Film resistor temperature sensor and its making process

A technology of temperature sensor and thin film resistor, used in thermometers, thermometers and instruments with directly sensitive electrical/magnetic components, etc., can solve problems such as easy generation of pinholes, dust, bubbles, difficulty in adjusting printing characteristics, etc.

Inactive Publication Date: 2005-01-12
董述恂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the pure liquid organometallic paste is easy to burst during sintering, and the thickness of each printing and sintering can only reach 0.2-0.3um. To achieve the required thickness of resistance, it is necessary to repeat printing and sintering 3-4 times, the production efficiency is low, and it is easy to produce needles. Pores, dust and other film defects, low yield; low selectivity of solvents for dissolving organic metal paste and matching film-forming resin materials, high viscosity of paste, easy to produce defects such as bubbles and pinholes during printing, printing characteristics adjustment difficulty
[0004] Although gold has a large temperature coefficient of resistance, it has not been used as a temperature measuring resistance material in temperature sensors due to its small resistivity and the high cost of the original gold film production process.

Method used

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  • Film resistor temperature sensor and its making process
  • Film resistor temperature sensor and its making process
  • Film resistor temperature sensor and its making process

Examples

Experimental program
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Effect test

Embodiment 1

[0034] The hybrid platinum paste is different from the thick-film platinum resistor paste formed by mixing platinum powder and glass powder, because it uses the polymer bonding technology of platinum, so the film-forming property is very good. Technically, the thickness of the film is required to be 0.02um-2um, and the present invention adopts mixed slurry to make the temperature-sensing part. The 43% vulcanized turpentine platinum produced by Handan Ceramic Research Institute was heated at 190°C for 15 minutes, and the decomposition product was mixed with 4.3% vulcanized turpentine rhodium and 5.1% abietic acid bismuth by platinum: rhodium: bismuth=1: 0.0001: 0.003 Ratio, adding 20% ​​by weight of polymethacrylic acid resin produced by Weihai Weixin Chemical Co., Ltd. and 5% by weight of cellulosolve and 10% by weight of terpineol and other solvents, stirring and mixing to obtain the required hybrid platinum slurry Material, the platinum slurry is evenly coated on the glazed ...

Embodiment 2

[0037] 43% sulfurized turpentine platinum and 35% sulfurized terpineol platinum produced by Handan Ceramic Research Institute were mixed in a ratio of 2:1, heated at 190°C for 15 minutes, and the decomposition product was mixed with 4.3% sulfurized turpentine rhodium, 3.8% The copper abietate is by platinum: rhodium: the ratio of copper=1: 0.0001: 0.001, adds the polymethacrylic acid resin that the Weihai Weixin Chemical Co., Ltd. of 20% by weight produces and the cellosolve of 5% by weight and 10% by weight Solvents such as terpineol, stirred and mixed evenly to obtain the required hybrid platinum slurry, and the platinum slurry was evenly coated on the glazed alumina substrate 1, and after sintering at 810°C for 30 minutes, a platinum-coated substrate was obtained. Repeat printing and sintering to obtain a thickened platinum-coated substrate; form the required pattern by photolithography and plasma etching to obtain the temperature-sensitive platinum resistor part 2, print an...

Embodiment 3

[0040] The 43% vulcanized turpentine platinum 190 ℃ of heating 15 minutes that Handan ceramics research institute produces, with decomposition product and 4.3% vulcanized turpentine rhodium, 5.1% bismuth abietate by platinum: rhodium: bismuth=1: 0.0003: 0.01 ratio Add 20% by weight of polymethacrylic acid resin produced by Weihai Weixin Chemical Co., Ltd. and 5% by weight of cellulosolve and 10% by weight of terpineol and other solvents, stir and mix to obtain the desired hybrid platinum Slurry, apply the platinum slurry evenly on the glazed alumina substrate 1, sinter at 850°C for 30 minutes to obtain a platinum-coated substrate, repeat printing and sintering to obtain a thickened platinum-coated substrate; Form the required pattern by etching to obtain the temperature-sensitive platinum resistance part 2, print and sinter the lead electrode 3, coat and sinter the glass encapsulation layer 4, laser correction to obtain the required resistance value, and cut and seal the termin...

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Abstract

The film resistor temperature sensor has insulating substrate, film resistor on the substrate, electrodes connected to the resistor and protecting layer, and the film resistor has the component of Pt or Au containing small amount of metal oxide and thickness of 0.02-2 micron. The making process includes the steps of: heating organic Pt or Au compound to obtain mixture; mixing the mixture with organic compound, resin and solvent to form mixed Pt or Au slurry; printing the mixture slurry onto substrate; sintering, etc. The present invention is used in temperature measurement, temperature control, etc. in space flight, chemical, automobile and other fields.

Description

Technical field [0001] The invention relates to a temperature sensor and a manufacturing method thereof, in particular to a thin-film resistance temperature sensor and a manufacturing method thereof. Background technique [0002] Platinum resistors have the advantages of high linearity, short thermal response time, and good stability, and are widely used in aerospace, chemical, automotive and other fields. figure 1 It is a schematic diagram of the structure of a thin-film resistance temperature sensor, figure 2 It is the structure diagram of the thin film chip resistance sensor, image 3 It is a schematic diagram of the structure of a thick film resistance temperature sensor, Figure 4 It is a structure diagram of a thick film chip resistance sensor. In the figure, 1 is an insulating substrate composed of materials such as ceramics, 2 is a temperature-sensitive resistor, 3 is a glass encapsulation layer, 4 is a lead electrode, 5 is a platinum wire lead, and 6 is a lead r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/16
Inventor 董述恂龙峰洲
Owner 董述恂
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