Solar-blind AlGaN ultraviolet photoelectric detector and preparation method thereof
A technology of electrical detectors and ultraviolet light, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of low electron saturation mobility, weak visible light filtering, and narrow bandgap width, etc., and achieve excellent material properties, Increased responsivity and detectability, and easy device fabrication
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Embodiment 1
[0042] This embodiment provides a method for preparing a sun-blind AlGaN ultraviolet photodetector, comprising the following steps:
[0043] (1) if figure 1 As shown, a non-doped N-polar surface AlN buffer layer 2, a carbon-doped N-polar surface AlN layer 3, and a carbon-doped N-polar surface composition graded Al y Ga 1-y N layer 4 and non-doped N polar surface Al x Ga 1-x N layer (thin film) 5, obtains the epitaxial wafer of ultraviolet photodetector;
[0044] (2) Place the AlGaN ultraviolet photodetector epitaxial wafer obtained in step (1) in sequence in acetone, deionized water, and absolute ethanol for ultrasonic treatment, take it out, wash it with deionized water, and dry it with hot high-purity nitrogen;
[0045] (3) Mesa isolation pattern preparation: the AlGaN rectifier epitaxial wafer obtained in step (2) is subjected to photolithography preparation of insulating mesa isolation pattern: apply photoresist evenly on the AlGaN rectifier epitaxial wafer obtained in...
Embodiment 2
[0065] This embodiment provides a method for preparing a sun-blind AlGaN ultraviolet photodetector, which specifically includes:
[0066] (1) if figure 1 As shown, AlGaN ultraviolet photodetector epitaxial wafers were grown on silicon substrates by metal-organic chemical vapor deposition, including non-doped N-polar surface AlN buffer layer 2, carbon-doped N-polar surface AlN layer 3, carbon Doped N polar surface composition graded Al y Ga 1-y N layer 4 and non-doped N polar surface Al x Ga 1-x N layer 5, where:
[0067] A non-doped N-polar surface AlN buffer layer 2 is grown on the silicon substrate 1 with a thickness of 450 nm;
[0068] The carbon-doped N-polar surface AlN layer 3 is grown on the N-polar surface AlN buffer layer 2, and its doping concentration is 2.0×10 18 cm -3 , with a thickness of 420nm;
[0069] Carbon-doped N polar surface composition graded Al y Ga 1-y The N layer 4 is grown on the carbon-doped semi-insulating N-polar AlN buffer layer 3 with ...
Embodiment 3
[0086] This embodiment provides a method for preparing a sun-blind AlGaN ultraviolet photodetector, which specifically includes:
[0087] (1) AlGaN ultraviolet photodetector epitaxial wafers are grown on silicon substrates by metal-organic chemical vapor deposition, including non-doped N-polar surface AlN buffer layer 2, carbon-doped N-polar surface AlN layer 3, carbon Doped N polar surface composition graded Al y Ga 1-y N layer 4 and non-doped N polar surface Al x Ga 1-x N layer 5, where:
[0088] A non-doped N-polar surface AlN buffer layer 2 is grown on the silicon substrate 1 with a thickness of 500nm;
[0089] The carbon-doped N-polar surface AlN layer 3 is grown on the N-polar surface AlN buffer layer 2, and its doping concentration is 3×10 18 cm -3 , with a thickness of 440nm;
[0090] Carbon-doped N polar surface composition graded Al y Ga 1-y The N layer 4 is grown on the carbon-doped semi-insulating N-polar AlN buffer layer 3, and its doping concentration is...
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Abstract
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