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Microconductive powder suitable for preparing anisotropic conductive rubber composition

An anisotropic conductive adhesive and conductive powder technology, applied in the direction of conductive adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of thin resin layer damage, easy failure, reliability, etc. , to achieve the effect of high material utilization rate, high reliability, and thin line reliability

Inactive Publication Date: 2004-01-28
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reliability of this dry mixing method depends on the particle size distribution of the fine resin used; moreover, the thin resin layer is easily damaged during the mixing process with the adhesive
Therefore, the planar direction that this patent intends to achieve is not easy to short circuit, and the purpose of the metal coating particles to be uniformly dispersed in the adhesive is likely to fail.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Using a 2 liter, 3-port reactor, add 800g of ethanol, 25g of 3-glycidyloxypropyl trimethoxysilane (3-glycidoxypropyl trimethoxysilane) (code name Z-6040, U.S. Dow Corning Co.), 30g of fluorine-containing Alkoxysilane ((H 5 C 2 O) 3 SiCH 2 (CF 2 O) m CH 2 Si(OC 2 h 5 ) 3 ) (Code FLUORO GT S10 TM , weight average molecular weight (Mw): 1750~1950), 5g 1,8-diazabicyclo(5,4,0)-undecene-7 octanoate [1,8-diazabicyclo(5,4,0) -undecene-7 (DBU) octanoic acid salt] (code name U-CAT SA102, Japan San Apro Co.) Stir and mix, add 1000g nickel-plated and gold-plated coated plastic powder (average particle size: 5 microns), 60 ° C reaction Stir for 1 hour, then add 50g carboxyl terminatedpolybutadiene-acrylonitrile copolymer (code name CTBN 1300×8, BF Goodrich Co., U.S.A.), 0.5g triethylenediamine (triethylene diamine), 50g N-methyl-2-pyrrolidone (N-methyl-2-pyrrolidone; NMP), stirred at 80°C for 2 hours, filtered, and dried at 100°C. (powder 1)

Embodiment 2

[0040] Using a 2-liter, 3-port reactor, add 1000 g of ethanol, 10 g of aminoethylaminopropyl trimethoxysilane (code name Z-6020, U.S. Dow Corning Co.), 20 g of fluorine-containing alkoxy Silane (FLUORO GTS10 TM ), 5g of DBU octanoate (U-CAT SAl02) were stirred and mixed, and 1000g of silver powder (average particle size: 3.5μm) was added, and stirred at 60°C for 1 hour (Part 1). In addition, use a 0.5 liter, 3-port reactor, add 15g Z-6020, 25g bisphenol-A epoxy resin (Bisphenol A epoxy) (code name 828, British Shell Co.), 0.5g BF 3 - Monoethylamine [BF 3 -monoethylamine, referred to as BF 3 -MEA], 50 g isopropanol (IPA), react at 80° C. and stir for 2 hours (Part 2). Add part 2 to part 1, react and stir at 80°C for 1 hour, filter, and dry at 100°C. (powder 2)

Embodiment 3

[0042] Use 2 liters, 3 mouth reactors, add 800g ethanol, 40g methacryloxypropyl trimethoxysilane (methacryloxypropyl trimethoxysilane) (code name Z-6030, U.S. Dow Corning Co.), 40g fluorine-containing alkoxy Silane (FLUORO GTS10 TM ), 8g of DBU octanoate (U-CAT SA102) were stirred and mixed, and 1000g of nickel powder (average particle size: 5 microns) was added, and stirred at 60°C for 2 hours. Add 30g methyl acrylate, 0.5g 2,2'-azobis-isobutyronitrile (2,2'-azobis-isobutyronitrile, AIBN) (Showa Chemical Co., Japan), 300g NMP, react at 100°C for 1 hour, filter, Dry at 120°C. (Powder 3) Example 4. Preparation of Anisotropic Conductive Film (ACF-1)

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Abstract

The invented microconductive powder applicable to preparation of heterodirectionality conductive adhesive composite is mainly formed from metal conductive particles and insulating organic covering film formed on the surface of said particles, said metal conducting particles have diameter with 1-20 micrometers, and said insulating organic covering film has the thickness with 50-400 nm, and has thehot-pressing fluidity. Said insulating organic covering film is prepared by using silane containing active functional group, silane containing fluorine and a functional group compound which can be reacted with said active functional group or resin.

Description

technical field [0001] The invention relates to an anisotropic conductive adhesive composition, in particular to a micro-conductive powder suitable for preparing the anisotropic conductive adhesive composition. Background technique [0002] With the development of high-density and high-performance ICs, semiconductor packaging technology is also moving towards high-density and thinning. Therefore, the requirements for the performance and reliability of packaging materials are also higher. Anisotropic conductive adhesive composition (anisotropic conductive adhesive composition) has the process characteristics of easy processing, high output and high yield. Therefore, in addition to the traditional packaging application, using an anisotropic conductive adhesive composition to simultaneously form the IC interlayer interconnection (interconnection) and hermetic adhesion packaging has become one of the more important options. The anisotropic conductive adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J11/04
Inventor 李巡天黄淑祯陈凯琪
Owner IND TECH RES INST
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