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Conductive slurry organic carrier and preparation and application thereof

An organic carrier and conductive paste technology, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. It can improve the rheological properties and printing properties, the raw materials are cheap, and the vapor pressure can be changed.

Active Publication Date: 2022-02-15
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: aiming at the deficiencies of the prior art, an organic carrier for conductive paste and its preparation and application are provided, which effectively solves the problems of high sintering temperature, poor volatilization level and volatile product of the existing conductive silver paste. Problems such as toxicity and high resistivity greatly improve the sintered surface quality of the slurry

Method used

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  • Conductive slurry organic carrier and preparation and application thereof
  • Conductive slurry organic carrier and preparation and application thereof
  • Conductive slurry organic carrier and preparation and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] The organic vehicle for the conductive paste of the present embodiment and its preparation and application are carried out as follows:

[0039] (1) Weigh 16g each of n-hexanol, diethylene glycol butyl ether acetate, and terpineol according to the mass ratio of 1:1:1, put them in a beaker and stir on a magnetic stirrer to make a uniform solvent.

[0040] (2) Weigh 3 g of polyvinylpyrrolidone (molecular weight: 1,300,000) and add it to the prepared solvent, place it on a magnetic stirrer and stir for 10 h until the PVP is completely dissolved in the solvent to obtain a viscous transparent liquid.

[0041] (3) Weigh 1g of castor oil and add it to the viscous liquid, place it on a magnetic stirrer until it is evenly stirred to obtain the required conductive paste organic vehicle.

[0042](4) Mix the prepared organic carrier and silver powder according to the mass ratio of 1:2 (the silver powder includes spherical silver powder with an average grain size of 1 μm and flake si...

Embodiment 2

[0045] The preparation method of the novel intermetallic compound based on high-entropy alloy diffusion welding in this embodiment is carried out in the following steps:

[0046] (1) Weigh 24g of n-hexanol and diethylene glycol butyl ether acetate according to the mass ratio of 1:1, put them in a beaker and stir on a magnetic stirrer to make a uniform solvent.

[0047] (2) Weigh 3 g of polyvinylpyrrolidone (molecular weight: 1,300,000) and add it to the prepared solvent, place it on a magnetic stirrer and stir for 10 h until the PVP is completely dissolved in the solvent to obtain a viscous transparent liquid.

[0048] (3) Weigh 1g of castor oil and add it to the viscous liquid, place it on a magnetic stirrer until it is evenly stirred to obtain the required conductive paste organic vehicle.

[0049] (4) Mix the prepared organic carrier and silver powder according to the mass ratio of 1:2 (the silver powder includes spherical silver powder with an average grain size of 1 μm an...

Embodiment 3

[0052] The preparation method of the novel intermetallic compound based on high-entropy alloy diffusion welding in this embodiment is carried out in the following steps:

[0053] (1) Weigh 48g of n-hexanol, place it in a beaker and stir on a magnetic stirrer to make a uniform solvent.

[0054] (2) Weigh 3 g of polyvinylpyrrolidone (molecular weight: 1,300,000) and add it to the prepared solvent, place it on a magnetic stirrer and stir for 10 h until the PVP is completely dissolved in the solvent to obtain a viscous transparent liquid.

[0055] (3) Weigh 1g of castor oil and add it to the viscous liquid, place it on a magnetic stirrer until it is evenly stirred to obtain the required conductive paste organic vehicle.

[0056] (4) Mix the prepared organic carrier and silver powder according to the mass ratio of 1:2. The silver powder includes spherical silver powder with an average grain size of 1 μm and flake silver powder with a size of 1-5 μm and a thickness of 500 nm, and it...

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Abstract

The invention discloses a conductive slurry organic carrier and preparation and application thereof. The invention particularly relates to an organic carrier suitable for low-temperature sintering of conductive silver slurry and preparation and application thereof. One of the better schemes of the organic carrier comprises 5.77% of polyvinylpyrrolidone, 30.77% of n-hexanol (1-Hexanol), 30.77% of diethylene glycol monobutyl ether acetate, 30.77% of terpilenol and 1.92% of castor oil. The problems that existing conductive silver slurry is high in sintering temperature, cracks exist on the volatile surface and the like are solved, and raw materials are low in cost and easy to purchase; the prepared organic carrier is moderate in viscosity, is applied to conductive silver paste, the paste is good in rheological property, good in printing performance and high in resolution ratio, low-temperature sintering can be achieved, the conductivity is high after sintering, the surface is smooth, and necessary conditions are provided for application of high-resolution and high-conductivity solar grid line plates and the like. The invention can be used for preparing high-resolution solar grid line plates and the like.

Description

technical field [0001] The invention relates to an organic carrier of conductive paste and its preparation and application; it belongs to the technical field of composite material preparation. Background technique [0002] The 21st century is an era of rapid development of the electronic information manufacturing industry. Some smart devices, such as smart phones, tablet computers, wearable watches and other electronic products are ubiquitous. The emergence of these devices has driven the development of the information industry and the integrated circuit industry. Promote the research and development of related new materials. As the key conductive functional material of such electronic components, conductive silver paste mainly plays the role of conductive wiring and electrical connection in these electronic components, and its development and application have also attracted widespread attention. [0003] Conductive silver paste is a viscous or paste-like suspension system ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 刘文胜唐思危柳萧伍思远陈柏杉黄宇峰马运柱
Owner CENT SOUTH UNIV