the obtained polycrystalline silicon rods were crushed, sorted into grai...

Embodiment 3

[0225] Synthesis, distillation purification, recovery purification, and precipitation of polycrystalline silicon were performed in the same manner as in Example 1. The concentration of dichlorosilane in the recovered and purified trichlorosilane at this time was measured by gas chromatography and found to be 200 ppmw.

[0226] The polycrystalline silicon obtained after the precipitation was analyzed by the same method as in Example 1. The average resistivity was 8300 [Ωcm]. The main B concentration is 2 [ppta], and the main Al concentration is less than 1 [ppta] which is the lower limit of quantification. The bulk Al concentration is assumed to be 0 [ppta], and the bulk acceptor concentration is assumed to be 2 [ppta]. The main P concentration is 11 [ppta], and the main As concentration is 2 [ppta]. Therefore, the host donor concentration is 13 [ppta].

[0227] Next, in the same manner as in Example 1, the obtained polycrystalline silicon rods were crushed, sorted into gra...

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Abstract

This polycrystalline silicon material is for producing monocrystalline silicon and includes multiple polycrystalline silicon ingots, and is characterized in that, when the total concentration of donor elements present in a bulk of the polycrystalline silicon material is defined as Cd1 [ppta], the total concentration of acceptor elements present in the bulk of the polycrystalline silicon material is defined as Ca1 [ppta], the total concentration of donor elements present in the surface of the polycrystalline silicon material is defined as Cd2 [ppta], and the total concentration of acceptor elements present in the surface of the polycrystalline silicon material is defined as Ca2 [ppta], Cd1, Ca1, Cd2, and Ca2 satisfy the relation as follows: 5 [ppta] <= (Ca1+Ca2)-(Cd1+Cd2) <= 26 [ppta].

Description

technical field [0001] The present invention relates to polysilicon raw materials. In particular, the present invention relates to polycrystalline silicon feedstock for the manufacture of single crystal silicon with high resistivity. Background technique [0002] Monocrystalline silicon is an extremely important material in industry, and is used as a substrate for various components such as semiconductor wafers, solar cells, high-frequency devices, and sensors. In the case of a substrate used for various elements, the substrate is required to be a single crystal silicon having high resistivity in order to suppress the movement of electric charges in the substrate. For example, as described in Patent Document 1, a substrate having a resistivity of about several thousand Ωcm is required. [0003] Single crystal silicon is obtained as a single crystal silicon ingot by bringing a seed crystal into contact with a silicon melt obtained by melting a polycrystalline silicon raw ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B29/06C30B15/00
CPCC01B33/02C01B33/035C01B33/037C30B29/06C30B15/04C30B15/20C30B15/00C30B30/00
Inventor 浅野卓也佐伯幸一惠本美树小野田透
Owner TOKUYAMA CORP