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Structure and making method of thin film transistor

A technology of thin-film transistors and manufacturing methods, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., and can solve the problems of slow electron movement and affecting the performance of thin-film transistors, etc.

Active Publication Date: 2005-01-05
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The silicon structure formed by this technology is close to amorphous silicon at the bottom, especially the interface adjacent to the gate dielectric layer, so the electron movement speed in the channel region is relatively slow, which in turn affects the performance of the thin film transistor.

Method used

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  • Structure and making method of thin film transistor
  • Structure and making method of thin film transistor
  • Structure and making method of thin film transistor

Examples

Experimental program
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Embodiment

[0028] First, if Figure 2A As shown, a gate layer is formed on a substrate 200 by a deposition method such as sputtering, the substrate 200 is preferably a glass substrate, and the gate layer is preferably a metal layer, which can be made of tantalum (Ta) , Tungsten (W), Molybdenum (Mo), Titanium (Ti), Chromium (Cr), Aluminum (Al) or their alloys. Afterwards, the gate layer is patterned by a general photolithography method to form a gate 202 on the substrate 200 .

[0029] Next, if Figure 2B As shown, with a deposition method, such as chemical vapor deposition (chemical vapor deposition), a gate dielectric layer 204 is formed to cover the gate 202 and the substrate 200, and the gate dielectric layer 204 is preferably composed of the following molecules Groups: oxides of tantalum, oxides of tungsten, oxides of molybdenum, oxides of titanium, oxides of chromium, oxides of aluminum, oxides of silicon, nitrides of silicon, oxynitrides of silicon, and combinations thereof .

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PUM

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Abstract

The invention discloses a structure of a film transistor and a manufacturing method. The method includes at providing a base board, a grating electrode is formed on the base board, and a grating electrode dielectric layer covers the grating electrode and the base board; the, carries on ion injection step to the grating electrode dielectric layer; and forms a semi-conductor on the grating electrode dielectric layer after the injection.

Description

technical field [0001] The present invention relates to a thin-film transistor (thin-film transistor; TFT) structure and manufacturing method, in particular to a thin-film transistor structure and manufacturing method whose active region is a microcrystalline structure (microcrystalline). Background technique [0002] Thin-film transistors are active elements commonly used in liquid crystal displays. By using thin-film transistors, the semiconductor layer of the thin-film transistors becomes a low-resistance state (ON state) during the image data writing period (address period). Transfer and write the image data into a capacitor to change the angle of the liquid crystal; and during the sustain period (sustain period), the semiconductor layer can be made into a high resistance state (OFF state), and the stored on the capacitor Image data remains constant. [0003] Common thin film transistor structures used in thin film transistor flat panel displays such as figure 1 As sho...

Claims

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Application Information

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IPC IPC(8): H01L21/28H01L21/336H01L29/786
Inventor 甘丰源林汉涂
Owner AU OPTRONICS CORP
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