Multi-fold spherical silver powder and preparation method and application thereof

Abstract

The invention discloses a preparation method of multi-fold spherical silver powder, which belongs to the technical field of conductive silver powder preparation, and comprises the following steps: 1) preparing a reducing agent solution A by taking vitamin C as a solute and water as a solvent; 2) dropwise adding the silver nitrate solution into the sodium citrate solution to obtain a silver-containing solution B; and (3) the silver-containing solution B is transferred into a water bath to be stirred and heated, the reducing agent solution A is added into the solution B at the dropwise adding speed of 20-60 mL/min, after dropwise adding is completed, after precipitation, the solution is centrifuged, cleaned and dried, and the silver-containing composite material is obtained. According to the method, the vitamin C solution is adopted as a reducing agent, the silver citrate solution is adopted as a silver-containing solution, the vitamin C solution is added into the citric acid solution in a quantitative and constant-speed mode, the multi-fold spherical silver powder is prepared, the specific surface area of the silver powder is increased through the multi-fold structure, the silver powder has the low-temperature sintering characteristic, a more compact silver layer is formed, and the silver layer is more compact. The conductive performance is excellent, no dispersing agent is needed, and the preparation cost is low.

Description

technical field [0001] The invention relates to the technical field of conductive silver powder preparation, in particular to a multi-fold spherical silver powder and its preparation method and application. Background technique [0002] Silver powder is the most widely used metal powder in the electronics industry. In recent decades, with the advancement of science and technology, especially the rapid development of the electronics industry, the preparation of silver powder has made considerable progress in both technology and equipment, and has become quite mature. Silver powder is the most critical material to form conductive silver paste, and its quality directly or indirectly affects the performance of the paste and the final conductor. In recent decades, with the rapid development of the microelectronics industry, great progress has been made in the preparation and technology research of precious metal powders, especially silver powders, which are the most widely used ...

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Problems solved by technology

[0003] In the current method of preparing silver powder, silver powder is generally relatively smooth, so its specific surface area is relatively small, it does not have low-temperature sintering characteristics, and cannot form a dense silver layer, which consumes a lot of energy. In order to improve the dispersion effect of silver powder, generally Need to add dispersant, making the whole silver powder preparation process costly and more complicated

In addition, the silver powder with a smooth surface has poor adsorption capacity, which also seriously restricts the promotion and application of silver powder.

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