Electron beam curing type hot-melt pressure-sensitive adhesive and application thereof

Abstract

The invention relates to the field of adhesives, in particular to an electron beam curing type hot-melt pressure-sensitive adhesive and application thereof. The adhesive is prepared from the following raw materials: an allyl monomer and a solvent. The electron beam curing type hot-melt pressure-sensitive adhesive provided by the invention overcomes the defect of high energy consumption caused by solvent type glue coating, and achieves remarkable social benefits in the aspect of production energy conservation. And in the aspects of environmental protection, sanitation and safety, no solvent, zero emission, 100% curing, real no residue, no photoinitiator, no odor and no VOC emission are realized. The problem that water emulsion type glue cannot resist high temperature is solved, and an adhesive tape manufactured by adopting the electron beam curing type hot-melt pressure-sensitive adhesive has a high long-term temperature-resistant grade and can be used in a high-temperature environment. The adhesive is prepared by using a soft monomer and a functional monomer in a certain weight ratio as alkene monomers, and through electron beam curing, high high-temperature stability can be obtained, and high adhesive force and initial adhesion performance are ensured while the flexibility of an adhesive product is improved.

Description

technical field [0001] The invention relates to the field of adhesives, and more particularly, to an electron beam-curable hot-melt pressure-sensitive adhesive and its application, that is, rapid curing of a resin system by the action of high-energy electron beams of an electron accelerator. It changes the mechanism of the traditional UV curing method that requires an external photoinitiator to generate free radicals. It does not require an external photoinitiator to generate free radicals, but directly acts on the active resin, usually completing the curing process within a few milliseconds. Background technique [0002] In the field of ordinary civilian and industrial tapes and adhesive products, the traditional production method adhesives are dissolved in organic solvents, which will cause different degrees of pollution during the production process. , due to the need to volatilize a large amount of solvent in the pressure-sensitive adhesive at high temperature, it will c...

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Problems solved by technology

[0002] In the field of ordinary civil and industrial tapes and adhesive products, the traditional production method of adhesive is dissolved in an organic solvent, which will cause different degrees of pollution during the production process. In the process of pressure-sensitive adhesive coating to make adhesive tape , due to the need for high temperature to volatilize a large amount of solvent in the pressure-sensitive adhesive, it will consume a large amount of heat source energy, and will further cause the organic solvent to volatilize into the environment, causing pollution; in the field of adhesive products, due to the implementation of environmental protection regulations and public awareness of environmental protection and health The European Commission has also promulgated the requirements of the "Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (ROHS Directive), and the requirements of national environmental protection regulations are becoming more and more stringent. The requirements are also increasing

[0003] At present, the production of adhesive tapes and adhesive products has gradually eliminated solvent-based or rubber-based adhesives, and more and more water-based rubber-based and water-based acrylic adhesives are used, but there are problems such as low temperature resistance, and in the adhesive In the product, there are generally problems such as degumming after fast splicing, and mismatch between softness, adhesion, and peel strength.

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