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MEMS structure

A backplane, piezoelectric composite technology, applied in the field of MEMS structure, can solve the problems of restricting development, no considerable improvement, low sensitivity of piezoelectric MEMS microphone, etc., to achieve high sensitivity and improve the effect of output electric energy

Pending Publication Date: 2022-02-08
ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, capacitive MEMS microphones seem to have reached a performance bottleneck, and there has been no considerable improvement in recent years; while piezoelectric MEMS microphones have low sensitivity, which restricts their development

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0028] Substrate 10 comprises silicon or any suitable silicon-based compound or derivative (e.g. silicon wafer, SOI, SiO 2 / polysilicon on Si). A passivation layer 11 is formed on the substrate 10, and the material of the passivation layer 11 includes silicon dioxide and silicon nitride. A backplane 13 is formed over the passivation layer 11 . The first spacer layer 12 is formed on the passivation layer 11 and separated from the backplane 13 , and the material of the first spacer layer 12 includes silicon dioxide or PSG (phospho-silicate Glass, ie phospho-silicate glass).

[0029] The vibration support layer 15 is formed above the first spacer layer 12 and is suspended above the cavity 14 . The material of vibration supporting layer 15 comprises silicon nitride (Si 3 N 4 ), silicon oxide, single crystal silicon, polycrystalline silicon single-layer or multi-layer composite film structure or other suitable supporting materials. The first electrode layer 16 is formed over t...

Embodiment 2

[0034] It is worth noting that the same components use the same symbols in Embodiment 2 and Embodiment 1, and the materials used are also basically the same, which will not be repeated here.

[0035] see image 3 and Figure 4 , the MEMS structure includes a barrier layer 21 formed over the substrate 10 . The material of the barrier layer 21 includes thermally oxidized silicon dioxide.

[0036] The MEMS structure also includes a vibration support layer 15 , a first electrode layer 16 , a piezoelectric layer 17 and a second electrode layer 18 sequentially formed over the barrier layer 21 .

[0037] The second spacer layer 24 is formed over the barrier layer 21 and spaced apart from the first electrode layer 16 . The material of the second spacer layer 24 may be the same as that of the first spacer layer 12 . The back plate 13 is formed over the second spacer layer 24 .

[0038] It can be known from the above description that the piezoelectric composite vibration layer is f...

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Abstract

The invention discloses an MEMS structure, and the structure comprises a back plate and a piezoelectric composite vibration layer which are separated by a cavity; the back plate and the piezoelectric composite vibration layer form a capacitor structure, and the piezoelectric composite vibration layer comprises a vibration supporting layer, a first electrode layer, a piezoelectric layer and a second electrode layer which are stacked in sequence. The MEMS structure combines the characteristics of a piezoelectric MEMS microphone and a capacitive MEMS microphone, and obtains more converted electric energy under the condition of receiving equal sound energy, so the output electric energy is improved, and higher sensitivity is obtained.

Description

technical field [0001] The present application relates to the technical field of acoustic-electric conversion devices, and in particular, relates to a MEMS (short for Micro-Electro-Mechanical System, micro-electro-mechanical system) structure. Background technique [0002] MEMS microphones (that is, microphones) mainly include two types: capacitive and piezoelectric. The MEMS condenser microphone forms a plate capacitor through the diaphragm and the back plate. The diaphragm vibrates under the action of sound waves, resulting in a change in the distance between the diaphragm and the back plate, resulting in a change in the capacitance of the plate capacitor, thereby converting the sound wave signal into an electric current. Signal. MEMS piezoelectric microphone is a microphone prepared by microelectromechanical system technology and piezoelectric thin film technology. Due to the use of semiconductor planar technology and bulk silicon processing technology, it has small size...

Claims

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Application Information

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IPC IPC(8): B81B3/00B81B7/02H04R19/04
CPCB81B3/0021B81B7/02H04R19/04B81B2201/0257
Inventor 夏永禄刘端
Owner ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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