Photosensitive diamine monomer and preparation method thereof, resin containing photosensitive diamine monomer, and photosensitive resin composition

A technology of photosensitive resin and diamine monomer, applied in the field of photosensitive resin composition, can solve the problems of increased solubility difference, low film retention rate of cured film, large acting force, etc., and achieves improved transparency and high photosensitivity. , the effect of enhancing photosensitivity

Active Publication Date: 2022-06-17
POME TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is a mixed photosensitive PI, the intermolecular force between the organic group in the o-diazonaphthoquinone sulfonate and PI is relatively large, which increases the solubility difference between the exposed area and the non-exposed area, and the resolution is also low. Improved
However, since the photosensitizer is a small molecule, it will decompose and volatilize during the curing process, resulting in a low retention rate of the cured film

Method used

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  • Photosensitive diamine monomer and preparation method thereof, resin containing photosensitive diamine monomer, and photosensitive resin composition
  • Photosensitive diamine monomer and preparation method thereof, resin containing photosensitive diamine monomer, and photosensitive resin composition
  • Photosensitive diamine monomer and preparation method thereof, resin containing photosensitive diamine monomer, and photosensitive resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0115] The preparation method of the above-mentioned photosensitive diamine monomer specifically comprises the following steps:

[0116] (1) Preparation of primary product: mix and fully dissolve hydroxybenzaldehyde, triethylamine and DMAC to obtain a reaction solution; control the system temperature of the reaction solution to be (-10)-(-5) °C, add the reaction solution The mixed solution of diazonaphtholsulfonyl chloride and DMAC was dropped, and the reaction was stirred to obtain the primary product.

[0117] Wherein, the hydroxy-containing benzaldehyde is selected from p-hydroxybenzaldehyde, 3,4-dihydroxybenzaldehyde, 4-hydroxy-3-trifluoromethylbenzaldehyde, 4-hydroxy-3-trifluoromethoxybenzaldehyde , 4-hydroxy-3-methylbenzaldehyde, 5-methyl-3-(2-benzothiazolyl)-2-hydroxybenzaldehyde, 3-hydroxy-4-benzyloxybenzaldehyde and 3-(tri Fluoromethoxy) o-hydroxybenzaldehyde.

[0118] (2) Preparation of secondary product: fully react the primary product obtained in step (1) with hy...

preparation example 1-6

[0132] Preparation Examples 1-6 respectively provide a photosensitive diamine monomer. The difference is that the types of hydroxy-containing benzaldehyde and diazonaphthol sulfonyl chloride used in the preparation method of each photosensitive diamine monomer are different.

[0133] The preparation process of the above-mentioned photosensitive diamine monomer is shown in Table 1, and its preparation method specifically includes the following steps:

[0134] (1) Preparation of primary product: mix hydroxybenzaldehyde, triethylamine and DMAC in a three-necked flask, stir to fully dissolve the three, and obtain a reaction solution; reduce the system temperature of the reaction solution to -5°C, and add to the reaction The mixed solution of diazonaphtholsulfonyl chloride and DMAC is dropped into the solution, and the reaction is stirred to obtain the primary product.

[0135] (2) Preparation of secondary product: add hydrochloric acid dropwise to the primary product obtained in ...

preparation example 7-16

[0158] Preparation Examples 7-16 respectively provide a resin containing a photosensitive diamine monomer. The difference lies in: in the preparation process of each resin containing photosensitive diamine monomer, the photosensitive diamine monomer used is shown in Table 3 in detail. Among them, the types of photosensitive diamine monomers respectively represent the photosensitive diamine monomers prepared by the corresponding preparation examples in the above-mentioned preparation examples 1-6.

[0159] The preparation method of the above-mentioned resin containing photosensitive diamine monomer specifically comprises the following steps:

[0160] (1) preparation of dianhydride solution: under nitrogen flow, in the 500ml there-necked flask equipped with agitator, dropping funnel and thermometer, successively add 4,4'-oxydiphthalic anhydride (ODPA), N-methane pyrrolidone (NMP), stirring at room temperature to fully dissolve each substance to obtain a dianhydride solution;

...

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Abstract

The invention relates to the technical field of high polymer materials, in particular to a photosensitive diamine monomer and a preparation method thereof, resin containing the photosensitive diamine monomer and a photosensitive resin composition. The invention provides a photosensitive diamine monomer. The structural formula of the photosensitive diamine monomer is as shown in formula (1). The preparation method of the photosensitive diamine monomer specifically comprises the following steps: preparing a primary product; preparing a secondary product; preparing a photosensitive diamine monomer crude product; and purifying the photosensitive diamine monomer crude product. The invention also provides a photosensitive diamine monomer-containing resin prepared by using the photosensitive diamine monomer, and a photosensitive resin composition prepared by using the photosensitive diamine monomer-containing resin. According to the invention, the photosensitivity and the film retention rate of the photosensitive resin composition can be improved at the same time.

Description

technical field [0001] The present application relates to the technical field of polymer materials, and more particularly, to a photosensitive diamine monomer and a preparation method thereof, a resin containing the photosensitive diamine monomer, and a photosensitive resin composition. Background technique [0002] Polyimide (PI) is one of the most widely used polymer materials in the semiconductor and microelectronics industries. Due to the rigid structure and aromatic structure of cyclic imide on the PI backbone, PI has good thermal stability, excellent mechanical properties, electrical properties and chemical properties, and is widely used in electronics, optics, aerospace, optoelectronic devices, etc. field. With the light weight, high performance and multi-function of electronic products, the requirements for PI of electronic products are also getting higher and higher. [0003] In order to improve the photosensitivity of PI, a lot of research has been done at home a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C309/76C07C303/30C08G73/10G03F7/023
CPCC07C309/76C08G73/1042C08G73/1071C08G73/1053C08G73/1039C08G73/1017G03F7/023C07C2602/10
Inventor 公聪聪贾杰孟凡兴李铭新王珂
Owner POME TECH CO LTD
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