Photoelectric detector based on TaIrTe4/Si heterojunction and preparation method thereof
A photodetector and heterojunction technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of low detection rate, low responsivity, narrow detection wavelength range, etc., and achieve stable and reproducible optical switching curves. Good, easy-to-operate effect
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Embodiment 1
[0031] figure 1 For the present invention based on TaIrTe 4 / Si heterojunction photodetector structure schematic diagram, such as figure 1 shown. Among them, metal plate bottom electrode 1, silver paste 2, three-dimensional Si 3, silicon dioxide layer 4, TaIrTe 4 Layer 5, top electrode 6. The photodetector is based on TaIrTe 4 / Si heterojunction photodetector with a top electrode structure of 6 / TaIrTe 4 / Si heterojunction 5 / bottom electrode 1, the TaIrTe 4 / Si heterojunction is in Si / SiO 2 The Si window is etched on the substrate to make the TaIrTe 4 Nanosheets are obtained in full contact with Si, and in TaIrTe 4 TaIrTe outside the Si heterojunction 4 The edge makes the top electrode.
[0032] In this embodiment, the bottom metal plate electrode is a copper plate, and the Si substrate and the copper plate are pasted together with silver paste, and dried on a hot table, so as to ensure ohmic contact between the copper plate and the Si substrate; in addition, the th...
Embodiment 2
[0034] A TaIrTe-based 4 / Si heterojunction photodetector preparation method, such as figure 2 shown, including the following steps:
[0035] 1. On Si / SiO2 2 Spin-coat photoresist on the substrate at a speed of 4000 rpm, and dry on a hot stage at 100°C for 4 minutes;
[0036] 2. Using ultraviolet lithography technology, the Si / SiO coated with photoresist 2 The area of the substrate is photoetched out to 500×500μm 2 window, and developed, blow dry with nitrogen gun;
[0037] 3. Soak the substrate with a window in buffered oxide etchant (BOE) for about 1 min, then take it out, wash it with clean water 3-4 times, and blow it dry with a nitrogen gun;
[0038] 4. Soak the film processed in step 3 in acetone solution for about 10s, wash off the photoresist, rinse with water 1-2 times, dry it with a nitrogen gun, and dry it in Si / SiO 2 The middle area of the substrate gets 500 x 500 μm 2 Dimensions of the Si window;
[0039] 5. Repeatedly overlap with thermal release tape...
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