Flexible copper-clad plate graphene oxide hole metallization method

A technology of flexible copper clad laminate and hole metallization, which is applied in the direction of electrical connection formation of printed components, can solve the problems of poor conductivity of the conductive layer, limited conductivity of the polymer conductive layer, waste products, etc., to avoid waste and pollute the environment, The effect of saving human resource costs and simple process flow

Pending Publication Date: 2022-08-02
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive layer formed by graphite or carbon black has poor conductivity, and due to the large size of the particles, it is difficult to adhere when the size of the through hole is small; metal palladium is difficult to mass-produce due to its high cost; the polymer conductive layer is currently the most widely used Pore ​​metallization process, but the polymerization process requires potassium permanganate solution for oxidation

Method used

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  • Flexible copper-clad plate graphene oxide hole metallization method
  • Flexible copper-clad plate graphene oxide hole metallization method
  • Flexible copper-clad plate graphene oxide hole metallization method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The specific process steps of metallizing the graphene oxide holes of the flexible copper clad laminate of the present invention are as follows:

[0043] The first step is to use ultraviolet laser drilling to drill several through holes on the flexible copper clad plate; use a 355nm picosecond ultraviolet laser drilling machine, the power of the ultraviolet laser drilling machine is 4.5W, the scanning speed is 50mm / s, repeat The number of drillings is 4 times.

[0044] In the second step, the perforated flexible copper clad laminate is washed with circulating water, and then the through hole of the flexible copper clad laminate is processed with a hole-forming agent polyacrylamide. The concentration range of the pore-forming agent is 20wt%, the pH value range is 10, and the set temperature is 35°C. Ultrasonic treatment was used during the whole hole treatment, and the frequency was 45 kHz.

[0045] The 3rd step, add the graphite solid powder of 2g in the sulfuric acid...

Embodiment 2

[0051] The difference from Example 1 is that the black hole treatment time is 4 minutes, and other operations are the same as those of Example 1.

[0052] Graphene oxide conducts black hole treatment on the hole wall of the flexible copper clad laminate for 4 minutes, and the hole wall is electroplated with copper layer such as figure 2 As shown in the figure, the bottom of the hole is round and complete, without black spots, the copper thickness of the hole is uniform, and there is no void or delamination, which is the best group of black holes.

Embodiment 3

[0054] The difference from Example 1 is that the black hole treatment time is 6 minutes, and other operations are the same as those of Example 1.

[0055] Graphene oxide conducts black hole treatment on the hole wall of the flexible copper clad laminate for 6 minutes, and the hole wall is electroplated with copper layer such as image 3 As shown in the figure, the bottom of the hole is round and complete, with a few black spots, the copper thickness of the hole is uniform, there is no void, no delamination, and there are some defects at the orifice.

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Abstract

The invention provides a flexible copper-clad plate graphene oxide hole metallization method. A flexible copper-clad plate with through holes is soaked in a graphene oxide aqueous solution and then is subjected to chemical copper plating. The hole wall generated by the hole metallization method is smooth, flat and flawless, and the problem of skip plating is avoided.

Description

technical field [0001] The invention relates to a method for metallizing graphene oxide holes of a flexible copper clad plate, and belongs to the technical field of flexible circuit boards. Background technique [0002] Flexible Printed Circuit (FPC for short) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability, and is widely used in LCD and plasma flat panel displays in the fields of electronics and communications. [0003] Flexible circuit boards are prepared on flexible copper clad laminates through a certain process. Flexible circuit boards can generally be divided into single-sided, double-sided and multi-layer circuit boards. Double-sided and multi-layer circuit boards have two layers of copper plates and multi-layer copper plates, respectively, and the copper plates and the copper plates are separ...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/423
Inventor 罗学涛陈志城刘文鑫黄柳青
Owner XIAMEN UNIV
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