HJT low-temperature conductive silver paste and preparation method thereof
A conductive silver paste, low temperature technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of insufficient fluidity, low curing temperature, and scattered silver powder. The effect of improving the morphology of printed lines and lines, reducing friction between powders and improving contact resistance
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[0072] In another specific embodiment, the present invention provides a method for preparing a low-temperature conductive silver paste of HJT as described above, the preparation method comprising the following steps:
[0073] (1) Mix polyurethane resin, epoxy resin, solvent and curing agent, 1000-2000rpm / min, 1-3min of the first dispersion to obtain resin liquid;
[0074](2) Mix the resin liquid and nano powder, sequentially 800-1500rpm / min, 2-4min second dispersion, 3-6min ultrasonic dispersion and 1000-2000rpm / min, 2-4min third dispersion to obtain nanopowder solution;
[0075] (3) Mix the nano-powder solution and class A micron powder, after the first rolling of 9-12 times to obtain semi-finished silver paste;
[0076] (4) Mixing the semi-finished silver paste, class B micron flour and additives, after 9-12 times of second rolling, 400-600rpm / min, 10-15min after the fourth dispersion to obtain the low temperature conductive silver paste.
[0077] To be clear, the use of ...
Example Embodiment
[0078] Example 1
[0079] The present embodiment provides a low-temperature conductive silver paste of HJT, the raw material components of the low-temperature conductive silver paste by weight comprising:
[0080] Polyurethane prepolymer (relative molecular weight 1700) 3.5 parts, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycide 2 parts, diethylene glycol butyl ether acetate 3 parts, dicycline 0.5 parts, acrylate leveling agent (BYK-358N) 1 part and silver powder 90 parts.
[0081] The silver powder comprises micron powder and nano powder; the mass of the micron powder is 96% of the total mass of the silver powder; the mass of the nano powder is 4% of the total mass of the silver powder;
[0082] The micron powder comprises flakes with a particle size of 3 μm and a vibration density of 6.5 g / cm 3 Class A micron powder and spherical, particle size of 1.5 μm, vibration density of 4.3 g / cm 3 The mass ratio of Class A micron powder and Class B micron powder is 6.5:3.5;
[0083]...
Example Embodiment
[0089] Example 2
[0090] The present embodiment provides a low-temperature conductive silver paste of HJT, the raw material components of the low-temperature conductive silver paste by weight comprising:
[0091] Polyurethane prepolymer (relative molecular weight 1300) 2 parts, 3,4 epoxy cyclohexyl methyl-3,4-epoxy cyclohexylformate 3 parts, diethylene glycol butyl ether 4 parts, hexafluoroantimonate 0.2 parts, polysiloxane antifoam (BYK, BYK-A530) 1.5 parts and silver powder 95 parts.
[0092] The silver powder comprises micron powder and nano powder; the mass of the micron powder is 98% of the total mass of the silver powder; the mass of the nano powder is 2% of the total mass of the silver powder;
[0093] The micron powder comprises flakes with a particle size of 1 μm and a vibration density of 6.9 g / cm 3 Class A micron powder and spherical, particle size of 0.5 μm, vibration density of 4.8 g / cm 3 The mass ratio of Class A micron flour and Class B micron powder is 6:4;
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