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Halogen-free flame-retardant resin composition and application thereof

A flame retardant resin and resin composition technology, applied in the field of laminates, can solve the problem of unsatisfactory heat resistance, reliability and dielectric properties, lowering the glass transition temperature of the resin system, and poor rigidity of low-polarity materials. problems, such as excellent dimensional stability, improved dimensional stability, and improved dielectric properties

Active Publication Date: 2022-06-28
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the melting point or softening point of most additive flame retardants is low, which will significantly reduce the glass transition temperature of the resin system. When the temperature exceeds a certain limit during processing, especially when the glass transition temperature of the resin is exceeded, the deformation of the substrate will increase sharply. , the dimensional stability is greatly reduced
Some practitioners choose epoxy resin and phenolic resin with phosphorus structure as flame retardant resin, but these resins are not satisfactory in terms of heat resistance, reliability and dielectric properties
[0004] On the other hand, it is easy to achieve low dielectric properties by using low-polarity resin materials, but low-polarity materials often have poor rigidity, or poor adhesion, and are prone to warping and wire throwing (copper wires are separated from the substrate) when PCB is used. Cause scrap and increase manufacturing cost

Method used

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  • Halogen-free flame-retardant resin composition and application thereof
  • Halogen-free flame-retardant resin composition and application thereof
  • Halogen-free flame-retardant resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0107]

[0108] 350g (0.5mol) of OL-1001 (purchased from FRX company in the United States, n is 3) and 1000g of appropriate amount of toluene were placed in a three-necked flask, to which was added 28.5g (0.5mol) of allylamine, 75g (1mol) of Aqueous methanol (40%). After the addition, the temperature was raised to 90°C at a heating rate lower than 2°C / min, and the reaction was carried out for 5h. Then the temperature was raised to 120°C, and the solvent was drained within 60 minutes under a pressure of less than 30tor, and the resin was transferred to a beaker, and cooled in ice water to obtain a phosphorus-containing unsaturated bond benzoxazine resin.

[0109]

preparation example 2

[0111]

[0112] 400g (0.25mol) of terminal hydroxy phosphate (purchased from ICL, n is 6) and 1000g appropriate amount of toluene were placed in a three-necked flask, 14.25g (0.25mol) of allylamine was added to it, 75g (0.5mol) of Aqueous methanol (40%). After the addition, the temperature was raised to 90°C at a heating rate lower than 2°C / min, and the reaction was carried out for 5h. Then the temperature was raised to 120°C, and the solvent was drained within 60 minutes under a pressure of less than 30tor, and the resin was transferred to a beaker, and cooled in ice water to obtain a phosphorus-containing unsaturated bond benzoxazine resin.

[0113]

preparation example 3

[0115]

[0116] 370g (0.5mol) of SPH-100 (purchased from Japan Otsuka Chemical) and 1000g appropriate amount of toluene were placed in a three-necked flask, 28.5g (0.5mol) of allylamine, 75g (1.0mol) of methanol aqueous solution ( 40%). After the addition, the temperature was raised to 90°C at a heating rate lower than 2°C / min, and the reaction was carried out for 5h. Then the temperature was raised to 120°C, and the solvent was drained within 60 minutes under a pressure of less than 30tor, and the resin was transferred to a beaker, and cooled in ice water to obtain a phosphorus-containing unsaturated bond benzoxazine resin.

[0117]

[0118] In order to better illustrate the present invention and facilitate the understanding of the technical solutions of the present invention, typical but non-limiting examples of the present invention are as follows:

[0119] In the examples and comparative examples, unless otherwise specified, the parts represent parts by weight, and ...

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Abstract

The invention relates to a halogen-free flame-retardant resin composition and application thereof, and the halogen-free flame-retardant resin composition comprises the following solid components in parts by weight: (A) 1-40 parts of epoxy resin; (B) 1-30 parts by weight of a phosphorus-containing benzoxazine resin containing an unsaturated bond at a terminal group; (C) 30 to 80 parts by weight of a maleimide compound; the invention also provides a prepreg prepared from the resin composition, a resin film or a resin-coated copper foil, an insulating plate, a metal foil-coated laminated plate and a printed circuit board. According to the halogen-free flame-retardant resin composition disclosed by the invention, the dielectric property of the resin composition is effectively improved while high Tg and high heat resistance of the resin composition are ensured; and the prepreg and the laminated board for the printed circuit have excellent dimensional stability while having excellent performance.

Description

technical field [0001] The invention relates to the technical field of laminates, in particular to a halogen-free flame retardant resin composition and its application. Background technique [0002] With the development of communication technology, the dielectric constant of printed circuit board (CCL) (D k ) and dielectric loss (D f ) requirements are getting higher and higher. The field of consumer electronics represented by mobile phones, notebook computers and tablet computers will be redesigned and manufactured as an important application node of 5G networks in the upcoming 5G era. Unlike in the past, its CCL material requires lower dielectric losses. At present, the main board structures of mainstream mobile phones and tablet PCs are all high-density interconnection (HDI) designs, which have higher requirements on the heat resistance of materials after curing for many times. In the process of PCB processing, in order to improve the yield of products, there are stri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L61/34C08L63/00C08K7/18C08K3/34C08K5/523C08K5/521C08K5/5399C08J5/24B32B27/04B32B17/02B32B17/12B32B15/14B32B15/20B32B37/06B32B37/10H05K1/03
CPCC08L79/085C08J5/24H05K1/036B32B5/02B32B5/26B32B15/14B32B15/20B32B37/06B32B37/10C08L2201/02C08L2201/22C08L2312/00C08L2203/20C08L2205/025C08L2205/035C08J2379/08C08J2463/00C08J2461/34B32B2255/02B32B2255/26B32B2260/021B32B2260/046B32B2307/734B32B2307/306B32B2307/3065B32B2457/08C08L61/34C08L63/00C08K7/18C08K3/34C08K5/523C08K5/521C08K5/5399H05K1/03B32B17/02B32B17/067B32B27/04C08L79/08
Inventor 奚龙肖逸兴郭浩黄天辉王碧武林伟许永静
Owner GUANGDONG SHENGYI SCI TECH