Prepn of lateral hydroxyl group containing polyimide/SiO2 hybrid film

Abstract

The preparation process of lateral hydroxyl group containing polyimide / SiO2 hybrid film includes dissolving polyamido acid containing lateral hydroxyl group or polyimide in 1-1400 portions in solvent to compound 5-15 % concentration solution, adding silane coupling agent containing epoxy radical in 0-250 portions for reaction at 120-150 deg.c in the presence of catalyst in 0.1-10 portions of 2-4 hr; cooling to room temperature, adding n-silicate ester in 1-1000 portions through stirring for 6-24 hr, flow casting to form film, and processing at 0.1 atm negative pressure and 60 deg.c for 12 hr, and 160 deg.C for 2 hr, at 200 deg.c for 2 hr, at 260 deg.c for 1 hr and at 300 deg.c for 0.5 hr to obtain the lateral hydroxyl group containing polyimide / SiO2 hybrid film.

Description

1. Technical field [0001] The invention relates to a method for preparing a polyimide / silicon dioxide hybrid film containing hydroxyl side groups, and belongs to the field of synthesis and preparation of organic-inorganic hybrid materials. 2. Background technology [0002] In recent years, with the wide application of large-scale integrated circuits and ultra-large-scale integrated circuits, electronic and electrical products are developing towards miniaturization, integration, high power and high reliability, and higher requirements are placed on the performance of polyimide. In addition to the characteristics of high temperature resistance, small dielectric constant, good electrical insulation, and good film-forming properties, materials are also required to have low thermal expansion, low water absorption, low polarization, high strength, high modulus, and chemical resistance. Good performance. The overall performance of ordinary polyimide is difficult to meet the above ...

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Problems solved by technology

[0004] Previous research results have shown that when the content of silicon dioxide in ordinary polyimide / silica hybrid materials is greater than 8%, the hybrid film is no longer transparent due to phase separation, and the size of the inorganic phase reaches several microns; The particle size of the silica phase increases further with the increase of the content of inorganic components, and there is a tendency to agglomerate with each other, and obvious phase separation occurs, which further reduces the transparency and mechanical properties of the hybrid material.