Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Adhesive suitable for high-reliability copper-clad plate of Mini LED and preparation method of adhesive

A copper-clad laminate and reliability technology, which is applied in the field of high-reliability copper-clad laminate adhesives and its preparation, can solve problems such as shortening the service life of electronic components, and achieve good machining performance and low water absorption Effect

Pending Publication Date: 2022-02-25
南亚新材料科技(江西)有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, Mini LED has to consider the issue of heat dissipation. The high temperature generated by poor heat dissipation will cause high temperature aging of components such as chip materials, which will greatly shorten the service life of electronic components.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive suitable for high-reliability copper-clad plate of Mini LED and preparation method of adhesive
  • Adhesive suitable for high-reliability copper-clad plate of Mini LED and preparation method of adhesive
  • Adhesive suitable for high-reliability copper-clad plate of Mini LED and preparation method of adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] 1. Prepare materials according to the formula composition shown in Table 2:

[0072] Table 2

[0073] material name Example 1 Bisphenol A benzoxazine 60 Cycloaliphatic Epoxy Resin 10 o-cresol novolac ring 20 Amine curing agent 0.5 imidazole accelerator 0.05 Phosphorous Flame Retardants 10 Toughener 5 Soft silica powder 75 boron nitride 75 Organic solvents 50

[0074] 2. Prepare the adhesive:

[0075] Add organic solvents, flame retardants, amine curing agents, and imidazole accelerators into the mixing tank in sequence according to the formula amount, turn on the high-speed stirrer, rotate at 1000 rpm, and tank temperature at 35°C, and continue stirring for 60 minutes after the addition is completed;

[0076] Add benzoxazine resin, cycloaliphatic epoxy resin, novolac epoxy resin, and toughening agent successively according to the formula amount in the stirring tank and stir for 120 minutes at a ...

Embodiment 2

[0093] 1. Prepare materials according to the formula composition shown in Table 3:

[0094] table 3

[0095]

[0096]

[0097] 2. Glue adjustment:

[0098] Add organic solvents, flame retardants, amine curing agents, and imidazole accelerators into the mixing tank in sequence according to the formula, turn on the high-speed stirrer at a speed of 1200 rpm, and tank temperature of 45°C. After the addition is complete, continue stirring for 80 minutes;

[0099] Add benzoxazine resin, cycloaliphatic epoxy resin, novolac epoxy resin and toughening agent successively according to the formula amount in the stirring tank and stir for 100 minutes at a speed of 1000 rpm;

[0100] Weigh the inorganic filler according to the formula, add it into the stirring tank and stir for 3 hours at the speed of 1200 rpm, and then the adhesive is prepared.

[0101] 3. Glue baking:

[0102] The adhesive made by impregnating 7628 type E-glass glass fiber cloth is selected, and the semi-cured ad...

Embodiment 3

[0116] 1. Prepare materials according to the formula composition shown in Table 4:

[0117] Table 4

[0118] material name Example 3 Bisphenol A benzoxazine 80 Cycloaliphatic Epoxy Resin 25 O-Cresol Novolak Epoxy 15 Amine curing agent 5 imidazole accelerator 0.5 Phosphorous Flame Retardants 10 Toughener 8 Soft silica powder 80 boron nitride 100 Organic solvents 30

[0119] 2. Glue adjustment:

[0120] Add organic solvents, flame retardants, amine curing agents, and imidazole accelerators into the mixing tank in sequence according to the formula, turn on the high-speed stirrer, rotate at 130 rpm, and tank temperature at 40°C, and continue stirring for 120 minutes after the addition is completed;

[0121] Add benzoxazine resin, isocyanate-modified epoxy resin, phenolic novolac resin, and toughening agent successively according to the formula amount in the stirring tank and stir for 180 minutes at a speed...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Heat resistanceaaaaaaaaaa
Solder heat resistanceaaaaaaaaaa
Copper foil peel strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses an adhesive suitable for a high-reliability copper-clad plate of a Mini LED. The adhesive is characterized by comprising the following components in parts by weight: 10-30 parts of novolac epoxy resin; 10 to 30 parts of alicyclic epoxy resin; 20 to 80 parts of benzoxazine resin; 0.5 to 10 parts of an amine curing agent; 0.001 to 1 part of an imidazole accelerant; 2 to 20 parts of a toughening agent; 5-30 parts of a phosphorus-containing flame retardant; 20 to 100 parts of an organic solvent; and 100-200 parts of an inorganic filler. The invention also discloses a preparation method of the adhesive. For an epoxy glass cloth-based copper-clad plate prepared by adopting the adhesive disclosed by the invention, Tg is not less than 150 DEG C; Z-axis CTE is not more than 3.0%; in the aspect of heat resistance, TD is greater than or equal to 400 DEG C, and T288 is greater than 60 min, in addition, the epoxy glass cloth-based copper-clad plate has very low water absorption and good machining performance, and the flame retardance reaches the UL94 V-0 level, and cancompletely meet the production requirements of the Mini LED substrate.

Description

technical field [0001] The invention relates to the field of preparation of copper clad boards, in particular to an adhesive for high reliability copper clad boards suitable for Mini LEDs and a preparation method thereof. Background technique [0002] Mini LED is a kind of LED screen, and its chip size is between 50-200um, which is the technical product of LED miniaturization and matrixization. To put it simply, Mini LED is a high-density micro-sized LED array integrated on a chip. Compared with ordinary LEDs, its units are smaller than 50 microns, which is only 1%, but its picture performance and properties are better than ordinary LED numbers. times. [0003] From traditional backlights to Mini LED backlights, the forms of chips and packages are constantly changing, and materials and equipment are also being upgraded in the evolution of technology as powerful aids. With the rapid development of Mini LED, the requirements for materials are also increasing simultaneously, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J161/34C09J163/04C09J163/00C09J11/04
CPCC09J161/34C09J11/04C08L2201/02C08L2201/08C08K2003/385C08K2201/005C08L63/04C08L63/00C08K3/36C08K3/38
Inventor 佟雷林立成粟俊华席奎东蒋岳
Owner 南亚新材料科技(江西)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com