Method for preparing ceramic circuit board through low-temperature sintering

A ceramic circuit board, low-temperature sintering technology, used in printed circuits, printed circuit manufacturing, printed circuit secondary treatment, etc. problems, to avoid dimensional deformation, reduce sintering temperature, and save energy

Pending Publication Date: 2021-12-14
HUAZHONG UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the speed of electroplating deposited copper layer is slow and the thickness is limited, the bonding strength between copper and substrate is low, and the pollution of electroplating waste solution is relatively large.

Method used

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  • Method for preparing ceramic circuit board through low-temperature sintering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] S1 selects nano-silver particles with an average particle size of 5nm, and adds 2 μm titanium particles as active metals to the silver particles, and titanium accounts for 4wt% of the total mass; add terpineol, chlorosalicylic acid and stearic acid as organic Solvent, after stirring and defoaming treatment, nano-metal active solder paste is obtained, wherein the mass of metal particles in the solder paste accounts for 65wt%;

[0042] S2 Coating an active solder paste layer on the surface of the ceramic substrate by screen printing, the thickness of the solder paste layer is 80 μm;

[0043]S3 covers the active solder paste layer with a copper foil with a thickness of 0.2mm, and sinters at a low temperature in a vacuum furnace. To remove the organic solvent in the solder paste; then raise the temperature to 230°C at a heating rate of 10°C / min, and keep it for 20 minutes; finally cool with the furnace to obtain a single-sided or double-sided ceramic copper-clad laminate; ...

Embodiment 2

[0046] S1 selects nano-copper particles with an average particle size of 10nm, and adds 1 μm of titanium, cerium, and gallium particles as active metals to the copper particles, and the active metals account for 8wt% of the total mass; add terpineol, ethyl cellulose, and chlorine Substituting salicylic acid and stearic acid as organic solvents, stirring and defoaming to obtain nano-metal active solder paste, wherein the mass of metal particles in the solder paste accounts for 75wt%;

[0047] S2 Coating an active solder paste layer on the surface of the ceramic substrate by screen printing, the thickness of the solder paste layer is 150 μm;

[0048] S3 covers the active solder paste layer with a copper foil with a thickness of 0.3mm, and sinters at a low temperature in a protective atmosphere. The temperature curve is: at a heating rate of 5°C / min, increase from room temperature to 200°C, and keep it for 20 minutes. To remove the organic solvent in the solder paste; then raise ...

Embodiment 3

[0051] S1 selects nano-copper and nano-silver mixed particles with an average particle size of 20nm, in which the ratio of copper to silver is 1:1, and 3 μm titanium and cerium particles are added to the alloy particles as active metals, and titanium and cerium account for 5wt% of the total mass Adding terpineol, ethylene glycol and ethyl cellulose as organic solvents, stirring and defoaming to obtain nano-metal active solder paste, wherein the mass of metal particles in the solder paste accounts for 70wt%;

[0052] S2 Coating an active solder paste layer on the surface of the ceramic substrate by screen printing, the thickness of the solder paste layer is 100 μm;

[0053] S3 covers the active solder paste layer with a copper foil with a thickness of 0.5mm, and performs low-temperature sintering under the condition of ultrasonic assistance. , to remove the organic solvent in the solder paste; then raise the temperature to 250°C at a heating rate of 15°C / min, and keep it warm f...

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Abstract

The invention discloses a method for preparing a ceramic circuit board through low-temperature sintering, and the method comprises the steps: firstly adding active metal particles into nano metal particles, adding an organic solvent, and carrying out the stirring and defoaming treatment to obtain nano metal active soldering paste; coating the surface of the ceramic substrate with active soldering paste through silk-screen printing; covering copper foil on the active soldering paste layer, and carrying out the sintering at low temperature (less than 300 DEG C) to obtain the ceramic copper-clad plate; and finally, forming a pattern on the copper layer through photoetching, developing and etching processes to obtain a single-sided or double-sided ceramic circuit board. The copper foil and the ceramic substrate can be directly bonded by using the active metal element, and the nano metal particles are adopted to reduce the sintering temperature, so that the high-strength ceramic copper-clad plate is obtained. Compared with an existing preparation method of a thick film printing ceramic substrate (TPC), a direct bonding copper-ceramic substrate (DBC) and an active metal welding ceramic substrate (AMB), the preparation method is simple in process and low in sintering temperature, and meets the packaging and heat dissipation requirements of power devices.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing, and more specifically relates to a method for preparing a ceramic circuit board by low-temperature sintering. Background technique [0002] With the development of technology and the continuous extension of application requirements, the third-generation semiconductor materials represented by SiC and GaN have been widely used in aerospace, weaponry, automotive electronics and other fields due to their excellent physical properties. These high-power devices such as light-emitting diodes (LEDs), insulated-gate bipolar transistors (IGBTs), and lasers (LDs) have been in harsh environments such as high temperature, high humidity, and large temperature changes for a long time. Therefore, the selection of heat dissipation materials is a key technical issue. Affect the performance and life of the device. [0003] In electronic packaging, the heat dissipation substrate conducts heat away ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/00C04B37/02
CPCH05K3/38H05K3/00C04B37/02C04B2237/125C04B2237/124C04B2237/12C04B2237/122C04B2237/407C04B2237/408C04B2237/403C04B2237/40
Inventor 陈明祥刘佳欣刘松坡黄卫军
Owner HUAZHONG UNIV OF SCI & TECH
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