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Microcapsule type self-repairing sintered epoxy coating and preparation method thereof

A technology of fusion-bonding epoxy and fusion-bonding epoxy powder, which is applied in the direction of microcapsule preparation, microsphere preparation, epoxy resin coating, etc., can solve the problems of high temperature and thermal stability difficult to meet the requirements of sintering and solidification, and achieve good The effect of support

Active Publication Date: 2022-03-04
PIPECHINA SOUTH CHINA CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the temperature of fusion-bonded epoxy powder solidification is relatively high, and it needs to be heated to 170-230°C at one time and sintered at this temperature for a certain period of time until solidification
The thermal stability of the existing common microcapsule self-healing system is difficult to meet the needs of its sintering and curing molding
How to find a microcapsule self-healing system with high thermal stability and develop a fusion-bonded epoxy coating material with self-healing and anti-corrosion functions is very challenging

Method used

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  • Microcapsule type self-repairing sintered epoxy coating and preparation method thereof
  • Microcapsule type self-repairing sintered epoxy coating and preparation method thereof
  • Microcapsule type self-repairing sintered epoxy coating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] (1) Mix 90 parts of bisphenol F bisglycidyl ether (BFDGE) with 10 parts of reactive diluent n-butyl glycidyl ether (BGE) to form F10B epoxy resin. Mix 95 parts of the epoxy solution with 5 parts of 4,4-dicyclohexylmethane diisocyanate (HMDI) to form a core solution to be coated. The core liquid was put into a syringe, extruded at a rate of 10.0 mL / h, and atomized under a static voltage of 17 kV to form core liquid micro-droplets. A reaction solution containing 100.0 mL of deionized water, 1.0 g of sodium dodecylsulfonate, and 12.0 g of diethylenetriamine was used to receive the core liquid micro-droplets to form primary microcapsules containing epoxy resin. After the primary microcapsules were prepared, the mixture containing the primary microcapsules and the reaction solution was reacted at 90° C. for 9 hours to form final microcapsules containing epoxy resin. Finally, wash with water, filter, and dry at room temperature to obtain finished epoxy resin microcapsules wi...

Embodiment 2

[0060] The difference with Example 1 is that the core fluid injection rate used in step (1) is 15.0mL / h, and the prepared epoxy resin microcapsule particle diameter is about 150 μm; The injection rate of the core fluid was 1.0mL / h, and the particle size of the prepared amine curing agent microcapsules was about 150 μm.

Embodiment 3

[0062] The difference with Example 1 is that the core liquid injection rate used in step (1) is 5.0mL / h, and the prepared epoxy resin microcapsule particle diameter is about 50 μm; The injection rate of the core fluid was 0.25mL / h, and the particle size of the prepared amine curing agent microcapsules was about 75 μm.

[0063] Figure 6 and Figure 7 The appearances of self-healing fusion-bonded epoxy coatings containing 10.0wt% 50-75μm microcapsules and 10.0wt% 150μm microcapsules were subjected to accelerated corrosion in 10.0wt% saline solution for 2 days. Both exhibit excellent self-healing corrosion protection effects. The results of Examples 1, 2, and 3 show that microcapsules with different particle sizes can be used in the self-repairing anti-corrosion fusion-bonded epoxy coating to realize the self-repairing and anti-corrosion function of the coating.

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Abstract

The invention discloses a microcapsule type self-repairing anti-corrosion sintered epoxy coating and a preparation method thereof. The sintered epoxy coating is formed by mixing sintered epoxy powder, an epoxy resin microcapsule and an amine curing agent microcapsule, coating the substrate with the mixture, and sintering and curing the mixture. The invention also discloses a microcapsule type self-repairing anti-corrosion sintered epoxy coating. The epoxy resin microcapsule and the amine curing agent microcapsule are added into the basic component sintered epoxy powder. The two-component microcapsules with good thermal stability, namely the epoxy resin microcapsules and the amine curing agent microcapsules, are added into the sintered epoxy powder, and after the formed self-repairing anti-corrosion sintered epoxy coating is damaged, the damage can be completely and autonomously repaired. The epoxy resin microcapsule and the amine curing agent microcapsule are less in loss in the curing process of the sintered epoxy coating, have excellent survival performance, and can effectively self-repair the sintered epoxy coating after the sintered epoxy coating is damaged, so that the self-repairing and anti-corrosion functions of the sintered epoxy coating are realized.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a microcapsule type self-repairing fusion-bonded epoxy coating. Simultaneously, the invention also relates to a microcapsule type self-repairing fusion-bonded epoxy coating and a preparation method thereof. Background technique [0002] The self-healing of materials refers to the ability of materials to restore their original properties by using only their own resources without external intervention. Since self-repair technology has the advantages of prolonging the service life of materials, improving product safety performance, and reducing the cost of material use and maintenance, it has broad application prospects in aircraft, automobiles, construction, military equipment, electronic products and other fields. Since White et al. (Nature, 2001, 409: 794-797) pioneered the use of microcapsules to achieve a breakthrough in self-repair in 2001, it has aroused the interest of many...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/02C09D175/02C09D5/08C09D5/03C08G59/50B01J13/16
CPCC09D163/00C09D5/08C09D5/03C08G59/188C08G59/5006B01J13/16C08L75/02
Inventor 王现中熊道英王垚张晨张鹤
Owner PIPECHINA SOUTH CHINA CO
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