HJT low-temperature conductive silver paste and preparation method thereof

A conductive silver paste, low temperature technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of insufficient fluidity, low curing temperature, and scattered silver powder. The effect of improving the morphology of printed lines and lines, reducing friction between powders and improving contact resistance

Pending Publication Date: 2022-05-13
苏州星翰新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductive silver paste pretreats the silver powder to obtain better properties, but the silver powder obtained by the method needs to be dried, and the process is relatively complicated
[0005] CN111261320A discloses an epoxy resin-based low-temperature conductive silver paste and a preparation method thereof, comprising the following components by weight: 55-75 parts by weight of silver powder, 5-15 parts by weight of epoxy resin, 0.3-10 parts by weight of curing agent, 0.05-5 parts by weight of curing accelerator, 2-18 parts by weight of diluent, 0.011 parts by weight of inhibitor, 0.1-3 parts by weight of rheology additive, and 0.5-5 parts by weight of additives, with lower curing temperature and smaller Viscosity, suitable for screen printing process; but single diameter silver powder makes the conductive silver paste easy to peel off
[0006] CN113345623A discloses a HJT battery low-temperature curing silver paste for fine printing and a preparation method thereof. The HJT battery low-temperature curing silver paste is calculated in parts by weight, and the composition of raw materials includes: 88-93 parts of main conductive silver powder, 0.2- 5 parts of auxiliary conductive silver powder, 2.5-9 parts of main epoxy resin, 0.1-2 parts of low-viscosity epoxy resin, 0.1-0.5 parts of curing agent, and 2-5 part

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  • HJT low-temperature conductive silver paste and preparation method thereof

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Example Embodiment

[0072] In another specific embodiment, the present invention provides a method for preparing a low-temperature conductive silver paste of HJT as described above, the preparation method comprising the following steps:

[0073] (1) Mix polyurethane resin, epoxy resin, solvent and curing agent, 1000-2000rpm / min, 1-3min of the first dispersion to obtain resin liquid;

[0074](2) Mix the resin liquid and nano powder, sequentially 800-1500rpm / min, 2-4min second dispersion, 3-6min ultrasonic dispersion and 1000-2000rpm / min, 2-4min third dispersion to obtain nanopowder solution;

[0075] (3) Mix the nano-powder solution and class A micron powder, after the first rolling of 9-12 times to obtain semi-finished silver paste;

[0076] (4) Mixing the semi-finished silver paste, class B micron flour and additives, after 9-12 times of second rolling, 400-600rpm / min, 10-15min after the fourth dispersion to obtain the low temperature conductive silver paste.

[0077] To be clear, the use of ...

Example Embodiment

[0078] Example 1

[0079] The present embodiment provides a low-temperature conductive silver paste of HJT, the raw material components of the low-temperature conductive silver paste by weight comprising:

[0080] Polyurethane prepolymer (relative molecular weight 1700) 3.5 parts, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycide 2 parts, diethylene glycol butyl ether acetate 3 parts, dicycline 0.5 parts, acrylate leveling agent (BYK-358N) 1 part and silver powder 90 parts.

[0081] The silver powder comprises micron powder and nano powder; the mass of the micron powder is 96% of the total mass of the silver powder; the mass of the nano powder is 4% of the total mass of the silver powder;

[0082] The micron powder comprises flakes with a particle size of 3 μm and a vibration density of 6.5 g / cm 3 Class A micron powder and spherical, particle size of 1.5 μm, vibration density of 4.3 g / cm 3 The mass ratio of Class A micron powder and Class B micron powder is 6.5:3.5;

[0083]...

Example Embodiment

[0089] Example 2

[0090] The present embodiment provides a low-temperature conductive silver paste of HJT, the raw material components of the low-temperature conductive silver paste by weight comprising:

[0091] Polyurethane prepolymer (relative molecular weight 1300) 2 parts, 3,4 epoxy cyclohexyl methyl-3,4-epoxy cyclohexylformate 3 parts, diethylene glycol butyl ether 4 parts, hexafluoroantimonate 0.2 parts, polysiloxane antifoam (BYK, BYK-A530) 1.5 parts and silver powder 95 parts.

[0092] The silver powder comprises micron powder and nano powder; the mass of the micron powder is 98% of the total mass of the silver powder; the mass of the nano powder is 2% of the total mass of the silver powder;

[0093] The micron powder comprises flakes with a particle size of 1 μm and a vibration density of 6.9 g / cm 3 Class A micron powder and spherical, particle size of 0.5 μm, vibration density of 4.8 g / cm 3 The mass ratio of Class A micron flour and Class B micron powder is 6:4;

...

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Abstract

The invention provides HJT low-temperature conductive silver paste and a preparation method thereof. The low-temperature conductive silver paste comprises the following raw material components in parts by weight: 2-5 parts of polyurethane resin, 1-3 parts of epoxy resin, 2.5-4 parts of a solvent, 0.2-0.5 part of a curing agent, 0.5-1.5 parts of an additive and 86-95 parts of silver powder, the silver powder comprises micron powder and nano powder; the preparation method comprises the following steps: (1) mixing organic phase raw materials, and carrying out first dispersion to obtain a resin liquid; (2) mixing the resin liquid and nano powder, and sequentially carrying out second dispersion, ultrasonic dispersion and third dispersion to obtain a nano powder solution; (3) mixing the nano powder solution and the class A micron powder, and performing first rolling to obtain semi-finished silver paste; and (4) mixing the semi-finished product silver paste, the class B micron powder and the additive, and carrying out second rolling and fourth dispersion to obtain the low-temperature conductive silver paste, according to the preparation method, the silver powder with different particle sizes is added step by step, so that the bonding strength and uniformity of the silver paste are improved, and the electrical property and the printing property of the low-temperature conductive silver paste are improved.

Description

technical field [0001] The invention belongs to the technical field of conductive materials, and in particular relates to a low-temperature conductive silver paste of HJT and a preparation method thereof. Background technique [0002] In the past two decades, electronic science and technology have developed rapidly. As an important part, low-temperature curing conductive silver paste has been widely used in solar cells, membrane switches, RFID, flexible printed circuit boards and many other fields through screen printing technology. Solar cells are considered to be one of the most promising new energy technologies in the future due to their many advantages such as cleanness and environmental protection, wide application range, simple operation, stable operation, abundant material sources, and long service life. [0003] Low-temperature curing silver paste is an important part of the photovoltaic solar industry, which is mainly composed of conductive functional phase, matrix ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00H01L31/0224
CPCH01B1/22H01B13/00H01L31/022425
Inventor 孙光辉刘成牛亮峰梁玮王盼盼柴永康
Owner 苏州星翰新材料科技有限公司
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