Semiconductor silicon crystal bar slicing processing equipment and silicon powder recovery method thereof

Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to semiconductor silicon crystal bar slicing processing equipment and a silicon powder recycling method thereof.The semiconductor silicon crystal bar slicing processing equipment comprises a lathe bed, a wire conveying mechanism, a workbench, a wire frame and a cooling liquid circulating component; according to the invention, the cooling liquid box is uniformly divided into a plurality of mutually independent cooling liquid chambers along the circumferential direction by the partition pieces, and the cooling liquid containing silicon powder produced by primary slicing and cutting and the cooling liquid pumped by the pump are respectively placed in different cooling liquid chambers; the cooling liquid containing the silicon powder generated by primary slicing and cutting is isolated from the extracted cooling liquid, the situation that the cooling liquid containing the silicon powder disturbs the cooling liquid in the box when flowing into the cooling liquid box is avoided, it is guaranteed that the extracted cooling liquid is precipitated, the content of the silicon powder in the extracted cooling liquid is reduced, and the service life of the cooling liquid is prolonged. The silicon powder in the cooling liquid is prevented from being adhered to the surface of the silicon wafer due to more and more silicon powder, the surface of the silicon wafer is prevented from being polluted, and the surface quality of the cut silicon wafer is further improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a semiconductor silicon crystal rod slicing processing equipment and a method for recovering silicon powder. Background technique [0002] Semiconductors manage data by controlling current to form various characters, numbers, sounds, images and colors. They are widely used in integrated circuits and made into chips for use in various electronic products in daily life, while silicon in semiconductors It is one of the best, and has the most influence in commercial applications. Before making chips, silicon ingots need to be cut into silicon wafers, and then millions of transistors are etched on the wafers. [0003] At present, the slicing of silicon ingots on the market is cut with diamond wire. When the diamond wire is cut, the slicing slits are rinsed with coolant to take away the silicon powder produced during cutting, and the diamond wire and the silicon ingot ...

AI Technical Summary

Problems solved by technology

The present invention is mainly used to solve the problem that the silicon powder produced by diamond wire cutting in the prior art enters into the cooling liquid. When it is large enough, it will stick to the surface of the silicon wafer and cause the problem of deteriorating the surface quality of the silicon wafer

Images