A manufacturing method of a composite sensor package carrier board and a lidar sensor

Abstract

The invention discloses a manufacturing method of a composite sensor package carrier board and a laser radar sensor, comprising a PCB circuit substrate, a first optical cup board, and a second optical cup board. A functional circuit is formed on it, and the packaging pad 1 and the packaging pad 2 are made; the second step is to insert the solder resist material on the PCB circuit substrate, and the window is opened; the third step, the PCB circuit substrate, the first light The cup board and the second optical cup board are stacked and pressed together by vacuum thermocompression to form a carrier board profile with a plurality of packaging carrier boards, and the second optical cup board and the first optical cup board are pressed together on one of the packaging pads. The installation position with steps is formed above; the fourth step is to divide the carrier plate profile into suitable sizes according to the actual situation. The setting of the installation position can effectively limit the position of the optical unit and avoid the process of thermal pressing. Middle sliding shift.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a manufacturing method of a composite sensor packaging carrier board and a laser radar sensor. Background technique [0002] At present, the packaging of consumer electronic sensors such as mobile phones is usually packaged with a flat PCB substrate. First, the chip is packaged on the PCB substrate, then die-casting plastic sealant is sealed, and finally the shielding and protective plastic shell is injection-molded to form a single device. The manufacturing process is complex, and the die-casting plastic packaging Glue and injection-molded shielding have high requirements for protecting plastic housings, resulting in low yield and high cost of finished products. Moreover, the packaged finished devices still have quality problems such as air tightness, sensitivity, and stability. [0003] The high-performance solid-state lidar sensor package usually uses a ceramic substrat...

AI Technical Summary

Problems solved by technology

[0002] At present, the package of consumer electronic sensors such as mobile phones is usually packaged with a flat PCB substrate. First, the chip is packaged on the PCB substrate, and then sealed with die-casting plastic sealant. Finally, a single device is formed by injecting a shielding protective plastic shell. Plastic and injection-molded shielding protection plastic shells have high requirements, the yield of finished products is low, and the cost is high, and the packaged finished devices still have quality problems such as air tightness, sensitivity, and stability.

[0003] The high-performance solid-state lidar sensor package usually uses a ceramic substrate as the package carrier. Although it has the advantages of good sealing, high stability, and good heat dissipation performance, the ceramic substrate is brittle and fragile, and the adhesion of the surface metal circuit Poor, difficult to perform complex and precise processing and other shortcomings, resulting in bulky dimensions of the finished sensor device, and the inability to process complex and precise circuits, it is difficult to meet the packaging requirements of higher-performance chips, and the size or performance of the packaged lidar sensor device is limited. In addition, the ceramic substrate is fragile, and the number of holes cannot be drilled too much, which makes the processing difficult;

[0004] In addition, the solid-state lidar sensor packaging ceramic substrate basically relies on imported or directly imported finished devices, and the price is very high, especially the optical phased array (OPA) all-solid-state lidar sensor, which is currently only monopolized by large foreign companies. For example, Quanergy Corporation of the United States recently launched a laser radar sensor based on solid-state OPA technology; for automatic driving and other requirements, it has a high-performance laser radar sensor with ultra-long detection distance, high precision, high sensitivity, high reliability, high integration and miniaturization. There is a problem of being stuck in the country, and due to the basic characteristics of the ceramic substrate, it also hinders the lidar sensor from better meeting the higher needs of the development of autonomous driving

Images