Ultralow-temperature curing silver paste for flexible transparent metal grid conductive film and preparation method of ultralow-temperature curing silver paste

Abstract

The invention discloses ultralow-temperature curing silver paste for a flexible transparent metal grid conductive film, which comprises the following components in parts by weight: 30-45 parts of submicron spherical silver powder, 8-23 parts of flake silver powder, 0.5-1.5 parts of alkyl (aryl) ketoxime closed and modified hexamethylene diisocyanate, 28 parts of polyurethane resin, 10 parts of ethylene glycol monoethyl ether acetate and 7-8.5 parts of diethyl carbonate, the average particle size D50 of the flaky silver powder is 0.95 m, and the specific surface area of the flaky silver powder is 1.35 m < 2 > / g; the invention further discloses a preparation method. The curing temperature of the cured silver paste is reduced to 80 DEG C, the curing time is shortened to 20 min, and the cured silver paste has the remarkable advantages of being good in printing performance, excellent in grid filling performance, weather resistance and conductivity, capable of greatly improving the yield of products, capable of reducing energy consumption and the like and has high market competitiveness.

Description

technical field [0001] The invention belongs to the technical field of new electronic conductive silver paste materials for microelectronic flexible display touch control, and in particular relates to an ultra-low temperature curing silver paste for flexible transparent metal grid conductive films and a preparation method thereof. Background technique [0002] With the continuous development of flexible electronics and wearable electronics, various devices have higher and higher requirements for flexible transparent conductive film electrodes, and flexible transparent conductive films are more and more widely used. The traditional flexible transparent conductive film is dominated by flexible ITO film, but the cost of ITO is high, the preparation process is complex, high vacuum equipment is required, and ITO is rigid and brittle, which limits its application in flexibility. The newly developed alternative ITO materials mainly include high molecular conductive polymers, carbon...

AI Technical Summary

Problems solved by technology

[0004] At present, most of the conductive film silver pastes on the market are micron-scale silver pastes, which have large particle sizes and poor dispersion and cannot be effectively filled in 3-micron ultra-fine grooves; however, nano-scale small particle size silver powders are used to prepare conductive film silver pastes, which have good performance. However, due to the small particle size of nano-scale silver powder, it is easy to agglomerate and the effective contact (conduction) area after curing is relatively small, so it is difficult to obtain strong electrical conductivity

[0005] In addition, the general silver paste is filled in micron-scale ultra-fine grooves. After low-temperature baking, it is difficult for the silver paste itself to produce strong mechanical properties, and it is also difficult for the silver paste to achieve strong bonding with the substrate.

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