Controllable reduced graphene oxide modified carbon fiber and application thereof
A graphene and carbon fiber technology, applied in the directions of carbon fiber, fiber treatment, electrolytic coatings, etc., can solve the problems of the difference in the improvement effect of graphene oxide on the bonding performance of carbon fiber and resin matrix, etc.
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Embodiment 1
[0044] The preparation of the graphene oxide of embodiment 1 different oxygen contents
[0045] Ultrasonic reduction under alkaline conditions improved the Hummer method (according to the method of Acs Nano, 4 (2010) 4806) synthesized GO, cell crushing 60min, crushing power 500w, ultrasonic on 0.5s off 0.5s, GO / water dispersion The concentration is 0.5mg / ml. An 8 mol / L NaOH solution was prepared, the pH of the dispersion was adjusted, the ultrasonic time was 30 min, and the reaction temperature was 50°C.
[0046] The pH was adjusted to 3.8, 11, 12 and 13 respectively, and 4 samples were prepared, which were denoted as GO 3.8 、GO 11 、GO 12 and GO 13 .
Embodiment 2
[0047] The carbon fiber of embodiment 2 graphene oxide modification
[0048]Using SYT55S as raw material, desizing it with acetone extraction method to remove slurry and impurities. Graphene oxide with different oxygen content was deposited on CF by anodic EPD. During the deposition of negatively charged graphite oxide flakes, a graphite plate (cathode) was placed opposite the CF anode. The pH of the electrolyte of the 250 mg / ml graphene oxide suspension was adjusted to 10 with 0.1 mol / l NaOH solution. The deposition voltage is 20V, and the deposition time is 20min. The graphene oxide-modified carbon fibers prepared from the four GO samples in Example 1 are respectively denoted as CF / GO 3.8 , CF / GO 11 , CF / GO 12 and CF / GO 13 .
Embodiment 3
[0049] Embodiment 3 graphene oxide modified carbon fiber / resin composite material
[0050] CFs with different morphologies of graphene oxide structures were impregnated with epoxy resin to obtain prepregs. Then, after adding the curing agent, put the prepreg into the compression mold according to the control program (80°C@1h and 120°C@2h at 5MPa, 150°C@3h and 180°C@1h at 10MPa) into the compression mold for curing and molding. The CF volume fraction was maintained within the range of 50±1.5%. The curing agent can be 4,4-diaminodiphenylsulfone, 4,4-diaminodiphenylmethane, 3,3'-dichloro-4,4'-diaminobisone commonly used in the prior art Phenylmethane, diethyltoluenediamine, m-phenylenediamine, etc., 4,4-diaminodiphenylmethane is selected as the curing agent in this embodiment.
[0051] In order to further illustrate the technical solution of the present invention, the samples prepared in Examples 1-3 are tested and characterized through experiments below.
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