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Flux paste, soldering paste and soldering method

A solder paste and flux paste technology, applied in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of complex process flow, unfavorable environmental protection, long startup time, etc.

Pending Publication Date: 2022-07-22
深圳市福特佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, wave soldering generally uses fluxes with low boiling points, the process is complicated, the equipment takes a long time to start up, and needs to be maintained for 24 hours, and the oxidation of tin bars during the soldering process produces a large amount of tin slag, and the cost of consumables is high, which is not conducive to environmental protection.

Method used

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  • Flux paste, soldering paste and soldering method
  • Flux paste, soldering paste and soldering method

Examples

Experimental program
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Effect test

Embodiment 1

[0056] This embodiment provides a soldering flux paste, which, in parts by mass, includes: 30 parts of rosin (604), 15 parts of fully hydrogenated rosin, 23.5 parts of hexyl ether, 10 parts of hexylene glycol, 5 parts of neocapric acid, butanediol 5 parts of acid, 1 part of malonic acid, 3 parts of humectant (825), 4.5 parts of thixotropic agent (6650), 2 parts of triethanolamine, and 1 part of surfactant (3100).

[0057] This embodiment also provides a solder paste, using the solder paste and lead-free metal powder LF of this embodiment 143 Mix and dissolve by heating at 150°C to obtain.

Embodiment 2

[0059] This embodiment provides a soldering flux paste, which, in parts by mass, includes: 20 parts of rosin (604), 25 parts of fully hydrogenated rosin, 23 parts of hexyl ether, 10 parts of hexylene glycol, 10 parts of neocapric acid, butanediol 1 part of acid, 0.5 part of malonic acid, 1 part of dibromobutenediol, 8252 parts, 4.5 parts of thixotropic agent (6650), 1 part of surfactant (3100), 2 parts of triethanolamine.

[0060] This embodiment also provides a solder paste, using the solder paste and lead-free metal powder LF of this embodiment 143 Mix and dissolve by heating at 150°C to obtain.

Embodiment 3

[0062] This embodiment provides a soldering flux paste, which, in parts by mass, includes: 20 parts of rosin (604), 25 parts of fully hydrogenated rosin, 23 parts of hexyl ether, 10 parts of hexanediol, 10 parts of neocapric acid, hexanediol 1 part of acid, 0.5 part of malonic acid, 0.8 part of dibromobutenediol, 0.2 part of cyclohexylamine hydrochloride, 3 parts of humectant (825), 4.5 parts of thixotropic agent (6650), surfactant (3100 ) 1 part, 2 parts of triethanolamine.

[0063] This embodiment also provides a solder paste, which is obtained by mixing the solder paste of this embodiment and the lead-free metal powder LF143 and heating and dissolving at 150°C.

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Abstract

The invention relates to flux paste, soldering paste and a soldering method, and the flux paste comprises the following components in parts by mass: 25-45 parts of rosin resin, 25-38 parts of a solvent, 3-10 parts of an active agent, 5-8 parts of a thixotropic agent, 1-3 parts of a humectant, 3-7 parts of an antioxidant and 1-3 parts of a surfactant. The flux paste disclosed by the invention can be used for preparing soldering paste, and has the advantages of low melting point, good wettability, long moisturizing time and good pasting effect; the ink has the advantages of moderate viscosity, meeting of the printing requirements of roller printing, small viscosity change during printing, good printing rolling property and tin falling property, exquisite printing of a bonding pad with the distance as low as 0.3 mm, uniform tin feeding, no tiny tin ball and collapse, realization of completion of reflow soldering of heat-labile components by replacing a wave soldering process, reduction of the starting time of equipment, and reduction of the production cost. The welding efficiency is improved, oxidation of the tin bar in the wave soldering process is avoided, and the cost of consumables is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic welding, in particular, to a soldering flux paste, a soldering tin paste and a welding method. Background technique [0002] In order to mount various electronic components such as capacitors on a circuit board, surface mount technology (SMT) or plug-in (THT) technology is generally required. Reflow soldering is the most commonly used method of attaching components to printed circuit boards using surface mount technology, with components and solder joints on the same side of the board. Insertion is done by wave soldering. The molten solder (lead-tin alloy) is sprayed into the solder wave crest required by the design through an electric pump or an electromagnetic pump. It can also be formed by injecting nitrogen into the solder pool, so that the The printed board with components passes through the solder wave to realize the soft soldering of the mechanical and electrical connection between the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K1/00B23K101/42
CPCB23K35/3613B23K35/362B23K1/00B23K2101/42
Inventor 张然李淑梅
Owner 深圳市福特佳电子有限公司