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Negative photosensitive resin composition, pattern forming method, hardened coating film forming method, interlayer insulating film, and surface protective film

A photosensitive resin and composition technology, applied in the field of electronic parts, can solve the problems of miniaturization and insufficient study of pattern shape, and achieve the effects of good adhesion, excellent reliability, and excellent drug resistance

Pending Publication Date: 2022-02-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent Document 6 proposes a positive-type photosensitive resin composition obtained by adding a cross-linkable acrylic resin to an alkali-soluble resin having a phenolic hydroxyl group, but studies on miniaturization and pattern shape are insufficient, and there is room for improvement in photosensitive properties
[0010] In Patent Document 7 and Patent Document 8, a positive-type photosensitive resin composition formed of a polymer selected from polyimide, polybenzoxazole, and their precursors and an acrylic resin is proposed, which is a cured film Material with excellent physical properties and stress, but there is no description about photolithography performance

Method used

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  • Negative photosensitive resin composition, pattern forming method, hardened coating film forming method, interlayer insulating film, and surface protective film
  • Negative photosensitive resin composition, pattern forming method, hardened coating film forming method, interlayer insulating film, and surface protective film
  • Negative photosensitive resin composition, pattern forming method, hardened coating film forming method, interlayer insulating film, and surface protective film

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Embodiment

[0346] Hereinafter, the present invention will be specifically described with reference to synthesis examples, examples, and comparative examples, but the present invention is not limited to the following examples. In addition, weight average molecular weight (Mw) shows the polystyrene conversion weight average molecular weight obtained by GPC.

[0347] I. Synthesis of Alkali-Soluble Resin (A)

[0348] The chemical structural formulas and names of the compounds used in the following synthesis examples are shown below.

[0349] [chem 44]

[0350]

Synthetic example 1

[0351] [Synthesis example 1] Synthesis of polyimide resin (A1)

[0352] In a 1L flask equipped with a stirrer and a thermometer, add 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP) 30g (81.9mmol), 4-aminophenol (PAP) 0.9g (8.6 mmol), N-methyl-2-pyrrolidone 125g, stirred and dissolved at room temperature. Then, at room temperature, 26.7 g (86.2 mmol) of 3,3',4,4'-oxydiphthalic dianhydride (s-ODPA) dissolved in 270 g of N-methyl-2-pyrrolidone was added dropwise The resulting solution was stirred at room temperature for 3 hours after the dropwise addition. Thereafter, 40 g of xylene was added to the reaction liquid, and heating and reflux was performed for 3 hours while removing generated water to the outside of the system at 170°C. After cooling to room temperature, the reaction solution was added dropwise into 2 L of ultrapure water with stirring, and the precipitate was separated and filtered, washed with water, and dried under reduced pressure at 40°C for 48 hours,...

Synthetic example 2

[0353] [Synthesis example 2] Synthesis of polyimide resin (A2)

[0354] Replace 30 g (81.9 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (6FAP) in Synthesis Example 1 with 2,2-bis(3-amino-4-hydroxyphenyl) ) propane (BAP) 21.2g (81.9mmol), and the polyimide resin (A2) was obtained by the same prescription. When the molecular weight of the polymer was measured by GPC, the weight average molecular weight was 34,000 in terms of polystyrene.

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Abstract

The invention relates to a negative photosensitive resin composition, a pattern forming method, a hardened coating film forming method, an interlayer insulating film, and a surface protective film. The present invention addresses the problem of providing a negative photosensitive resin composition which is capable of forming a fine pattern having high rectangularity, is capable of obtaining high resolution, has good mechanical characteristics even when cured at low temperature, and does not deteriorate in adhesion force before and after a high-temperature and high-humidity test. A negative photosensitive resin composition containing: (A) an alkali-soluble resin containing at least one structure selected from the group consisting of a polyimide structure, a polybenzoxazole structure, a polyamideimide structure, and precursor structures thereof; (B) a crosslinkable polymer compound that contains a structural unit represented by general formula (1) and has a group that crosslinks with component (A); (C) a compound that generates an acid due to light; and (D) a thermal crosslinking agent.

Description

【Technical field】 [0001] The present invention relates to a negative photosensitive resin composition, a method for forming a pattern using the negative photosensitive resin composition that can be developed with an aqueous alkali solution, a method for forming a cured film, an interlayer insulating film, a surface protective film, and electronic parts . 【Background technique】 [0002] Along with the miniaturization and high performance of various electronic devices such as personal computers, digital cameras, and mobile phones, the demand for further miniaturization, thinning, and high-density semiconductor devices is also rapidly increasing. Along with this, interlayer insulating films and surface protective films of semiconductor elements are required to have more excellent electrical properties, heat resistance, mechanical properties, and the like. [0003] In high-density mounting technologies such as three-dimensional lamination, polyimide films have long been used as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038G03F7/00G03F7/09
CPCG03F7/038G03F7/0387G03F7/00G03F7/09G03F7/0382G03F7/085G03F7/40G03F7/0384C08K5/0025G03F7/162G03F7/168G03F7/2004G03F7/30C08L33/066C08L33/068C08L33/08C08L33/14C08L33/26G03F1/48G03F7/0045G03F7/075G03F7/11G03F7/322
Inventor 饭尾匡史浦野宏之渡边修竹村胜也
Owner SHIN ETSU CHEM IND CO LTD