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Preparation method of co-fired aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and aluminum nitride powder is applied in the field of preparation of co-fired aluminum nitride ceramic substrates, which can solve the problems of low thermal conductivity, high energy consumption and high sintering temperature, and achieves improved stability and performance. Stabilizing and avoiding the effect of competitive adsorption

Active Publication Date: 2022-05-27
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, in view of the above problems, the present invention provides a method for co-firing aluminum nitride ceramic substrates, which solves the defects of low thermal conductivity and high energy consumption caused by co-fired aluminum nitride ceramics in the prior art.

Method used

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  • Preparation method of co-fired aluminum nitride ceramic substrate

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Embodiment 1

[0029] A preparation method for a co-fired aluminum nitride ceramic substrate, comprising the following preparation steps: (1) batching ball milling: sending aluminum nitride powder and yttrium oxide into a ball mill for ball milling, and the amount of the yttrium oxide is aluminum nitride 0.2wt% of the powder, the particle size of the aluminum nitride powder is micron, specifically, in this embodiment, the aluminum nitride powder is 0.3μm; during the ball milling process, anhydrous ethanol and alumina are added to the ball mill. grinding ball;

[0030] (2) Deaeration: the ball milled slurry is aged for 2 hours and then sent to a deaerator for deaeration until the slurry viscosity reaches 20000mPa·s;

[0031] (3) tape casting: the slurry treated in step (2) is sent to a casting machine for tape casting, and left to stand for 6h;

[0032] (4) Punching: slicing the tape-casting green sheet to obtain a green sheet of the required shape and size, and printing with tungsten paste ...

Embodiment 2

[0037] A preparation method of a co-fired aluminum nitride ceramic substrate, comprising the following preparation steps: (1) batching ball milling: sending aluminum nitride powder and yttrium oxide into a ball mill for ball milling treatment;

[0038] (2) Deaeration: The ball milled slurry is aged for 2.5 hours and then sent to a deaerator for deaeration until the slurry viscosity reaches 22000mPa·s;

[0039] (3) tape casting: the slurry treated in step (2) is sent to a casting machine for tape casting, and left to stand for 7h;

[0040] (4) Punching: slicing the tape-casting green sheet to obtain a green sheet of the required shape and size, and printing with tungsten paste and leaving it to stand or drying the tungsten paste in an oven; the The preparation method of tungsten slurry is as follows: (1) The tungsten powder and part of the organic medium are first sent to a ball mill for dispersion treatment: tungsten powder with a particle size of 1.0 μm and tungsten powder with...

Embodiment 3

[0045] A preparation method for a co-fired aluminum nitride ceramic substrate, comprising the following preparation steps: (1) batching ball milling: sending aluminum nitride powder and yttrium oxide into a ball mill for ball milling treatment;

[0046] (2) Defoaming: The ball milled slurry is aged for 3 hours and then sent to a defoaming machine for defoaming until the slurry viscosity reaches 23000mPa·s;

[0047] (3) tape casting: the slurry treated in step (2) is sent to a casting machine for tape casting, and left to stand for 8h;

[0048] (4) Punching: slicing the tape-casting green sheet to obtain a green sheet of the required shape and size, and printing with tungsten paste and leaving it to stand or drying the tungsten paste in an oven; the The preparation method of tungsten slurry is as follows: (1) The tungsten powder and part of the organic medium are first sent to a ball mill for dispersion treatment: tungsten powder with a particle size of 1.1 μm and tungsten powd...

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Abstract

The invention relates to the field of electronic ceramic substrates, provides a method for co-firing an aluminum nitride ceramic substrate, and solves the defects of low heat conductivity and high energy consumption caused by over-high sintering temperature of co-fired aluminum nitride ceramic in the prior art. Comprising the following preparation steps: (1) batching and ball-milling: feeding aluminum nitride powder and a sintering aid into a ball mill for ball-milling treatment; (2) defoaming: aging the ball-milled slurry for 2-3 hours, and defoaming the slurry in a defoaming machine until the viscosity of the slurry reaches 20000-23000 mPa.s; (3) tape casting: feeding the slurry treated in the step (2) into a tape casting machine for tape casting, and standing for 6-8 hours; (4) punching; (5) laminating: decompressing the printed green sheet according to the thickness requirement; (6) glue discharging is conducted, specifically, the green body pieces treated in the step (5) are placed in a nitrogen protection glue discharging furnace, and glue discharging is conducted under the nitrogen atmosphere till the carbon content is 2000 ppm or below; and (7) sintering.

Description

technical field [0001] The invention relates to the field of electronic ceramic substrates, in particular to a preparation method of a co-fired aluminum nitride ceramic substrate. Background technique [0002] At present, the high temperature co-fired ceramics (HTCC) on the market are mainly divided into three categories: ceramics with alumina, mullite and aluminum nitride as the main components. Ceramics with alumina as the main component is a relatively mature microelectronic packaging technology. It is sintered at 1500-1700 ℃ by 92-96% alumina, plus 4-8% sintering aids, and its wires are tungsten. , Molybdenum, Molybdenum-Meng and other refractory metals. The substrate technology is mature, the medium cost is low, and the thermal conductivity and flexural strength are high. However, the shortcomings of alumina multilayer ceramic substrates are also more significant as follows: high dielectric constant, which affects the improvement of signal transmission speed; high con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/582C04B35/622C04B41/88
CPCC04B35/581C04B35/622C04B41/88C04B41/009C04B41/5133C04B2235/9607C04B2235/96C04B41/5035C04B41/5072C04B41/5031C04B41/4539
Inventor 杨大胜施纯锡
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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