Interplanar high-thermal-conductivity composite material and preparation method thereof

A composite material and high thermal conductivity filler technology, which is applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of destroying the array orientation structure, unable to achieve full infiltration of fillers, etc., and achieve the effect of high thermal conductivity and low cost.

Active Publication Date: 2022-02-11
RES & DEV INST OF NORTHWESTERN POLYTECHNICAL UNIV IN SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This "orientation first-recombination later" method may not be able to achieve sufficient infiltration of the filler, and the viscous polymer may destroy the alignment structure of the array during the infiltration process

Method used

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  • Interplanar high-thermal-conductivity composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1-4

[0031] (1) Six-water chloride, terephthalic acid, dimethylformamide, vinylsilane, carbon fiber, press 1 mmol: 1 mmol: 10 ml: 0.01 g: 1 g, stirred thoroughly until completely mixed Uniform;

[0032] (2) Transfer the mixture obtained in step (1) to the hydrothermal reaction kettle, reacting 5 h at 125 ° C, filtered, washed, dried, and obtained carbon fibers modified by metal organic frame after drying;

[0033] (3) The carbon fibers obtained in step (2) were calcined at 500 ° C under an inert gas protection for 2 h to obtain magnetic carbon fibers.

[0034] (4) Liquid silicone rubber with a certain amount of magnetic carbon fiber with a viscosity of 300 mPa · s (with methyl vinyl hydrogen: hydrogen-containing silicone oil: platinum catalyst: inhibitor = 100: 10: 1: 0.015 The mixture is mixed than silicon hydrocarbon hydroformation, pouring into the polytetrafluoride mold, and then transferred in a parallel magnetic field having a magnetic field intensity of 3 t, and the magnetic fie...

Embodiment 5

[0037] (1) Six water-chloride, terephthalic acid, dimethylformamide, silane coupling agent, carbon fiber according to 1 mmol: 1 mmol: 10 ml: 0.01 g: 1 g, and stir well until complete The mixing is uniform; wherein the silane coupling agent is composed of a percentage 3: 7 of the aminosilane and the methacryloxysilane.

[0038] (2) Transfer the mixture obtained in step (1) to a hydrothermal reaction kettle, reacted at 100 ° C 10 h, filtered, washed, dried, and obtained carbon fibers modified by metal organic frame after drying.

[0039] (3) The carbon fibers obtained in step (2) are calcined at 1000 ° C under the protection of inert gas to obtain magnetic carbon fibers.

[0040] (4) Liquid silicone rubber (methylvinyl silicone: hydrogen-containing silicone oil) with 30% by weight of magnetic carbon fiber (methylvinyl hydrogen: hydrogen-containing silicone oil: platinum catalyst: inhibitor = 100: 50: 5: 0.005 Will mix evenly, poured into the polytetrafluoride mold, and then transfer...

example 6-9

[0042] (1) Nickel sulfate, 2-methylimidazole, dimethylacetamide, amino silane, and hexagonal boron, boron, boron, boron, 1 mmol: 1 mmol: 20 ml: 0.005 g: 1 g, and stirred with stirring until complete well mixed;

[0043] (2) Transfer the resulting mixture from step (1) to the hydrothermal reaction kettle, at 150 ° C for 10 h, filtered, washed, dried, and obtained hexagonal boron tanks modified by metal organic frame after drying.

[0044] (3) The hexagonal boron obtained in step (2) is calcined with 800 ° C under an inert gas protection for 3 h, and magnetic hexagonal boron is obtained.

[0045] (4) Liquid silicone rubber (methylvinyl silicone: hydrogen-containing silicone oil) with a certain amount of magnetic hexagonal boron and viscosity is 500 mPa · s: Platinum catalyst: inhibitor = 100: 15: 4: 0.05 Number matching reactive reactive reactions) mixed uniform, poured into the polytetrafluoride mold, and then transferred into a parallel magnetic field of 5 t in the magnetic field ...

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Abstract

The invention discloses an interplanar high-thermal-conductivity composite material and a preparation method thereof. The composite material comprises 70-95 wt% of a silicone rubber matrix and 5-30 wt% of a thermal conductive filler. Firstly, a metal organic frame grows on the surface of the thermal conductive filler in situ, then a shell of the metal organic frame is converted into magnetic metal and metal oxide through calcination, and the filler obtains magnetism; and then, the magnetic thermal conductive filler and the liquid silicone rubber are uniformly mixed, the mixture is poured into a mold to be defoamed and then subjected to magnetic field orientation and curing treatment, the magnetic thermal conductive filler is directionally arranged along a magnetic field, the composite material is endowed with excellent inter-plane heat-conducting capacity, and the heat conductivity can reach 25.5 W/(mK) in the thickness direction. The invention provides a set of complete preparation process of the filler magnetization and oriented heat conduction composite material, and the process is low in operation difficulty, good in performance, low in cost and easy to prepare in a large scale, and is expected to be applied to the field of high-end heat management.

Description

Technical field [0001] The present invention relates to a high thermal conductivity composite material and a preparation method thereof, and is specifically a method for preparing a composite silica gasket available in the field of high-end heat management. This patent belongs to the field of high performance thermally conductive composite materials. Background technique [0002] With the arrival of the 5G era and the innovation of electronic technology, electronic equipment and circuits continue to develop in small-sized integration, circuits can accumulate a large amount of calories during operation; it is additionally uneven between the surface of the electronic device and the heat dissipation element. The gap, the actual contact area between them is only about 10%, so the contact thermal resistance is large. If it is not possible to quickly transfer the heat generated to the outside in time, it will seriously affect the stable operation of the equipment, and shorten its servi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/10C08K7/06C08K3/38C08K3/08C08K3/22C09K5/14
CPCC08L83/04C09K5/14C08K2201/01C08K2003/385C08K9/10C08K7/06C08K3/08C08K3/22C08K3/38
Inventor 陈妍慧丁栋梁王喣张诗煜张亮亮刘振国张秋禹
Owner RES & DEV INST OF NORTHWESTERN POLYTECHNICAL UNIV IN SHENZHEN
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