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Submicron spherical silica powder as well as preparation method and application thereof

A spherical silicon, sub-micron technology, applied in chemical instruments and methods, silicon compounds, inorganic chemistry, etc., to achieve the effect of uniform particle size, uniform distribution, and low particle size

Active Publication Date: 2021-12-17
江苏海格新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the rapid development of the global electronic information industry and the continuous improvement of 4G, 5G and other technologies, higher technical requirements have been put forward for electronic products, such as light, thin and small, chip packaging performance and chip carrier boards. Spherical silicon micropowder is also moving towards Development in the direction of small particle size and excellent performance, micron-sized spherical silica powder can no longer meet the existing requirements

Method used

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  • Submicron spherical silica powder as well as preparation method and application thereof
  • Submicron spherical silica powder as well as preparation method and application thereof
  • Submicron spherical silica powder as well as preparation method and application thereof

Examples

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preparation example Construction

[0030] It should be noted that a method for preparing submicron spherical silicon powder includes:

[0031] (1) In parts by weight, add 5-15 parts of organic solvent, 0.003-0.01 part of dispersant and 0.008-0.025 part of surfactant into the reactor, stir until uniform at a stirring rate of 1000-1500rpm, and then slowly Add 1.2-1.8 parts of water glass, continue to stir for 15-25 minutes, and then dropwise add ammonium salt solution, wherein the weight ratio of ammonium salt to water glass is 1.2-1.5:1, and adjust the pH value of the system to 8.2-10 to obtain a reaction solution ;

[0032] (2) Slowly add acid dropwise in the reaction solution, wherein the concentration of acid is 5-10%, the volume ratio of acid and water glass is 1:2.5-4.5, continue to stir at a stirring rate of 1000-1500rpm for 20-30min, After stirring, stand still and filter to obtain precipitate;

[0033] (3) Repeatedly wash the precipitate with distilled water for 3-5 times, filter with suction, make the...

Embodiment 1

[0039] A preparation method of submicron spherical silicon powder, comprising:

[0040] (1) In parts by weight, add 10 parts of n-butanol, 0.005 parts of sodium lauryl sulfate and 0.01 part of polyethylene glycol derivatives into the reactor, stir until uniform at a stirring rate of 1000 rpm, and then slowly Add 1.35 parts of water glass, continue to stir for 20 minutes, and then add ammonium sulfate solution dropwise, wherein the weight ratio of ammonium sulfate to water glass is 1.2:1, and adjust the pH value of the system to 9.5 to obtain a reaction solution;

[0041] (2) Slowly add sulfuric acid dropwise in the reaction solution, wherein the concentration of sulfuric acid is 5%, the volume ratio of sulfuric acid and water glass is 1:3.5, continue stirring at a stirring speed of 1000rpm for 30min, after stirring, leave standstill and filter , get the precipitate;

[0042] (3) Repeatedly wash the precipitate 3 times with distilled water, filter with suction, make the pH val...

Embodiment 2

[0044] A kind of preparation method of submicron spherical silicon powder is different from Example 1: in step (1), 15 parts of diesel oil, 0.008 part of sodium lauryl sulfate and 0.015 part of polyethylene glycol derivatives are added to the reaction In the container, stir at a stirring rate of 1500rpm until uniform, then slowly add 1.75 parts of water glass, continue to stir for 25min, then add ammonium sulfate solution dropwise, wherein the weight ratio of ammonium sulfate to water glass is 1.2:1, and adjust the pH of the system The value was 10.0, and a reaction liquid was obtained.

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Abstract

The invention discloses submicron spherical silica powder as well as a preparation method and application thereof, and belongs to the technical field of inorganic nonmetal functional materials. The preparation method comprises the steps: (1) adding an organic solvent, a dispersing agent and a surfactant into a reactor, uniformly stirring, slowly adding water glass, continuously stirring, dropwise adding an ammonium salt solution, and adjusting the pH value of the system to obtain a reaction solution; (2) slowly dropwise adding acid into the reaction solution, continuously stirring, standing after stirring is finished, and filtering to obtain a precipitate; and (3) washing the precipitate with distilled water, carrying out suction filtration, drying, and sintering the dried product in a combustion furnace to obtain the submicron spherical silica powder, wherein the surfactant comprises a polyethylene glycol derivative, and the polyethylene glycol derivative is formed by modifying polyethylene glycol with 1-caffeoylquinic acid. The prepared submicron spherical silica powder is uniform in particle size, uniform in distribution, relatively high in spheroidization rate, sphericity degree and density and relatively low in particle size.

Description

technical field [0001] The invention belongs to the technical field of inorganic non-metallic functional materials, and in particular relates to a submicron spherical silicon powder, a preparation method and an application thereof. Background technique [0002] Submicron spherical silica powder (spherical silica powder for short) is a key material in large-scale integrated circuit packaging and IC substrate industries, such as epoxy molding compounds and liquid packaging materials for chip packaging and high-performance substrates, in aviation and aerospace There are many applications in high-tech fields such as automotive, Internet of Things and special ceramics. With the rapid development of the global electronic information industry and the continuous improvement of 4G, 5G and other technologies, higher technical requirements have been put forward for electronic products, such as light, thin and small, chip packaging performance and chip carrier boards. Spherical silicon ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/187C08G65/332
CPCC01B33/187C08G65/3326C01P2004/32C01P2004/62C01P2004/61C01P2006/10C08G2650/04
Inventor 钮亚桥
Owner 江苏海格新材料有限公司
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