Mercaptobenzene functionalized graphene/copper composite heat-conducting coating and preparation method

Abstract

The invention relates to a mercaptobenzene functionalized graphene / copper composite heat-conducting coating and a preparation method. The synthesis general formula is TP-Gr-Cu, functionalized graphene TP-Gr and nano-copper are chemically connected through a mercaptobenzene molecular junction, sulfur atoms in the mercaptobenzene molecular junction and the nano-copper form a strong S-Cu covalent bond through electron tunneling, and an electron tunneling heat conduction path is constructed so that electrons can be freely conducted. The preparation method comprises the following steps of firstly, preparing the mercaptobenzene functionalized graphene, and then preparing the mercaptobenzene functionalized graphene / copper composite heat-conducting coating on a metal copper substrate through a pulse electrochemical co-deposition method. A novel graphene / metal composite heat conduction coating electron tunneling heat conduction path is constructed, chemical connection of graphene and nano-copper through mercaptobenzene molecular junctions is successfully established, the deposited mercaptobenzene functionalized graphene is compactly attached to the copper substrate, and the function of radiation heat dissipation of a molecular fan is achieved. A graphene / copper composite material has high heat conductivity coefficient and high heat conductivity; and compared with a composite material in which pi electrons participate in heat transfer, the heat-conducting coefficient is higher.

Description

technical field [0001] The invention relates to a composite thermally conductive material, in particular to a mercaptobenzene functionalized graphene / copper composite thermally conductive coating, and at the same time relates to a preparation method of the composite thermally conductive coating. Background technique [0002] The rapid development of modern electronic technology, the miniaturization and densification trend of electronic devices, and the high integration inside the equipment increase the heat generated by electronic devices. Much of the heat generated by these devices cannot be effectively dissipated, causing the device to heat up. When the system temperature reaches a certain value, the electronic components will overheat, and the equipment will become unstable and malfunction. Therefore, it is very challenging to improve the heat dissipation performance of electronic components while the power density increases with the decrease of device module size. [0...

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Problems solved by technology

So far, there is no report on the use of mercaptobenzene molecular junctions to chemically connect graphene and copper nanoparticles to prepare composite coating materials with high thermal conductivity and as a molecular fan coating for heat dissipation

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