Heterogeneous integration method for monocrystalline two-dimensional semiconductor molybdenum telluride film and arbitrary lattice mismatched monocrystalline substrate
A two-dimensional semiconductor and lattice-mismatching technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, sustainable manufacturing/processing, etc., can solve problems that hinder the development of related devices, complex processes, and high cost of buffer layer technology
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[0023] The present invention will be further elaborated below through specific embodiments in conjunction with the accompanying drawings.
[0024] In this example, a pn junction device that is heterogeneously integrated with a two-dimensional semiconductor molybdenum telluride thin film and a variety of lattice-mismatched three-dimensional single crystal materials is prepared through the following steps:
[0025] (1) Three-dimensional single-crystal substrate material preparation. In order to demonstrate the advantage that two-dimensional single-crystal semiconductor molybdenum telluride thin films can be directly grown on single-crystal materials with mismatched lattice structures, we selected molybdenum telluride thin films (hexagonal lattice structure) Different single crystal silicon materials are used as substrates (cubic lattice structure), and the crystal plane is [001]. The lattice constant of semiconductor molybdenum telluride is a=b=0.352nm, the lattice constant of s...
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