Organopolysiloxane composition with excellent adhesion and reliability and preparation method thereof

A polysiloxane, reliable technology

Pending Publication Date: 2022-02-18
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the one hand, it is generally a linear silicone oil, which cannot provide a good reinforcing effect; on the other hand, the hydrosilylation reaction activity of linear silicone oil is low, and more catalysts are needed to induce rapid positioning and bonding.
In addition, because the Si-H bond is easy to dehydrogenate in an alkaline environment, the synthesis of hydrogen-containing crosslinking agents is usually carried out in an acidic environment, and it is inevitable that more Si-OH will remain in the final product, making The one-component organopolysiloxane composition will gradually dehydrogenate during long-term storage to generate gas and cause bonding hazards

Method used

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  • Organopolysiloxane composition with excellent adhesion and reliability and preparation method thereof
  • Organopolysiloxane composition with excellent adhesion and reliability and preparation method thereof
  • Organopolysiloxane composition with excellent adhesion and reliability and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1 (H(CH 3 ) 2 SiO 1 / 2 ) (SiO 4 / 2 ) 1.5 preparation of

[0028] Add 208.33g of tetramethyldisiloxane (HMMH) and 0.27g of trifluoromethanesulfonic acid into the reaction vessel, heat up to 40°C, add 75g of tetramethyldisiloxane (HMMH), stir and mix well, then heat up to 60°C, then slowly add 15g of water dropwise, after the dropwise addition, set the temperature above 95°C to distill off small molecules with low boiling points until the temperature in the system exceeds 85°C, then stop the reaction. Wash with water until neutral, dry, filter, and vacuum rotary evaporation to remove solvent and small molecular substances, to obtain (H(CH 3 ) 2 SiO 1 / 2 ) (SiO 4 / 2 ) 1.5 .

Embodiment 2

[0029] Example 2 (H(CH 3 ) 2 SiO 1 / 2 )(Me 2 SiO 2 / 2 ) 6 (SiO 4 / 2 ) 1 preparation of

[0030] Add 208.33g tetraethyl orthosilicate (Q) and 2g sulfuric acid into the reaction vessel, raise the temperature to 40°C, and slowly add 1056g Me 2 Si(OOCCH 3 ) 2 , after the dropwise addition was completed, the temperature was raised to 100° C., and the low boiling generated during the reaction was removed. When there is no low-boiling distillation, cool down to below 50°C, add 70g of tetramethyldisiloxane (HMMH), stir and mix well, then raise the temperature to 60°C, then slowly add 26g of water dropwise to it, after the dropwise addition , Raise the temperature of the system to above 110°C to distill off small molecules with low boiling points until the temperature in the system exceeds 85°C, then stop the reaction. Wash with water until neutral, dry, filter, and vacuum rotary evaporation to remove solvent and small molecule substances, to obtain ((H(CH 3 ) 2 SiO 1 / 2 )(Me...

Embodiment 3

[0031] Example 3 (H(CH 3 ) 2 SiO 1 / 2 )(Me 3 SiO 1 / 2 ) (SiO 4 / 2 ) 2 preparation of

[0032] Add 208.33g tetramethyldisiloxane (Q) and 0.4g trifluoromethanesulfonic acid into the reaction vessel, raise the temperature to 45°C, add 75g tetramethyldisiloxane (HMMH) and 81.19g Me 3 SiOSiMe 3 , fully stir and mix evenly, heat up to 60°C, then slowly drop 15g of water into it, after the dropwise addition, set the temperature above 95°C to distill off small molecules with low boiling points, until the temperature in the system exceeds 85°C, stop the reaction . Wash with water until neutral, dry, filter, and vacuum rotary evaporation to remove solvent and small molecular substances, to obtain (H(CH 3 ) 2 SiO 1 / 2 )(Me 3 SiO 1 / 2 ) (SiO 4 / 2 ) 2 .

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Abstract

The invention aims to provide an organopolysiloxane composition with excellent adhesion and reliability and a preparation method thereof, in particular to an organopolysiloxane composition suitable for positioning and adhesion of a semiconductor chip heat dissipation cover plate and a preparation method of the organopolysiloxane composition. According to the invention, the branched hydrogen-containing polysiloxane is used as a cross-linking agent, so that the reaction activity is improved while reinforcement is realized; meanwhile, a self-made capsule type platinum catalyst is adopted, reaction is well inhibited at low temperature, rapid dissociation and release are achieved at high temperature, and rapid cross-linking reaction can be conducted; in addition, by means of an effective pre-reaction treatment mode of the adhesion promoter and organopolysiloxane containing Si-H bonds, excellent adhesion performance and adhesion reliability are provided. Moreover, an effective method for avoiding generation of H2 in the long-term storage process is provided, and the adhesion failure risk in the long-term use process is reduced.

Description

technical field [0001] The invention belongs to the field of structural bonding and sealing, and in particular relates to an organopolysiloxane composition with excellent bonding and reliability and a preparation method thereof. Background technique [0002] Curable organopolysiloxane compositions have been widely used in the semiconductor field due to their low TG point, low modulus, and excellent weather resistance. Good choice for thermal cover positioning bonding. On the one hand, the organopolysiloxane composition is required to have the function of rapid positioning bonding, and at the same time, the organopolysiloxane composition is required to have excellent adhesion to the cover plate and the substrate and excellent adhesion reliability. [0003] The hydrogen-containing crosslinking agent of the traditional curable organopolysiloxane composition usually uses terminal or side hydrogen-containing silicone oil, which can provide a relatively good crosslinking density,...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/08C09J11/06
CPCC09J183/04C09J11/08C09J11/06C08L2203/206C08L83/04C08K5/55C08K5/549
Inventor 姜云王建斌陈田安徐有志谢海华
Owner YANTAI DARBOND TECH
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