Semiconductor silicon crystal bar slicing processing equipment and silicon powder recovery method thereof

A technology for processing equipment and silicon crystal rods, which is applied to the semiconductor silicon crystal rod slicing processing equipment and the field of silicon powder recycling, can solve the problems of falling and adhesion of the surface quality of silicon wafers, shorten the time, ensure the water permeability, improve the The effect of the ability to keep working

Inactive Publication Date: 2022-06-28
侯典宇
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention is mainly used to solve the problem that the silicon powder produced by diamond wire cutting in the prior art enters into the cooling liq

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor silicon crystal bar slicing processing equipment and silicon powder recovery method thereof
  • Semiconductor silicon crystal bar slicing processing equipment and silicon powder recovery method thereof
  • Semiconductor silicon crystal bar slicing processing equipment and silicon powder recovery method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to make it easy to understand the technical means, creation features, achieved goals and effects of the present invention, the present invention will be further described below with reference to the specific embodiments.

[0046] like Figure 1 to Figure 10 As shown, a semiconductor silicon ingot slicing processing equipment includes a bed 1, a wire conveying mechanism 2, a worktable 3, a wire rack 4 and a cooling liquid circulation component 5; Wire transport mechanism 2 and wire rack 4; the wire rack 4 is located between the workbench 3 and the wire transport mechanism 2; the workbench 3, the wire transport mechanism 2 and the wire rack 4 are all fixed connected to the bed body 1; the cooling liquid circulation component 5 is arranged inside the bed body 1;

[0047] The cooling liquid circulation component 5 includes a cooling liquid tank 50, a pump 51, a ring gear 52, a chassis 53, a motor 54, a No. 1 gear 55, a support frame 56, a liquid suction ring 57 an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to semiconductor silicon crystal bar slicing processing equipment and a silicon powder recycling method thereof.The semiconductor silicon crystal bar slicing processing equipment comprises a lathe bed, a wire conveying mechanism, a workbench, a wire frame and a cooling liquid circulating component; according to the invention, the cooling liquid box is uniformly divided into a plurality of mutually independent cooling liquid chambers along the circumferential direction by the partition pieces, and the cooling liquid containing silicon powder produced by primary slicing and cutting and the cooling liquid pumped by the pump are respectively placed in different cooling liquid chambers; the cooling liquid containing the silicon powder generated by primary slicing and cutting is isolated from the extracted cooling liquid, the situation that the cooling liquid containing the silicon powder disturbs the cooling liquid in the box when flowing into the cooling liquid box is avoided, it is guaranteed that the extracted cooling liquid is precipitated, the content of the silicon powder in the extracted cooling liquid is reduced, and the service life of the cooling liquid is prolonged. The silicon powder in the cooling liquid is prevented from being adhered to the surface of the silicon wafer due to more and more silicon powder, the surface of the silicon wafer is prevented from being polluted, and the surface quality of the cut silicon wafer is further improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a semiconductor silicon crystal rod slicing processing equipment and a method for recovering silicon powder. Background technique [0002] Semiconductors manage data by controlling current to form various characters, numbers, sounds, images and colors. They are widely used in integrated circuits and made into chips for use in various electronic products in daily life, while silicon in semiconductors It is one of the best, and has the most influence in commercial applications. Before making chips, silicon ingots need to be cut into silicon wafers, and then millions of transistors are etched on the wafers. [0003] At present, the slicing of silicon ingots on the market is cut with diamond wire. When the diamond wire is cut, the slicing slits are rinsed with coolant to take away the silicon powder produced during cutting, and the diamond wire and the silicon ingot ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B28D5/00B28D5/04B01D36/04
CPCB28D5/045B28D5/0058B28D5/0076B28D5/0064B01D36/04
Inventor 侯典宇
Owner 侯典宇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap