Flat shape electronic component and its mfg. method

Abstract

Delamination in the conventional chip-type electronic part may create voids thereinside, allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode, in such a way that fatigue may accumulate in the internal electrode, which eventually will results in the internal electrode being electrically disconnected. To solve this problem, a chip-type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode, wherein external electrodes of the chip-type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste. The former is achieved by impregnating the synthetic resins before the formation of the external electrodes and the later, by extending the pores from surfaces of the external electrodes to surfaces of a main body and then by impregnating the synthetic resins thereinto.

Description

technical field [0001] The present invention relates to chip electronic components such as chip inductors, chip capacitors, and LC composite chip components, and their manufacturing methods. Background technique [0002] A chip electronic component generally consists of a chip unit body as the body of the electronic component and a pair of external electrodes formed at the ends of the unit body. The unit body is composed of a magnetic constituent object and a sheet-shaped inner conductor arranged inside the magnetic constituent object. The end of the internal conductor is exposed at the end of the unit body, the external electrode is arranged at the end of the unit body, and the external electrode and the internal electrode are electrically connected here. [0003] When the chip electronic component is a chip inductor, the magnetic component system is composed of a magnetic body, and the internal conductor is generally formed in a spiral shape inside the magnetic component....

AI Technical Summary

Problems solved by technology

[0006] However, in the manufacturing process of the above-mentioned chip-shaped electronic components, when the sheet-shaped laminate is fired at high temperature to form a unit body, the firing shrinkage of the laminate is uneven, and there is a gap between adjacent ceramic plates inside the laminate. Occasionally, peeling (delamination) occurs between the ceramic plate and the internal conductor, and a void will be formed at the peeled part

[0007] Furthermore, at least one side of the inner conductor adjacent to this gap loses the support of the ceramic plate and becomes in a floating state. Therefore, when an impact is applied to the unit body from the outside, the inner conductor vibrates in the gap and metal fatigue occurs. thus the problem of disconnection

[0008] Especially in the case where the chip electronic component is an inductor, if a high-frequency current flows through the inner conductor, the surrounding magnetic body acts on the inner conductor with a violently changing electromagnetic force, and the inner conductor is subjected to this electromagnetic force in the gap. Vibration, will produce large metal fatigue, so there is a problem of disconnection

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