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Polishing pad employing polyamine and cyclohexanedimethanol curing agents

A technology of cyclohexane dimethanol and polishing pads, which is applied in the field of polishing pads, can solve the problems of high cost and achieve the effects of long pad life, good planarization efficiency, and high removal rate

Pending Publication Date: 2022-05-06
CMC MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such an operation may be available, it is often costly as it requires the use of an additional polishing step

Method used

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  • Polishing pad employing polyamine and cyclohexanedimethanol curing agents
  • Polishing pad employing polyamine and cyclohexanedimethanol curing agents
  • Polishing pad employing polyamine and cyclohexanedimethanol curing agents

Examples

Experimental program
Comparison scheme
Effect test

example 2

[0026] Example diamines may include aniline diamine compounds, toluene diamine compounds, aminobenzoate compounds, and mixtures thereof. Example aniline diamine compounds include 4,4-methylenebis(2-chloroaniline) (MBCA or MOCA); 4,4'-methylene-bis-o-chloroaniline (MbOCA); 4,4'-methylene Methyl-bis-(3-chloro-2,6-diethylaniline) (MCDEA); 4,4'-methylene-bis-aniline; and 1,2-bis(2-aminophenylthio) ) ethane. Example toluenediamine compounds include dimethylthiotoluenediamine; diethyltoluenediamine; 5-tert-butyl-2,4-toluenediamine; and 3-tert-butyl-2,6-toluenediamine; 5 - tert-amyl-2,4-toluenediamine and 3-tert-amyl-2,6-toluenediamine; and chlorotoluenediamine. Example aminobenzoate compounds include trimethylene glycol di-p-aminobenzoate; polyoxytetramethylene di-p-aminobenzoate; polyoxytetramethylene mono-p-aminobenzoic acid ester; polyoxypropylene di-p-aminobenzoate; and polyoxypropylene mono-p-aminobenzoate.

[0027] Anilinediamine compounds such as 4,4-methylenebis(2-chloro...

no. 1 approach

[0042] A first embodiment may comprise a chemical mechanical polishing pad comprising a thermoset polyurethane polishing layer comprising an isocyanate terminated urethane prepolymer; a polyamine curing agent; and a cyclohexanedimethanol curing agent, Wherein the molar ratio of polyamine curing agent and cyclohexanedimethanol curing agent of polyamine curing agent to cyclohexanedimethanol curing agent is in the range of about 20:1 to about 1:1.

[0043] The second embodiment may include the first embodiment, wherein the prepolymer is a toluene diisocyanate (TDI) compound or a diphenylmethane diisocyanate (MDI) compound and a polytetramethylene ether glycol (PTMEG) or polymethylene Reaction product of propyl ether glycol.

[0044] The third embodiment may include the first or second embodiment, wherein the prepolymer is an aromatic prepolymer selected from the group consisting of 75D prepolymer, 80D prepolymer, and mixtures thereof.

[0045] The fourth embodiment may include a...

Embodiment 1

[0080] A number of non-porous polishing pad samples were prepared for evaluation of the effect of CHDM on mechanical properties (as described in more detail below in Examples 2-4). Samples are prepared by mixing the prepolymer, diamine curing agent, and optional diol curing agent. The mixture was poured onto a nine inch square preheated mold base where it was compression molded at 260°F for 10 min. The precured pad samples were then released from the mold and cured in a vented oven at a temperature of 200°F for 12 hours. The coupons are then cut into samples for mechanical testing.

[0081] Table 1A lists 11 experimental pad samples 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, 1J and 1K that included various prepolymer / diamine curing agent / diol compositions . Each of the compositions in Table 1A includes PET-75D prepolymer and dimethylthiotoluenediamine curing agent. Compositions are listed in parts by weight, where each composition is normalized (normalized) to 100 parts by weig...

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Abstract

A chemical mechanical polishing pad comprising a thermoset polyurethane polishing layer, the thermoset polyurethane polishing layer comprising an isocyanate terminated urethane prepolymer, a polyamine curing agent, and a cyclohexanedimethanol curing agent. The molar ratio of the polyamine curing agent to the cyclohexanedimethanol curing agent of the polyamine curing agent and the cyclohexanedimethanol curing agent is in the range of about 20: 1 to about 1: 1.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] none. technical field [0003] The disclosed embodiments relate to polishing pads and more particularly to thermoset polyurethane polishing pads for use in chemical mechanical polishing (CMP) operations comprising an isocyanate terminated urethane prepolymer and a polyamine cyclohexane dimethanol curing agent mixture. Background technique [0004] Chemical mechanical planarization or chemical mechanical polishing (CMP) is a common technique used to planarize or polish workpieces, such as semiconductor wafers. In a conventional CMP operation, a wafer is mounted on a carrier (polishing head), which is positioned in contact with a polishing pad in a CMP apparatus (polishing tool). The carrier assembly applies a controlled force to the wafer, pressing it against the polishing pad. A chemical mechanical polishing composition (eg, slurry) is dispensed onto the surface of the pad (polishing layer) while the substrate and pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/24
CPCB24B37/24B24B37/26B24D11/00B24D13/14B24D3/32C08G18/10C08G18/12C08G18/7621C08G18/7671C08G18/3212C08G18/3237C08G2110/0041C08G18/3225C08G18/48C08G18/42C08G18/4854C09D175/02C09D175/04C08G2110/0058B32B2260/021B32B27/40B32B5/02B32B2307/536B32B2264/2032B32B5/18B32B2307/54B32B2266/0278B32B27/12B32B2432/00B32B27/065B32B2307/72B32B27/08B32B27/26B24D11/001
Inventor 马锐富琳蔡晨智J.李S.布罗斯南
Owner CMC MATERIALS INC
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