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Lead frame, lead frame single-side brown oxidation process and semiconductor packaging body

A technology of brown oxidation and lead frame, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of affecting the integrity of semiconductor packages, high-pressure water washing or polishing processes, and increasing packaging costs, etc. problems, to achieve the effect of improving resource utilization, cleaning difficulty is small, and increasing binding force

Pending Publication Date: 2021-12-07
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, the brown oxidation is carried out on the whole substrate. The brown oxidation step is placed after the etching process and the silver plating process, which is easy to form brown powder and pollute the silver surface; and a brown oxide layer will appear on both sides of the product. During the injection molding process of the QFN package, it is inevitable that the molding compound overflows. After the molding compound is closely combined with the brown oxide layer on the back of the lead frame, it is difficult to remove it by ordinary cleaning processes, and additional high-pressure water washing or polishing processes are required. , which will not only affect the integrity of the semiconductor package, but also increase the packaging cost

Method used

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  • Lead frame, lead frame single-side brown oxidation process and semiconductor packaging body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A lead frame such as figure 1 As shown, a layer of brown oxide layer 2 is provided on the upper surface of the substrate 1, and the electroplated surface of the bonding area of ​​the substrate 1 is on the brown oxide layer 2, and in the bonding area from top to bottom are electroplated layer 3, brown oxide layer Layer 2 and Substrate 1.

[0035] In some examples, the size of the lead frame is 5*5mm.

Embodiment 2

[0037] Provide lead frame single-sided brown oxidation process, provide roll-type base material, the base material is made of copper alloy with pure copper accounting for more than 97%, including the following steps:

[0038] S1. Cleaning, also known as pre-cleaning. The cleaning step includes degreasing and drying processes. The temperature of degreasing is 55°C, the positive and negative difference of temperature is within 5°C, and the pressure of degreasing spray is 5-25psi, preferably 15psi , after the degreasing is completed, the substrate is dried;

[0039] S2, single-sided brown oxidation, undertake the substrate after cleaning in the previous step, firstly paste dry film on the back of the target brown oxidation surface on the substrate, the dry film adopts electroplating dry film, and the surface of the dry film retains PET Film, the back of the target brown oxidized surface is used as the back of the lead frame, the target brown oxidized surface on the substrate is u...

Embodiment 3

[0050] In the cleaning process of step S1 in this embodiment, degreasing refers to using alkali to clean the anti-oxidation oil layer on the copper surface to prevent its oxidation, and at the same time remove oxides and foreign matter on the substrate to protect the subsequent dry film application process from The deformation of foreign matter affects the quality of brown oxidation; the difference from Example 1 is that after alkali cleaning, the base material is slightly etched with acid to produce a rough surface on the base material, ensuring that the subsequent dry film will be more bonded to the copper surface. Tight, no peeling phenomenon.

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Abstract

The invention discloses a lead frame, and belongs to the field of integrated circuit packaging. The lead frame comprises a base material with a brown oxide layer on a single side surface, and an electroplated layer is arranged on the base material and is positioned on the surface of the brown oxide layer. The invention also provides a lead frame single-side brown oxidation process and a semiconductor packaging body for packaging a lead frame finished product. In the lead frame single-side brown oxidation process, brown oxidation is carried out before an electroplating procedure and an etching procedure, the single-side brown oxidation treatment is directly carried out on a copper raw material, and a treated brown oxidation layer is located on a bonding surface between silver and copper, so that the deposited silver is good in consistency and uniform in particle.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, more specifically, to a lead frame, a brown oxidation process on one side of the lead frame and a semiconductor package. Background technique [0002] Brown oxidation is a chemical method to form metal-organic compounds on the surface of metal copper and form a uniform surface roughness on the eroded surface, thereby improving the material locking effect of the plastic package and the lead frame. Taking a 5*5 mm lead frame as an example, it needs Reach the MSL1 level. In the existing technology, the brown oxidation is carried out on the whole substrate. The brown oxidation step is placed after the etching process and the silver plating process, which is easy to form brown powder and pollute the silver surface; and a brown oxide layer will appear on both sides of the product. During the injection molding process of the QFN package, it is inevitable that the molding compound o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48
CPCH01L23/49579H01L23/49582H01L23/49586H01L23/49548H01L21/4821H01L2224/83192H01L2224/32245
Inventor 黎超丰冯小龙章新立林杰林渊杰林海见罗壮
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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