A preparation process of porous copper foil, its product and application
A preparation process and technology of porous copper, applied in cables, insulated conductors, structural parts, etc., can solve the problem of high energy consumption, and achieve the effects of low energy consumption, good electrical conductivity and small pore size
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0038] Commercially available brass foil (62 brass, zinc content about 38wt%), 0.01mm thick, was cut into small pieces of 20×20mm, and methylene chloride was used as a cleaning agent to degrease the brass surface, and then Clean brass surfaces and dry until use.
[0039] The composition of chemical leaching solution: water as solvent, 10g / L sulfamic acid, 50g / L ammonium chloride, 20g / L choline chloride. Immerse the cut brass foil in the chemical dipping solution and react at 50°C for 10min.
[0040] figure 1 The SEM image of the porous copper foil prepared in this example. It can be seen from the figure that the distribution of pores on the surface of the prepared porous copper foil is relatively uniform, and the diameter of the pores is relatively consistent. The pore size distribution range is 0.30-0.80 μm, the average pore size is about 0.55 μm, and the pore size uniformity is good.
[0041] The porous copper foil prepared in this example was placed and baked at 250° C....
Embodiment 2
[0044] Use commercially available brass foil (62 brass, zinc content about 38wt%), 0.1mm thick, cut into small pieces of 20×20mm, use ethanol as a cleaning agent to degrease the brass surface, and then clean it up Brass finish and dry for use.
[0045] The composition of chemical zinc leaching solution: water as solvent, 5g / L sulfamic acid, 15g / L ammonium chloride, 5g / L choline chloride. Immerse the cut brass foil in the chemical dipping solution and react at 40°C for 2h.
[0046]After characterization, the porous copper foil prepared in this example has a relatively uniform distribution of holes on the surface, and the hole diameters are relatively consistent, about 0.30-0.90 μm, with good uniformity and an average pore diameter of about 0.62 μm.
[0047] The porous copper foil prepared in this example was placed and baked at 250° C. for 60 minutes, and no oxidative discoloration occurred on the surface of the porous copper foil, indicating that it has excellent anti-oxidati...
Embodiment 3
[0050] Use commercially available brass foil (62 brass, zinc content about 38wt%), 0.1mm thick, cut into small pieces of 20 × 20mm, use acetone as a cleaning agent to degrease the brass surface, and then clean it up Brass finish and dry for use.
[0051] The composition of chemical zinc leaching solution: water as solvent, 20g / L sulfamic acid, 80g / L ammonium chloride, 40g / L choline chloride. Immerse the cut brass foil in a chemical dipping solution and react at 70° C. for 5 min.
[0052] The characterization shows that the pores on the surface of the porous copper foil prepared in this example are independent, the distribution is relatively uniform, the diameter of the pores is relatively consistent, the size distribution of the pores is 0.50-1.0 μm, and the average pore diameter is about 0.74 μm.
[0053] The porous copper foil prepared in this example was placed and baked at 250° C. for 60 minutes, and no oxidative discoloration occurred on the surface of the porous copper ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| pore size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



