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Composition for forming transparent conductive film and method for preparing transparent conductive film

一种透明导电膜、组合物的技术，应用在分散在不导电无机材料中的导电材料、导电粘合剂、导电涂料等方向，能够解决不宜采用等问题

Inactive Publication Date: 2006-10-11
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] A transparent conductive film with high electromagnetic wave shielding effect can be formed by vapor deposition methods such as sputtering, but, considering the cost, this process is not suitable for mass production such as TV production

Method used

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  • Composition for forming transparent conductive film and method for preparing transparent conductive film
  • Composition for forming transparent conductive film and method for preparing transparent conductive film
  • Composition for forming transparent conductive film and method for preparing transparent conductive film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0079] Preparation method of transparent conductive film of the present invention

[0080] The preparation method of the transparent conductive film of the double-layer structure of the present invention is not particularly limited. For example, the method described below can be used.

[0081] First, a coating material containing fine metal powder and other required powders (ATO, ITO or black powder) (film-forming composition) used to form the bottom layer is coated on a transparent substrate to form a film containing fine metal powder. The coating material is prepared by dispersing fine metal powder and other randomly selected powders in a suitable solvent. The dispersion can be accomplished by conventional equipment used in the preparation of coating materials.

[0082] The coating material forming the bottom layer may or may not include a binder composed of alkoxysilane (which is at least partially hydrolyzed in advance) that can form a silica matrix after baking. In short, the...

Embodiment 1

[0202] Example 1 relates to a black powder-containing double-layer film prepared using a binder-free coating material forming a primer layer.

[0203] Coating material that forms the primer

[0204] Preparation of siloxane-free primer coating material: Add fine metal powder and black powder to the mixed solvent of isopropanol / 2-isopropoxyethanol at a weight ratio of 80 / 20, if necessary , And the types and proportions of titanium compound, black powder and titanium compound are listed in Table 1. Mix the resulting mixture in a paint mixer with zirconia pellets (diameter 0.3 mm) to disperse the two powders in the solvent . The average primary particle size of both the fine metal powder and the black powder in the coating material is up to 0.1 micrometers. The total content of these two powders in the coating material is 0.7-3.2%, and the viscosity of the coating material is 1.0-1.6 cps.

[0205] The conformity of the titanium compounds used in Table 1 has the following meanings:

[...

Embodiment 2

[0228] Example 2 relates to the preparation of a double-layer film using a binder-containing undercoat layer-forming coating material, wherein the underlayer conductive coating contains black powder.

[0229] Coating material that forms the primer

[0230] The details of this example are the same as those in Example 1, except that tetraethoxysilane (ethyl silicate) is added as a binder, and the added amount is 10 parts by weight relative to 10 parts by weight of fine metal powder and black powder. Parts (converted to silica), and a small amount of hydrochloric acid can be added as a hydrolysis catalyst.

[0231] Coating material forming the top coat

[0232] Same as Example 1

[0233] Film forming method

[0234] The procedure is the same as that in Example 1, except that after coating the base coat-forming coating material on the substrate with the aid of a spin coater, the coated substrate is heated at 50° C. for 5 minutes in the open air. The baking of the undercoat layer is co...

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Abstract

The invention discloses a composition for forming a transparent conductive film, wherein the composition includes a dispersion solution prepared by dispersing fine metal powder particles with an average primary particle size of 5-50 nanometers in a solvent containing a dispersant. into; the fine metal powder forms secondary particles, the particle size distribution of the secondary particles is 10% cumulative particle size up to 60 nanometers, 50% cumulative particle size is 50 ~ 150 nanometers and 90% cumulative particle size is 80 ~500 nm. ∴

Description

[0001] This application is a divisional application of the Chinese invention patent application with the application number 98117535.X entitled "Transparent conductive film and composition for preparing the transparent conductive film" filed on June 17, 1998. Technical field [0002] The present invention relates to a transparent conductive film with low reflectivity and low resistance. The film is a two-layer structure composed of a bottom layer containing fine metal powder and an upper coating layer based on silica, and also relates to the preparation of the transparent conductive film The composition is suitable for preparing the underlying film. The transparent conductive film of the present invention is suitable for imparting various functions to transparent substrates such as cathode ray tubes (CRT) and image display parts of various display units, such as charging prevention, electromagnetic wave shielding, and anti-glare properties (prevention of interference reflection). ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/00H01B1/20H01B5/14C09D5/24C09J9/02C03C17/34H01J9/20B05D1/02H01B1/22
CPCH01B1/22Y10T428/2991Y10T428/2995C09D7/61C09D7/63B05D1/02B05D3/0254B05D5/12C08K3/08C08K5/05C08K5/06C08K5/5415C09D5/24
Inventor 林年治冈友子西原明
Owner MITSUBISHI MATERIALS CORP
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