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Fragile diamond abrasive particle and manufacturing method thereof

A technology of diamond grains and diamonds, applied in the field of diamond abrasive grains, can solve expensive problems, achieve continuous performance, realize the effect of machined surface quality, continuous grinding and polishing performance

Pending Publication Date: 2022-07-22
东名钻石株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the production method of such polycrystalline abrasive grains uses a large amount of explosives restricted by many laws, so it is more expensive than ordinary abrasive grains produced by static ultra-high pressure-high temperature process

Method used

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  • Fragile diamond abrasive particle and manufacturing method thereof
  • Fragile diamond abrasive particle and manufacturing method thereof
  • Fragile diamond abrasive particle and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] §Improved brittleness of diamond particles for resin bonding

[0064] Commercially available diamond for resin bonding (Tomei Diamond Co. powder IRV3, #170 / 200, brittleness: 54.4; bulk density: 1.62 g / cm) 3 ) was used as the starting material, and was processed as follows for the purpose of improving brittleness.

[0065] [1] With CO 2 Oxidation

[0066] 20 grams of the starting material were weighed, placed in a ceramic dish and heated in a tube furnace at 980°C for 12 hours while carbon dioxide gas was flowing at a rate of 40 mL / min. The diamond particles recovered from the furnace showed a brittleness of 65.8 and 1.37 g / cm 3 bulk density; cracks were observed within the particles and surface corrosion was observed on the particles. A 21% increase in brittleness and an 18% decrease in bulk density were observed due to the rough surface.

[0067] [2] Use H 2 O oxidation

[0068] 20 grams of the above starting material was placed in a ceramic dish and heated in a...

Embodiment 2

[0073] § Improvement of diamond particles for metal bonding

[0074] Commercially available diamond particles for metal bonding (Tomei Diamond Co. powder IMS, #325 / 400, brittleness: 20.0) were used as starting materials, and were treated as follows for the purpose of increasing brittleness.

[0075] A volume of initial diamond material was placed in an alumina crucible and heated at 1300°C for 6 hours in a nitrogen atmosphere. A sample of diamond particles was recovered after treatment with a grey appearance and a thin graphite layer formed on the surface. The brittleness rating was 35.0.

[0076] Two 20-gram samples were taken from the treated diamond. The first sample was in CO 2 Treated at 1000° C. for 2 hours in an atmosphere; a brittleness of 54.0 was thus obtained. The second sample was in H 2 The brittleness of 58.6 was obtained by treating at 1000°C for 2 hours in O vapor.

Embodiment 3

[0078] § Improvement of micron-sized diamond particles

[0079] [1] Surface oxidation using solid etchant

[0080] The initial diamond material used was a commercial product Tomei Diamond Co. micron-sized diamond powder (IRM5-10, D 50 Value (average particle size): 5.730 μm, specific surface area: 0.849 m 2 / g).

[0081] The regular attachment of the fine powder of oxide etchant to the diamond particles is ensured by a wet process: the diamond particles are first wetted with an acidic solution of metal salts (ferric chloride, magnesium chloride, etc.) to which base is added to induce metal hydrogen Oxide attachment. Then, the whole was dried and shaped into pellets as samples.

[0082] Each sample was placed in an alumina crucible and processed by holding at 1300°C or 1200°C for 2 hours in an inert atmosphere. For the recovered samples, metal components were removed by dissolving in dilute hydrochloric acid, rinsed with water and dried to collect diamond particles. The c...

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Abstract

The present invention provides a diamond abrasive particle having enhanced brittleness, which has microcracks inside the particle and an irregular shape of the surface, and which has or does not have a non-diamond carbon layer covering the surface of the particle, and a method for manufacturing the same. The diamond abrasive particles of the present invention are formed from diamond particles synthesized by a static ultrahigh pressure-high temperature process, and include microcracks formed within the particles by heating and surface irregularities formed on the particles by oxidative etching at high temperature. The manufacturing method of the present invention comprises: generating diamond particles of an initial volume by a synthesis process in a static ultrahigh pressure-high temperature process, bringing the diamond particles into close contact with an oxidation etchant, and performing heat treatment at a treatment temperature of 800 DEG C or higher, thereby forming microcracks within the diamond particles and corroding the particle surfaces to form increased surface irregularities, recovering the treated diamond particles.

Description

technical field [0001] The present invention relates to diamond abrasive particles, and in particular to such particles having a unique crystal structure specifically designed to achieve good crushing performance and other essential qualities when applied to machining. Background technique [0002] Diamond synthesis technology has reached a level of perfection that allows gem-quality diamond crystals to be used as abrasive grains for industrial use. On the other hand, in the field of grinding and polishing work, there is a high demand for abrasive grains dedicated to high-speed precision machining in order to be able to perform at higher and Achieve higher precision surface machining at an effective stock removal rate. [0003] As such abrasive grains that can satisfy both the above-mentioned criteria of high stock removal rate and fine-machined surface quality, polycrystalline abrasive grains are favored in the machining industry. Formed secondary particles with a particl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24D3/00C01B32/28
CPCC01B32/28C01P2004/60C01P2006/12C01P2006/40C09K3/1409B24D3/10B01J3/062B01J2203/0655C01P2004/61C01P2006/90
Inventor 石塚博石塚良彰
Owner 东名钻石株式会社
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